• 제목/요약/키워드: Semiconductor Images

검색결과 229건 처리시간 0.022초

오목거울과 반사형 편광판을 이용한 이미지 확대장치 (Image Magnifier with Concave Mirror and Reflective Polarizer)

  • 오윤식
    • 반도체디스플레이기술학회지
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    • 제14권4호
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    • pp.13-19
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    • 2015
  • In this paper, the principle of devices which can magnify images without distorting the images is described. When the device is put on a smart phones, viewers can see the magnified images. Magnified images can be few 100 times bigger than the original images. Therefore, viewers can see movie theater size images with the device put on a smart phone. Two different schemes are explained in the paper and one realization of the device is presented. The device can be used in many different application areas.

압축된 영상 복원을 위한 양자화된 CNN 기반 초해상화 기법 (Quantized CNN-based Super-Resolution Method for Compressed Image Reconstruction)

  • 김용우;이종환
    • 반도체디스플레이기술학회지
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    • 제19권4호
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    • pp.71-76
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    • 2020
  • In this paper, we propose a super-resolution method that reconstructs compressed low-resolution images into high-resolution images. We propose a CNN model with a small number of parameters, and even if quantization is applied to the proposed model, super-resolution can be implemented without deteriorating the image quality. To further improve the quality of the compressed low-resolution image, a new degradation model was proposed instead of the existing bicubic degradation model. The proposed degradation model is used only in the training process and can be applied by changing only the parameter values to the original CNN model. In the super-resolution image applying the proposed degradation model, visual artifacts caused by image compression were effectively removed. As a result, our proposed method generates higher PSNR values at compressed images and shows better visual quality, compared to conventional CNN-based SR methods.

Image Clustering using Geo-Location Awareness

  • Lee, Yong-Hwan
    • 반도체디스플레이기술학회지
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    • 제19권4호
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    • pp.135-138
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    • 2020
  • This paper suggests a method of automatic clustering to search of relevant digital photos using geo-coded information. The provided scheme labels photo images with their corresponding global positioning system coordinates and date/time at the moment of capture, and the labels are used as clustering metadata of the images when they are in the use of retrieval. Experimental results show that geo-location information can improve the accuracy of image retrieval, and the information embedded within the images are effective and precise on the image clustering.

Ball Grid Array Solder Void Inspection Using Mask R-CNN

  • Kim, Seung Cheol;Jeon, Ho Jeong;Hong, Sang Jeen
    • 반도체디스플레이기술학회지
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    • 제20권2호
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    • pp.126-130
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    • 2021
  • The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

블록 기반 클러스터링과 히스토그램 카이 제곱 거리를 이용한 반도체 결함 원인 진단 기법 (Cause Diagnosis Method of Semiconductor Defects using Block-based Clustering and Histogram x2 Distance)

  • 이영주;이정진
    • 한국멀티미디어학회논문지
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    • 제15권9호
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    • pp.1149-1155
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    • 2012
  • 본 논문에서는 반도체 산업 영상에서 반도체의 결함 원인 진단 기법을 제안한다. 제안 기법은 먼저 결함 영상에 대한 특징 데이터베이스를 구축한다. 다음으로 결함 영상과 입력 영상을 블록 단위로 영역 분할을 수행한 후 컬러 히스토그램을 계산하여 블록들 사이의 히스토그램 카이 제곱 거리를 이용한 블록 유사성을 측정한다. 다음으로 각 영상에서 탐색된 블록들에 대하여 클러스터링을 수행하여 영역을 연결된 객체 단위로 군집한다. 마지막으로 각 클러스터들의 특징을 추출하여 클러스터 간 유사성 측정으로 가장 유사성이 높은 결함 영상을 특징 DB에서 탐색하여 결함 원인 정보와 함께 제시한다. 검색 결과 유사도 상위 n개의 영상 중에서 입력 영상과 동일한 범주의 결함을 갖는 영상이 검색되는 비율을 구하여 제안 기법의 정확성을 검증하였다. n = 1, 2, 3에 대해서 결함 범주에 상관없이 검색 정확도는 모두 100%로 제안 기법은 실제 산업 응용이 가능한 정확한 검색 결과를 보여주었다.

A Novel Data Driver for Passive Matrix Organic Light-emitting Devices with High Gray Scale Images utilizing a High Uniform Current

  • Shin, Hong-Jae;Kwack, Kae-Dal;Kim, Tae-Whan
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1398-1400
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    • 2005
  • A novel data driver for passive matrix organic lightemitting devices (PM-OLEDs) with high gray scale images was designed. The proposed circuit consisted of a main current bias circuit as well as sample & hold circuits in each channel of the data driver to compensate a current offset. These results indicate that a data driver designed by using the current offset compensation technique holds promise for poten tial applications in PM-OLED displays with high gray scale images.

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Automatic Defect Detection from SEM Images of Wafers using Component Tree

  • Kim, Sunghyon;Oh, Il-seok
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권1호
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    • pp.86-93
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    • 2017
  • In this paper, we propose a novel defect detection method using component tree representations of scanning electron microscopy (SEM) images. The component tree contains rich information about the topological structure of images such as the stiffness of intensity changes, area, and volume of the lobes. This information can be used effectively in detecting suspicious defect areas. A quasi-linear algorithm is available for constructing the component tree and computing these attributes. In this paper, we modify the original component tree algorithm to be suitable for our defect detection application. First, we exclude pixels that are near the ground level during the initial stage of component tree construction. Next, we detect significant lobes based on multiple attributes and edge information. Our experiments performed with actual SEM wafer images show promising results. For a $1000{\times}1000$ image, the proposed algorithm performed the whole process in 1.36 seconds.

이산 웨이블릿 합성 영상을 이용한 철강 후판 검사의 조명 메커니즘에 관한 연구 (A Study on Illumination Mechanism of Steel Plate Inspection Using Wavelet Synthetic Images)

  • 조은덕;김경범
    • 반도체디스플레이기술학회지
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    • 제17권2호
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    • pp.26-31
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    • 2018
  • In this paper, surface defects and typical illumination mechanisms for steel plates are analyzed, and then optimum illumination mechanism is selected using discrete wavelet transform (DWT) synthetic images and discriminant measure (DM). The DWT synthetic images are generated using component images decomposed by Haar wavelet transform filter. The best synthetic image according to surface defects is determined using signal to noise ratio (SNR). The optimum illumination mechanism is selected by applying discriminant measure (DM) to the best synthetic images. The DM is applied using the tenengrad-euclidian function. The DM is evaluated as the degree of contrast using the defect boundary information. The performance of the optimum illumination mechanism is verified by quantitative data and intuitive image looks.

깊은 곡선 추정을 이용한 수중 영상 개선 (Enhancing Underwater Images through Deep Curve Estimation)

  • 무하마드 타릭 마흐무드;최영규
    • 반도체디스플레이기술학회지
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    • 제23권2호
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    • pp.23-27
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    • 2024
  • Underwater images are typically degraded due to color distortion, light absorption, scattering, and noise from artificial light sources. Restoration of these images is an essential task in many underwater applications. In this paper, we propose a two-phase deep learning-based method, Underwater Deep Curve Estimation (UWDCE), designed to effectively enhance the quality of underwater images. The first phase involves a white balancing and color correction technique to compensate for color imbalances. The second phase introduces a novel deep learning model, UWDCE, to learn the mapping between the color-corrected image and its best-fitting curve parameter maps. The model operates iteratively, applying light-enhancement curves to achieve better contrast and maintain pixel values within a normalized range. The results demonstrate the effectiveness of our method, producing higher-quality images compared to state-of-the-art methods.

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반도체 웨이퍼 ID 인식을 위한 다중템플릿형 영상분할 알고리즘 개발 (Development of a Multi-template type Image Segmentation Algorithm for the Recognition of Semiconductor Wafer ID)

  • 안인모
    • 전기학회논문지P
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    • 제55권4호
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    • pp.167-175
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    • 2006
  • This paper presents a method to segment semiconductor wafer ID on poor quality images. The method is based on multiple templates and normalized gray-level correlation (NGC) method. If the lighting condition is not so good and hence, we can not control the image quality, target image to be inspected presents poor quality ID and it is not easy to identify and then recognize the ID characters. Conventional several method to segment the interesting ID regions fails on the bad quality images. In this paper, we propose a multiple template method, which uses combinational relation of multiple templates from model templates to match several characters of the inspection images. To find out the optimal solution of multiple template model in ID regions, we introduce newly-developed snake algorithm. Experimental results using images from real FA environment are presented.