• KSII Transactions on Internet and Information Systems (TIIS)
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• v.17 no.2
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• pp.663-677
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• 2023

As the paradigm of future vehicles changes, the interest in automotive semiconductor, which plays a key role in realizing this, is increasing. Automotive semiconductors are the technology with very high entry barriers that require a lot of effort and time because it must secure technology readiness level and also consider safety and reliability. In this technology field, it is very important to develop new businesses and create opportunities through technology trend analysis. However, systematic analysis and application of automotive semiconductor technology trends are currently lacking. In this paper, U.S. registered patent documents related to automotive semiconductor were collected and investigated based on the patent's IPC. The main technology of automotive semiconductor was analyzed through topic modeling, and the technology path such as emerging technology was investigated through cosine similarity. We identified that those emerging technologies such as driving control for vehicle and AI service appeared. We observed that as time passed, both convergence and independence of automotive semiconductor technology proceeded simultaneously.

• Journal of the Semiconductor & Display Technology
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• v.23 no.1
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• pp.52-55
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• 2024

In this paper, a state change study was conducted through Frequency Domain Reflectometry (FDR) technology for the process chamber of plasma equipment for semiconductor manufacturing. In the experiment, by direct connecting the network analyzer to the RF matcher input of the 300 mm plasma enhanced chemical vapor deposition (PECVD) chamber, S11 was measured in a situation where plasma was not applied, and the frequency domain reacting to the chamber state change was searched. Response factors to changes in the status, such as temperature, spacing of the heating chuck, internal pressure difference, and process gas supply state were confirmed. Through this, the frequency domain in which a change in the reflection value was detected through repeated experiments. The reliability of the measured micro-displacement was verified through reproducibility experiments.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.4
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• pp.35-46
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• 2000

Semiconductor technology includes from semiconductor materials, design, fabrication, handling of process equipments, reliability test to packaged semiconductor devices. Our departmental curriculum is organized with 2-years/6-quarters system of Ulsan College: the understanding for the fundamental of semiconductor is carried out in the first academic year and the training for the design skill on semiconductor devices will be focused in the second academic year. The main focus is reflected on the worldwide trend on the design engineering of semiconductor devices and considered for the market establishment on design engineers trained by the lab-oriented practice as well as the fundamental of semiconductor technology.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.3
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• pp.50-53
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• 2007

Improving the reliability or long-term dependability of a system requires a different approach from the previous emphasis on short-term concerns. The purpose of this paper is to present a reliability evaluation method for an oil cooler intended for high-precision machining centers. The oil cooler system in question is a cooling device that minimizes the deformation caused from the heat generated by driving devices. This system is used for machine tools and semiconductor equipment. We predicted the reliability of the system based on the failure rate database and conducted the reliability test using a test-bed to evaluate the life of the oil cooler. The results provided an indication of the reliability of the system in terms of the failure rate and the MTBF of the oil cooler system and its components, as well as a distribution of the failure mode. These results will help increase the reliability of oil cooler systems. The evaluation method can also be used to determine the reliability of other machinery products.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.11-14
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• 2022

In this work, we evaluated the Al₂O₃ film, which was deposited by atomic layer deposition, degraded by exposure to harsh environments. The Al₂O₃ films deposited by atomic layer deposition have long been used as a gas diffusion barrier that satisfies barrier requirements for device reliability. To investigate the barrier and mechanical performance of the Al₂O₃ film with increasing temperature and relative humidity, the properties of the degraded Al₂O₃ film exposed to the harsh environment were evaluated using electrical calcium test and tensile test. As a result, the water vapor transmission rate of Al₂O₃ films stored in harsh environments has fallen to a level that is difficult to utilize as a barrier film. Through water vapor transmission rate measurements, it can be seen that the water vapor transmission rate changes can be significant, and the environment-induced degradation is fatal to the Al₂O₃ thin films. In addition, the surface roughness and porosity of the degraded Al₂O₃ are significantly increased as the environment becomes severer. the degradation of elongation is caused by the stress concentration at valleys of rough surface and pores generated by the harsh environment. Becaused the harsh envronment-induced degradation convert amorphous Al₂O₃ to crystalline structure, these encapsulation properties of the Al₂O₃ film was easily degraded.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.117-118
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• 2008

High-pressure deuterium annealing process is proposed and investigated for enhanced electrical and reliability properties of 512Mb DDR2 DRAM without increase in process complexity. High pressure deuterium annealing (HPDA) introduced during post metal anneal (PMA) improves not only DRAM performance but also reliability characteristics of MOSFET. Compared with a control sample annealed in a conventional forming gas, additional annealing in a high pressure deuterium ambient at $400^{\circ}C$ for 30 min decreased G1DL current and junction leakage. The improvements can be explained by deuterium incorporation at $SiO_2$/Si substrate interface near isolation trench edge.

• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.73-77
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• 2015

This paper proposes an object tracking system according to reliability assessment of learning in mobile environments. The proposed system is based on markerless tracking, and there are four modules which are recognition, tracking, detecting and learning module. Recognition module detects and identifies an object to be matched on current frame correspond to the database using LSH through SURF, and then this module generates a standard object information that has the best reliability of learning. The standard object information is used for evaluating and learning the object that is successful tracking in tracking module. Detecting module finds out the object based on having the best possible knowledge available among the learned objects information, when the system fails to track. The experimental results show that the proposed system is able to recognize and track the reliable objects with reliability assessment of learning for the use of mobile platform.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.320-323
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• 2005

This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.35 no.4
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• pp.1-9
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• 2012

Decisions on reliability screening rules and burn-in policies are determined based on the estimated reliability. The variability in a semiconductor manufacturing process does not only causes quality problems but it also makes reliability estimation more complicated. This study investigates the nonuniformity characteristics of integrated circuit reliability according to defect density distribution within a wafer and between wafers then develops optimal burn-in policy based on the estimated reliability. New reliability estimation model based on yield information is developed using a spatial stochastic process. Spatial defect density variation is reflected in the reliability estimation, and the defect densities of each die location are considered as input variables of the burn-in optimization. Reliability screening and optimal burn-in policy subject to the burn-in cost minimization is examined, and numerical experiments are conducted.

• Proceedings of the Korean Society for Quality Management Conference
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• 2004.04a
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• pp.272-277
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• 2004

Recently reliability Improvement and certification are considered as important issues by world-wide leading and highly qualified companies in advanced countries. In Korea, from a few years ago, the policy for reliability certification newly has been driven to improve product competitiveness in part and material industry. As yet the reliability certification is local and domestic, it is necessary to develop local certification system to global certification system. Reliability certification system is composed of accreditation body, testing laboratory and reliability assurance. In this paper, we review the reliability certification system and its application in Korea and the current research trends in advanced countries. Finally we propose some suggestions for the eliability certification system to be an international standard.