• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.2
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• pp.147-152
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• 1999

Semiconductor piezoresistive type vibration sensor was fabricated by using semiconductor process and micromachining technology. To measure the micro electromagnetic force between coil and magnet, fabricated vibration sensor was used. Toapply micro electromagnetic force produced from the micro exciter, small-sized NdFeB permanent magnet was attached on the mass of the fabricated vibration sensor. The measured electromagnetic force are about 5~180dyne when the applied sinusoidal current of 1KHz in the range of 1.5~8mA. The measurement of micro electromagnetic forcewas performed by changing the distance between coil and magnet. Output characteristics of micro electromagnetic force according to the applied coil current were linear. Furthermore, output results were used to get the transfer constant that is important to decide the efficiency and the performance of the coil and magnet.

• Journal of Sensor Science and Technology
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• v.30 no.5
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• pp.295-299
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• 2021

In this study, we present a complementary metal-oxide-semiconductor (CMOS) binary image sensor. It can shoot an object rotating at a high-speed by using a gate/body-tied (GBT) p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET)-type photodetector. The GBT PMOSFET-type photodetector amplifies the photocurrent generated by light. Therefore, it is more sensitive than a standard N+/P-substrate photodetector. A binary operation is installed in a GBT PMOSFET-type photodetector with high-sensitivity characteristics, and the high-speed operation is verified by the output image. The binary operations circuit comprise a comparator and memory of 1- bit. Thus, the binary CMOS image sensor does not require an additional analog-to-digital converter. The binary CMOS image sensor is manufactured using a standard CMOS process, and its high- speed operation is verified experimentally.

• Design & Manufacturing
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• v.16 no.1
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• pp.15-20
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• 2022

This paper is about elimination the situation in which gas sensor data becomes inaccurate due to temperature control when a semiconductor gas sensor is driven. Recently, interest in semiconductor gas sensors is high because semiconductor sensors can be driven with small and low power. Although semiconductor-type gas sensors have various advantages, there is a problem that they must operate at high temperatures. First temperature control was configured to adjust the temperature value of the heater mounted on the gas sensor. At that time, in controlling the heater temperature, gas sensor data are fluctuated despite supplying same gas concentration according to the temperature controlled. To resolve this problem, gas and temperature are extracted as a data. And then, a relation function is constructed between gas and temperature data. At this time, it is included low pass filter to get the stable data. In this paper, we can find optimal gain and parameters between gas and temperature data by using genetic algorithm.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.107-111
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• 2022

In this paper, a plastic film type submersion sensor capable of measuring submersion speed was developed. This submersion sensor is designed as a capacitive type, and it is a sensor that outputs the change in capacitance between the electrode of the submersion sensor and the grounded body as a voltage through a C-V(capacitance-voltage) converter. We developed an submersion sensor in which two electrodes of different lengths are connected in parallel to measure the submersion speed accurately by minimizing the influence of noise such as contamination. When both electrodes of the submersion sensor are exposed to water, the rate of change of water level suddenly increases, so the submersion speed is measured by measuring the time to this point. Since the difference in length between the two electrodes of the submersion sensor does not change in any case, it is possible to accurately measure the submersion speed.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.124-128
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• 2019

In this paper, a high temperature plastic film type water level sensor was developed. The high temperature film type water level sensor was manufactured by attaching a copper film to a polyimide film which can be used for a long time at 250℃, by laminating process and patterning the electrode by etching process. For the performance evaluation of the developed film type water level sensor, the temperature dependence of the capacitance was measured, and the deformation was examined after standing for 8 hours in 150℃ air. The developed film type water level sensor can be used at up to 150℃, and can be applied to electric ports and steam devices.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.4
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• pp.388-396
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• 2012

In this paper, a $320{\times}240$ pixel, 80 frame/s CMOS image sensor with a low power dual correlated double sampling (CDS) scheme is presented. A novel 8-bit hold-and-go counter in each column is proposed to obtain 10-bit resolution. Furthermore, dual CDS and a configurable counter scheme are also discussed to realize efficient power reduction. With these techniques, the digital counter consumes at least 43% and at most 61% less power compared with the column-counters type, and the frame rate is approximately 40% faster than the double memory type due to a partial pipeline structure without additional memories. The prototype sensor was fabricated in a Samsung $0.13{\mu}m$ 1P4M CMOS process and used a 4T APS with a pixel pitch of $2.25{\mu}m$. The measured column fixed pattern noise (FPN) is 0.10 LSB.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.4
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• pp.1376-1384
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• 1996

Measuring the velocity of fluid flow, semiconductor flow sensors are widely used in the various fields of engineering and science such as the semiconductor manufacturing processes and electronic control engines for automobiles. In the near future, this type of sensors will replace present hot wire type sensors or other type flow sensor due to its low price, easy handling and small size. To develop the advanced semiconductor flow sensor, it is necessary to obtain characteristics of the flow and the heat transfer around the sensor in advance. In the present study, the theoretical analysis including mathematical modeling and numerical calculation to predict the characteristics of heat transfer and flow field around the sensor was carried out. The main parameters for optimum design of the flow sensor are the free stream velocity, the heat generation rate of silicon arm and the distance between arms. Effects of these parameters on flow and heat transfer around the sensor and the temperature difference between arms are examined.

• Journal of Sensor Science and Technology
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• v.30 no.2
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• pp.114-118
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• 2021

In this study, the sensitivity of an active pixel sensor (APS) was adjusted by employing a gate/body-tied (GBT) p-channel metal-oxide semiconductor field-effect transistor (PMOSFET)-type photodetector with a transfer gate. A GBT PMOSFET-type photodetector can amplify the photocurrent generated by light. Consequently, APSs that incorporate GBT PMOSFET-type photodetectors are more sensitive than those APSs that are based on p-n junctions. In this study, a transfer gate was added to the conventional GBT PMOSFET-type photodetector. Such a photodetector can adjust the sensitivity of the APS by controlling the amount of charge transmitted from the drain to the floating diffusion node according to the voltage of the transfer gate. The results obtained from conducted simulations and measurements corroborate that, the sensitivity of an APS, which incorporates a GBT PMOSFET-type photodetector with a built-in transfer gate, can be adjusted according to the voltage of the transfer gate. Furthermore, the chip was fabricated by employing the standard 0.35 ㎛ complementary metal-oxide semiconductor (CMOS) technology, and the variable sensitivity of the APS was thereby experimentally verified.

• Journal of Sensor Science and Technology
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• v.27 no.6
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• pp.362-367
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• 2018

A complementary metal oxide semiconductor (CMOS) binary image sensor is proposed for low-power and low-noise operation. The proposed binary image sensor has the advantages of reduced power consumption and fixed pattern noise (FPN). A gate/body-tied (GBT) p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET)-type photodetector is used as the proposed CMOS binary image sensor. The GBT PMOSFET-type photodetector has a floating gate that amplifies the photocurrent generated by incident light. Therefore, the sensitivity of the GBT PMOSFET-type photodetector is higher than that of other photodetectors. The proposed CMOS binary image sensor consists of a pixel array with $394(H){\times}250(V)$ pixels, scanners, bias circuits, and column parallel readout circuits for binary image processing. The proposed CMOS binary image sensor was analyzed by simulation. Using the dynamic comparator, a power consumption reduction of approximately 99.7% was achieved, and this performance was verified by the simulation by comparing the results with those of a two-stage comparator. Also, it was confirmed using simulation that the FPN of the proposed CMOS binary image sensor was successfully reduced by use of the double sampling process.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.63-67
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• 2017

In this study, We developed a simple and low cost capacitive pressure mapping sensor and microcontroller-base lock-in amplifier array. We developed capacitive type pressure mapping sensor by forming the electrode and adhesives on plastic films using only the printing process, and the finishing the process by bonding the two films. Lock-in amplifier array was based on a general purpose microcontroller and had only a charge amplifier as analog circuits. In this study, a $10{\times}10$ capacitive type pressure mapping sensor and lock-in amplifier array was fabricated and its characteristics were analyzed.