• Resources Recycling
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• v.12 no.4
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• pp.20-29
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• 2003

In order to efficiently recycle the waste solution resulting from shadow mask processing, nano-sized Ni-ferrite powder was fab-ricated through spray pyrolysis process. The average particle size of the powder was below 100nm. In this study, the effects of the reaction temperature. the concentration of raw material solution and the injection speed of solution on the properties of powder were respectively investigated. As the reaction temperature increased from $800^{\circ}C$ to $1100^{\circ}C$, average particle size of the powder significantly Increased and power structure became more solid, whereat its specific surface area was greatly reduced. Formation rate and crystallization of($NiFe_2$$O_4$) phale increased along with the temperature rise. As the concentrations of iron and nickel components in wastere solution increased, particle size of the powder became larger, particle size distribution became more irregular, and specific surface area was reduced. Formation rate and crystallization of $NiFe_2$$O_4$ phase increased significantly along with the increase of the concentration of solution. As the inlet speed of solution increased, particle size of the powder became larger, particle size distribution became wider, specific surface area was reduced and powder structure became less solid. As the inlet speed of solution decreased, formation rate and crystallization of $NiFe_2$$O_4$ phase significantly increased.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.1
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• pp.18-26
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• 2016

The semiconductor industry is one of the key industries of Korea, which has continued growing at a steady annual growth rate. Important technology for the semiconductor industry is high integration of devices. This is to increase the memory capacity for unit area, of which key is photolithography. The photolithography refers to a technique for printing the shadow of light lit on the mask surface on to wafer, which is the most important process in a semiconductor manufacturing process. In this study, the width and step-height of wafers patterned through this process were measured to ensure uniformity. The widths and inter-plate heights of the specimens patterned using photolithography were measured using transmissive digital holography. A transmissive digital holographic interferometer was configured, and nine arbitrary points were set on the specimens as measured points. The measurement of each point was compared with the measurements performed using a commercial device called scanning electron microscope (SEM) and Alpha Step. Transmission digital holography requires a short measurement time, which is an advantage compared to other techniques. Furthermore, it uses magnification lenses, allowing the flexibility of changing between high and low magnifications. The test results confirmed that transmissive digital holography is a useful technique for measuring patterns printed using photolithography.