• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.106-109
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• 2008

Polyurethane has been one of the most important materials for automobile elastic parts such as bumper, head rest, instrument panel and so on since it covers very wide range of mechanical characteristics with low production costs. The process variables such as formulation of ingredients and mold temperature, mixing speed, etc. can affect the quality of produced polyurethane foams so that process conditions should be determined appropriately. In this study, foaming behaviors of semi-rigid polyurethane were investigated by conducting cup foam tests with 2 major process variables such as environmental temperature and blowing agent content.

• 소성∙가공
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• 제18권3호
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• pp.256-261
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• 2009

Polyurethane has been one of the most important materials for automobile elastic parts such as bumper, head rest, instrument panel and so on since it covers very wide range of mechanical characteristics with low production costs. The processing variables such as formulation of ingredients and mold temperature, mixing speed, etc. can affect the quality of produced polyurethane foams so that process conditions should be determined appropriately. In this study, foaming behaviors of semi-rigid polyurethane were investigated by conducting cup foam tests with two major processing variables such as environmental temperature and blowing agent content. In addition, it was verified that processing conditions of real practice can be determined effectively by considering foaming characteristics obtained by the cup foam tests.

• Composites Research
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• 제34권1호
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• pp.16-22
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• 2021

폴리우레탄폼(PUF)은 연질, 반경질, 경질 형태로 제작이 가능하여 산업적으로 다양한 분야에서 활용되고 있다. 그 중에서도 경질 폴리우레탄폼은 우수한 기계적 특성과 낮은 열전도도를 가지고 있어, 건축물의 단열재와 천연가스 운수송 분야에서 보냉재로 사용되고 있다. 해당 분야에서는 기계적 강도는 높이고 열전도도는 낮추고자 하는 기술적 수요가 꾸준히 요구되고 있다. 본 연구에서는 경질 폴리우레탄폼을 제작하고, 교반기의 임펠러 형태(Propeller, Dispersed turbine)에 따른 폼의 미세구조와 물성 변화를 연구하였다. FE-SEM 이미지 및 Micro-CT 분석을 통해 Dispersed turbine으로 제조한 폼의 평균 기공 크기가 Propeller로 제조한 기공보다 21.5% 작은 것을 확인하였다. 압축 강도는 작은 기공을 가진 폼에서 15.4% 향상되었고, 열전도도는 3.1% 감소하였다. 이러한 결과는 PUF 복합재 제조에 활용될 수 있다.

• 폴리머
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• 제34권1호
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• pp.8-13
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• 2010

발포체의 물성은 발포체의 밀도, 사용된 폴리머의 기계적 물성과 열린 셀의 함량, 셀 크기, 셀 크기 분포, 셀 형태, 스킨층의 두께 등을 포함하는 셀 구조에 의존하며, 이러한 발포체의 밀도는 사용된 폴리머의 종류와 가교제의 농도 그리고 가공 기술 및 가공 조건과 같은 다양한 원료 물질과 가교 조건에 영향을 받는다. 본 연구에서는 폴리에스터 폴리올, MDI, 아민계 촉매, 틴계 촉매, 실리콘 유화제, 물을 기본 폴리우레탄 발포체의 조성으로 설정하였으며, 발포체에 있어서 stiff-chain 요소인 사슬 연장제의 첨가에 의하여 가교 밀도를 증가시켰다. 또한, 폴리우레탄 발포체의 기계적 물성을 높이기 위해 무기 충전제로 입자 크기와 $SiO_2$ 함량이 다른 실리카와 탈크 각각 2종류를 사용하였다. 발포체의 제조시 사슬 연장제와 무기 충전제의 종류와 함량비를 달리하면서 모듈러스, 인장 강도, 압축 강도, 경도의 물성 변화를 알아보았고, 전자현미경을 통해 셀의 크기 변화와 무기 충전제의 분포도를 관찰하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• 한국정밀공학회지
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• 제18권12호
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• pp.192-199
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• 2001

Chemical mechanical planarization (CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There hale been serious problems in CMP in terms of repeatability and deflects in patterned wafers. Especial1y, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasives and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using CeO$_2$is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method fur developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.