• Journal of the Semiconductor & Display Technology
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• v.23 no.1
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• pp.92-96
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• 2024

The application of the technology for forming Al₂O₃ thin films using ALD(atomic layer deposition) method is rapidly increasing in the semiconductor and display fields. In order to increase the efficiency of the ALD process in a mass production line, metallic by-products generated from the ALD process chamber must be effectively collected. By collecting by-products flowing out of the chamber with a cold trap device before they go to the vacuum pump, damage to the vacuum pump can be prevented and the work room can be maintained stably, resulting in increased process flow rate. In this study, a cold trap was installed between the ALD process chamber and the dry pump to measure and analyze by-products generated during the Al₂O₃ thin film deposition process. As a result, it was confirmed that Al and O elements were discharged, and the collection forms were two types: bulk and powder. And the binding energy peaked at 73.7 ~ 74.3 eV, the binding energy of Al 2p, and 530.7 eV, the binding energy of O 1s, indicating that the binding structure was Al-O.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.24 no.4
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• pp.57-64
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• 2024

The introduction of Smart Factories has transformed manufacturing towards more objective and efficient line management. However, most companies are not effectively utilizing the vast amount of sensor data collected every second. This study aims to use this data to predict product quality and manage production processes efficiently. Due to security issues, specific sensor data could not be verified, so semiconductor process-related training data from the "SAMSUNG SDS Brightics AI" site was used. Data preprocessing, including removing missing values, outliers, scaling, and feature elimination, was crucial for optimal sensor data. Oversampling was used to balance the imbalanced training dataset. The SVM (rbf) model achieved high performance (Accuracy: 97.07%, GM: 96.61%), surpassing the MLP model implemented by "SAMSUNG SDS Brightics AI". This research can be applied to various topics, such as predicting component lifecycles and process conditions.

• Journal of the Korea Society of Computer and Information
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• v.14 no.10
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• pp.55-61
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• 2009

This paper describes a point of production(POP) system which collects and manages real-time shop floor machining information in a wafer dicing process. The system are composed of POP terminal, line controller and network. In the configuration of the system, LAN and RS485 network are used for connection with the upper management system and down stratum respectively. As a bridge between POP terminal and server, a line controller is used. The real-time information which is the base of production management are collected from information resources such as machine, product and worker. The collected information are used for the calculation of optimal cutting condition. The collection of the information includes cutting speed, spout of pure water, accumulated count of cut in process for blade and wafer defect. In order to manage machining information in wafer dicing process, production planning information is delivered to the shop floor, and production result information is collected from the shop floor, delivered to the server and used for managing production plan. From the result of the system application, production progress status, work and non-working hour analysis for each machine, and wafer defect analysis are available, and they are used for quality and productivity improvements in wafer dicing process. A case study is implemented to evaluate the performance of the system.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1500-1503
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• 1997

In this paper a multiple channel EPD controller is developed which enables us to detect endpoints simultaneously in the plasma etching process operated in multiple etching chambers and its performance characteristic are investigated. for the accurate detectiion of endpoint the developed EDP controller was able to implement endpoint detectiions by integrating the existing EPD controllers with the techiques of artificial intellignet, to enhance its performance. The performance of the developed EPD controller was carried out by repeated experiments of endpoint detection in the acrual production line of semiconductor manufacturing. It's utility for endpoint detectiion was accurately evaluated in various etching process. The control capability of multiple etching chambers enhances its application compared with the existing one, and also increases the user utility os that the efficiency of operation was improved.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.2 no.3
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• pp.191-193
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• 2002

Insulation aging diagnosis system provides early warning in regard to electrical equipment defects. Early warning is very important in that it can avoid great losses resulting from unexpected shutdown of the production line. For solving this problem, many researchers proposed a method that diagnose power plant by using partial discharge. In this paper, we design the intelligent sensor to diagnose insulation degradation state that uses a Microprocessor and Al. Proposed sensor has MCU that is used to diagnose insulation degradation and communicate with main IDD system. And we use a fuzzy model to diagnose insulation degradation.

• The Journal of the Korea Contents Association
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• v.21 no.11
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• pp.203-212
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• 2021

The high-tech industry, a highly knowledge-intensive industry based on advanced technologies such as electronics, new materials, and IT, is developing rapidly centering on the semiconductor, display, and battery fields. The market size of this industry is continuously increasing, and various challenges are coming forward due to various factors such as changes in the market, changes in demand, and the requirements of the clients. Many strategies are being implemented to advance the start-up time of factories, such as fast-track construction and basic line construction. Therefore, construction of high-tech factory is required to respond to various types of construction plans and early decision making, and an accurate and reliable method of calculating construction costs is needed. In this study the existing construction type was classified into the overall line configuration considering the total production of the factory, and a basic line configuration for quick production start-up. The correction ratio/value for each detailed construction required to calculate the construction cost of the basic line configuration type was derived. Finally, reliability and accuracy were verified by applying the correction ratio suggested in this study to a new high-tech factory construction project.

• Laser Solutions
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• v.16 no.4
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• pp.17-23
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• 2013

The research for the development of roll-to-roll printing process is actively underway on behalf of the existing semiconductor process. The roll-to-roll printing system can make the electronic devices to low-cost mass production. This study is performed for developing the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser engraving technology is used to create printable roll and the printable roll is made out of the chrome coated roll after coating copper and polymer on the surface of steel roll, ablating the polymer on the surface of roll and etching the roll. The 3 dimensional laser scanner and roll rotating systems are constructed and the system control program is developed. We have used the fiber laser of 100 W grade, the 3 dimensional laser scanner and the 3 axes moving stage system with a rotating axis. We have found the optimal conditions by performing the laser patterning experiments and can make the minimum line width of $24{\mu}m$ by using the developed 3 dimensional laser scanner system.

• Laser Solutions
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• v.15 no.4
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• pp.12-15
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• 2012

On behalf of the existing semiconductor process, the electronic devices to low-cost mass production to mass print the way, the research for development of roll-to-roll printing process is actively underway. This study was performed in about the research on the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser imprinting technology was used to create printable roll, and after coating copper on the surface of steel and thereon after coating polymer, after removing the polymer on the surface of roll, the printable roll was made. The laser system and roll feeder system were constructed and control program was developed. We has found the optimal conditions to perform laser patterning experiments using a system developed and We can make the minimum line width of 18 ${\mu}m$.

• Journal of Digital Contents Society
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• v.5 no.4
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• pp.251-256
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• 2004

The flatness of a silicon wafer concerned with ULSI chip is one of the most critical parameters ensuring high yield of wafers. That is necessary to constitute the circuit with high quality for he surface of silicon wafer, which comes to be base to make the direct circuit of the semiconductor, Flatness, therefore, is the most important factor to guarantee it wafer with high quality. The process of polishing is one of the most crucial production line among 10 processing stages to change the rough surface into the flatnees with best quality. Currently at this process, it is general for an engineer in charge to observe, judge and control the model of wafer from the monitor of measuring equipment with his/her own eyes to enhance the degree of flatness. This, however, is quite a troublesome job for someone has to check of process by one's physical experience. The purpose of this study is to approach the model of wafer with digital contents and to apply the result of the research for an algorithm which enables to control the polishing process by means of measuring the degree of flatness automatically, not by person, but by system. In addition, this paper shows that this algorithm proposed for the whole wafer flatness enables to draw an estimated algorithm which is for the thickness of sites to measure the degree of flatness for each site of wafer.

• Journal of Korean Society of Environmental Engineers
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• v.29 no.8
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• pp.909-914
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• 2007

Fluorine compounds are the essential chemicals for wet processes of semiconductor and LCD production line. Problems of conventional treatments for fluoride wastewater are their high operation costs and low fluoride removal capacity. In this study, cement paste containing various Ca-bearing hydrates such as portlandite, calcium silicate hydrate(CSH), and ettringite was investigated for fluoride removal. The objectives of this study are to assess the feasibility of using cement paste cured mixture of cement and water as an alternative agent for treatment of fluoride wastewater and to investigate fluoride removal capacity of the cement paste. The performance of cement paste was comparable to that of lime in the kinetic test. In column experiment where the effluent fluoride concentrations were below 0.5 mg/L. Then the leached calcium reached the maximum level of 800 mg/L. The nitrate reduced to the level of less than 10 mg/L. Nitrate in the wastewater was exchanged with interlayer sulfate of these cement hydrate LDHs. Phosphate concentration could be reduced to 10 mg/L by forming calcium phosphate. These results indicate that the cement paste generally has advantageous characteristics as an economical and viable substitute for lime to remove fluoride.