• Clean Technology
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• v.21 no.1
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• pp.76-82
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• 2015

Volatile organic compounds (VOC) free adhesives have been interested by many scientists and engineers due to environmental regulations and the safety of industrial workers. In this work, a series of composites composed with bisphenol A epoxy resin used as solvent, dicyandiamide, and promoter were prepared to investigate the most appropriate molar ratio for steel-steel adhesion. The cured test specimen of each composite were measured with universal testing machine (UTM) to figure out mechanical properties such as tensile strength, Young’s modulus, and elongation. Furthermore, the lap shear strength of the specimen was tested with UTM while impact resistance was measured with Izod impact tester. The composite whose molar ratio of epoxy resin to curing agent is 1 : 0.9 (sample 3), showed better tensile strength, coefficient of elastic modulus, elongation, and impact strength than other composites did. The highest tanδ from dynamic mechanical analysis (DMA) was observed from sample 2 (epoxy resin: dicy = 1 : 0.7) while sample 3 showed slightly lower tanδ than that of 2. The morphology of the fracture surface of the cured composites from SEM showed that the number of subtle lines on the surface caused by impact increase as the contents of amine curing agent accrete. Furthermore, the viscosity change of sample 5 (epoxy resin: dicy = 1 : 1.3) was observed to confirm its storage stability.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.