• Journal of the Korean Wood Science and Technology
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• v.45 no.5
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• pp.580-587
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• 2017

Woodfiber insulation board can be considered as a one of the key material for low energy consumption, comfortable and safety construction of residential space because of its eco-friendly and high thermal insulation performance. This study was carried out to investigate the formaldehyde (HCHO) total volatile organic compounds (TVOC) emission properties and combustion shapes by flame test of low density fiberboards (LDFs) prepared with different adhesives. HCHO TVOC emission and combustion properties of LDFs prepared by melamine urea formaldehyde (MUF), phenol formaldehyde (PF), emulsified methylene diphenyl diisocyanate (eMDI) and latex resin adhesives were measured by desiccator method, 20 L chamber method, and flame test, respectively. As results, LDFs manufactured by MUF, eMDI and latex resin adhesives satisfied the Super $E_0$ grade of HCHO emission performance except PF resin. Furthermore, TVOC emission of all LDFs were satisfied the Korean indoor air quality standard (below $400{\mu}g/m^2{\cdot}h$). Especially, LDF with eMDI resin adhesive showed the lowest HCHO and TVOC emissivity, that $0.14mg/{\ell}$, $12{\mu}g/m^2{\cdot}h$, respectively. However, eMDI emitted the small amount ($3{\mu}g/m^2{\cdot}h$) of toluene in VOC components. In the flame test, LDF with MUF resin adhesives showed the most favorable shape after flame test compare to LDFs prepared other adhesives. Based on HCHO and TVOC emission, and combustion shapes, MUF resin adhesive may be recommended to prepare LDF for insulation purpose.