• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.223-227
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• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.

• Journal of Sensor Science and Technology
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• v.19 no.2
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• pp.112-117
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• 2010

A high-throughput sorting (HTS) system has been designed to separate target particles using a negative dielectrophoretic (n-DEP) force. The system consists of a meso-sized channel and a cantilever-type electrode(CE) array designed to separate a large number of target particles by discerning subtle difference of weight and dielectric material property of the particles. Using the polystyrene beads with various sizes of 10, 25 and $50{\mu}m$, the developed system exhibits high-throughput sorting of about 200 beads/sec and more than 80 % of separation efficiency.

• Laser Solutions
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• v.15 no.2
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• pp.11-14
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• 2012

In this paper, we have made a proposal concerning the beam shaping mask(BSM) using random-array slits to control intensity distribution profile of laser beam and demonstrated its proprieties experimentally. When a lot of slits are set out irregularly, diffraction patterns of light does not appear but granularity patterns as a bundle of fibers appear. Intensity distribution profile is controlled by densities distribution of circular slits arrayed randomly because the number of slits and its area means amount of light energy through BSM. Namely as the number of slits in high intensity area is increased and that in low intensity area decreased, amount of light energy is same over all local parts. So gaussian intensity distribution could be changed to flat-top.

• Journal of Sensor Science and Technology
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• v.27 no.3
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• pp.160-164
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• 2018

In this paper, a wide dynamic range complementary metal-oxide-semiconductor (CMOS) image sensor with the adjustable sensitivity by using cascode metal-oxide-semiconductor field-effect transistor (MOSFET) and inverter is proposed. The characteristics of the CMOS image sensor were analyzed through experimental results. The proposed active pixel sensor consists of eight transistors operated under various light intensity conditions. The cascode MOSFET is operated as the constant current source. The current generated from the cascode MOSFET varies with the light intensity. The proposed CMOS image sensor has wide dynamic range under the high illumination owing to logarithmic response to the light intensity. In the proposed active pixel sensor, a CMOS inverter is added. The role of the CMOS inverter is to determine either the conventional mode or the wide dynamic range mode. The cascode MOSFET let the current flow the current if the CMOS inverter is turned on. The number of pixels is $140(H){\times}180(V)$ and the CMOS image sensor architecture is composed of a pixel array, multiplexer (MUX), shift registers, and biasing circuits. The sensor was fabricated using $0.35{\mu}m$ 2-poly 4-metal CMOS standard process.

• Journal of Sensor Science and Technology
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• v.27 no.6
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• pp.362-367
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• 2018

A complementary metal oxide semiconductor (CMOS) binary image sensor is proposed for low-power and low-noise operation. The proposed binary image sensor has the advantages of reduced power consumption and fixed pattern noise (FPN). A gate/body-tied (GBT) p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET)-type photodetector is used as the proposed CMOS binary image sensor. The GBT PMOSFET-type photodetector has a floating gate that amplifies the photocurrent generated by incident light. Therefore, the sensitivity of the GBT PMOSFET-type photodetector is higher than that of other photodetectors. The proposed CMOS binary image sensor consists of a pixel array with $394(H){\times}250(V)$ pixels, scanners, bias circuits, and column parallel readout circuits for binary image processing. The proposed CMOS binary image sensor was analyzed by simulation. Using the dynamic comparator, a power consumption reduction of approximately 99.7% was achieved, and this performance was verified by the simulation by comparing the results with those of a two-stage comparator. Also, it was confirmed using simulation that the FPN of the proposed CMOS binary image sensor was successfully reduced by use of the double sampling process.

• Journal of Sensor Science and Technology
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• v.21 no.3
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• pp.186-191
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• 2012

In this paper, we present a pH measurement method that uses a microcantilever-array-based biosensor system. It is composed of microcantilever array, liquid cell, micro syringe pump, laser diode array, position sensitive detector, data acquisition device, and data processing software. Four microcantilevers are functionalized with pH-sensitive MHA(mercaptohexadecanoic acid) as a probe, while three microcantilevers are functionalized with HDT(hexadecane thiol) as reference. We prepare PBS(phosphate buffered saline) solutions of different pH and inject them into the liquid cell with a predefined volumetric speed at regular time intervals. The functionalized mircocantilevers in the liquid cell deflect as a self-assembled monolayer on the microcantilever binds with probe molecules in the solution. The difference in deflection between the MHA-covered probe microcantilever and the HDT-covered reference microcantilever was used to compensate for thermal drift. The deflection difference clearly increases with increasing pH in the solution. It was shown that when the pH values of the PBS solutions are high, there were large variations in the deflection of microcantilevers, whereas there were small variations for low pH value. The experimental results show that the microcantilever array functionalized with MHA and HDT can detect pH value with good repeatability.

• Journal of Sensor Science and Technology
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• v.26 no.2
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• pp.91-95
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• 2017

Recently, infrared (IR) spectrometers have been required in various fields such as environment, safety, mobile, automotive, and military. This IR dispersive sensor detection method of substances is widely used. In this study, we fabricated a silicon (Si) prism-based near infrared (NIR) spectrometer utilizing micro electro mechanical system (MEMS) technology. Si prism-based NIR spectrometer utilizing MEMS technology consists of upper, middle, and lower substrates. The upper substrate passes through the incident IR ray selectively. The middle substrate, acting as a prism, disperses and separates the incident IR beam. The lower substrate has an amorphous Si (a-Si)-based bolometer array to detect the IR spectrum. The fabricated Si prism-based NIR spectrometer utilizing MEMS technology has the advantage of a simple structure, easy fabrication steps, and a wide NIR region operating range.

• Journal of Sensor Science and Technology
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• v.15 no.5
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• pp.347-351
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• 2006

A novel surface plasmon resonance sensor, which can measure 2-dimensional array of immobilized ligands without using imaging devices such as CCD, has been proposed. Regular surface plasmon resonance can be directly used due to the insertion of additional layers with different thickness, on which each ligands are immobilized. Surface plasmon resonance signals are separated depending on the thickness of additional layers. The possibility of multi-sensing capability of the proposed surface plasmon resonance sensor has been verified by the modeling that is based on Fresnel reflection model.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1979-1981
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• 2002

새로운 방식의 일체형 flexible sensor module을 제작하였다. MEMS공정을 이용하여 제작된이 센서 모듈은 배선기판은 물론 strain sensor 역시 임의의 곡면에 실장을 위해 자유로운 굽힘이 가능하도록 제작되었다. 실리콘웨이퍼에 구현된 piezoresistor 스트레인 센서는 release-etch 방법을 통해 웨이퍼로부터 분리되어, 폴리이미드를 기판으로 하는 Flexible Sensor Array Module로 완성되었다. 소자와 기판을 따로 제작한 후 조립하는 기존의 방식에 비해, 웨이퍼 위에서 flexible 기판을 형성하여 수율이 높고 사진공정의 정밀도를 그대로 보전한 기판과 센서 어레이의 패키징이 가능하였으며, 칩을 기판에 실장하기 위한 정밀한 조립공정도 불필요하였다. 폴리이미드 기판은 전기도금을 통해 회로를 구성하여 1단계 패키징 (die to chip carrier)과 2단계 패키징 (chip to substrate)을 웨이퍼 레벨에서 완성하였다. 마지막으로 불산 용액을 통해 희생층을 제거함으로서 웨이퍼로 부터 센서어레이 모듈을 분리 하였다.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.184-188
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• 2006

This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.