• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.19 no.3
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• pp.180-190
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• 2014

It has been customary to exclude top 10-20% of velocity profiles in the Acoustic Doppler Current Profiler (ADCP) measurement due to side lobe effects at the boundary. To better understand the mixing in the Yeongsan estuary, the freshwater advection speed (FAS) was recovered from highly contaminated ADCP data near the surface. The velocity profiles were measured by using ADCP at two stations in the Yeongsan estuary during August 2011: one was located in front of the Yeongsan estuarine dam and the other was deployed near Goha Island. The FAS was recovered from the ADCP data set by applying rigorous post-processing methods and compared with the sediment advection speed (SAS). The SAS was determined by the peak time difference of suspended sediment concentration between two stations in the channel, divided by the distance of two stations. The FAS and the SAS showed very similar value when the freshwater discharge was greater than $2.0{\times}10^7$ ton and the SAS was a bit greater when the freshwater discharge was smaller. Since the FAS was on average about 0.8 m/s greater than the velocity at 0.8 of water depth from the bottom, the net discharge, estimated with recovered FAS and integrated over water depth and tidal cycle, was directed seaward during the high discharge contrary to the onshore direction of the net discharge estimated with 0.8 of water depth from the bottom. Moreover, the velocity shear and Richardson number changed when the FAS was used. Thus, the importance of the true FAS is appreciated in the investigation of the surface layer stability. If currents, temperature and salinity were observed for longer time in the future, it could be possible to more accurately understand the formation and decay of stratification as well as the suspended sediment transport processes.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.