• Korean Journal of Optics and Photonics
• /
• v.15 no.5
• /
• pp.405-408
• /
• 2004

In this paper, we used a split-lens speckle shear interferometer using a double speckle interferometer, which enables continuous measurement of the deformation. We made two identical specklegrams corresponding to an object. With this method we could detect the measuring limits of the deformation for various shears. This experimental results showed that the measuring limits of a split-lens speckle shear interferometer are similar to the measuring limits of a double exposure speckle interferometer.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.20 no.4
• /
• pp.39-48
• /
• 2021

In this paper, an in-plane deformation measuring system using a dual-beam shear interferometer was constructed to measure the in-plane deformation of the measuring object. The in-plane deformation of the object was quantitatively measured according to the load and surface treatment conditions of the object. We also verified the reliability of the proposed technique by simultaneously performing the technique with an electronic speckle pattern interferometry system (ESPI), which is another laser application measurement technology. Digital shearography directly measures the deformation gradient or strain components and has the advantages of being full-field, noncontact, highly sensitive, and robust. It offers a much higher measurement sensitivity compared with noncoherent measurement methods and is more robust and applicable to in-field tests.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2003.11a
• /
• pp.215-223
• /
• 2003

Viscosity index improver (VII) is one of the major additives to the modern multigrade lubricants for the viscosity stability against temperature rise. However, it causes shear thinning effects which make the film thickness lessened very delicately at high shear rate $(over\;10^5\;s^{-1})$ of general EHL contact regime. In order to exactly verify the VII's performance of viscosity stability at such high shear rate, it is necessary to make the measurement of EHL film thickness down to $\~100nm$ with fine resolution for the preliminary study of viscosity control. In this work, EHL film thickness of VII added lubricant is measured with the resolution of $\~5nm$, which will give very informative design tool for the synthesis of lubricants regarding the matter of load carrying capacity at high shear rate condition.

• Korea-Australia Rheology Journal
• /
• v.15 no.3
• /
• pp.117-124
• /
• 2003

Elastohydrodynamic lubrication (EHL) film is measured under the condition of viscosity index improver added to base oil. In-situ optical contact method using the interference principle make the measuring resolution of ~5 nm possible and enables the measuring range all over the contact area of up to ~300 $\mu\textrm{m}$ diameter. What is more important to the developed method by the author is that the measurement of EHL film thickness is possible in the range from 100 nm to 2 $\mu\textrm{m}$, which is the regime of worst contact failures in precision machinery. Viscosity index improver (VII) is one of the major additives to the modem multigrade lubricants for the viscosity stability against temperature rise. However, it causes shear thinning effects which make the film thickness lessened very delicately at high shear rate (over $10^5 s^{-1}$) of general EHL contact regime. In order to exactly verify the VIIs performance of viscosity stability at such high shear rate, it is necessary to make the measurement of EHL film thickness down to ~100 nm with fine resolution for the preliminary study of viscosity control. In this work, EHL film thickness of VII added lubricant is measured with the resolution of ~5 nm, which will give very informative design tool for the synthesis of lubricants regarding the matter of load carrying capacity at high shear rate condition.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.20 no.1
• /
• pp.27-32
• /
• 2000

In this paper, ultrasonic wave in the thermoelastic regime was generated in a steel disk by illuminating a pulse laser (Q-switched Nd:YAG) on the surface of the sample and was detected on the other side by Michelson interferometer which was stabilized by feed back control. The experimentally detected displacement waveform of the ultrasonic wave showed good agreement with the theoretically expected one. Also it was shown that sound speeds of longitudinal and shear wave were similar to ones measured by pulse-echo method using a contact transducer. As an application of the noncontact ultrasonic measurement by using laser based ultrasonics, the sound speed in the sample was monitored while the sample was heated in a furnace, and the result showed that it decreased according to the increase of sample temperature.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.34 no.2
• /
• pp.165-170
• /
• 2014

Shear horizontal (SH) waves propagate as a type of plate wave in a thin sheet. The dispersion characteristics of SH waves can be used for signal analysis. Therefore, SH-waves are useful for monitoring the structural health of a thin-sheet-structure. An electromagnetic acoustic transducer (EMAT), which is a non-contact ultrasonic transducer, can generate SH-waves easily by varying the shape and array of magnets and coils. Therefore, an EMAT can be applied to an automated ultrasonic testing system for structural health monitoring. When used as a sensor, however, the EMAT has a weakness in that electromagnetic interference (EMI) noise can occur easily in the automated system because of motors and electric devices. Alternatively, a fiber optic sensor works well in the same environment with EMI noise because it uses a light signal instead of an electric signal. In this paper, a fiber Fabry-P$\acute{e}$rot interferometer (FFPI) was proposed as a sensor to receive the SH-waves generated by an EMAT. A simple test was performed to verify the performance of the FFPI sensor. It is thus shown that the FFPI can receive SH-wave signals clearly.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.28 no.9
• /
• pp.1408-1414
• /
• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.