• Title/Summary/Keyword: Semi-conductor manufacturing equipment

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A Study on the Reliability Evaluation System for O-ring of Semiconductor Equipments (반도체장비용 오링의 종합 신뢰성 평가기술에 관한 연구)

  • 김동수;김광영;최병오;박화영
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.613-617
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    • 2001
  • The test items like as endurance, air leakage and oil endurance test is requested for reliability evaluation about O-ring which is a kind of core machinery accessories of semi-conduct manufacturing equipment. For verification of these, we design and manufactured a test system for endurance, air leakage and oil endurance of O-ring for semi-conduct manufacturing equipment, and also performed the test for two kinds of O-ring, as it were Viton and Kalretz. The characteristics of this test equipment consist in realization of the test conditions of semi-conduct manufacturing equipment and satisfying the test method. The test conditions are cut gas, vacuum grade, temperature and revolution numbers in the endurance test system, vacuum grade and temperature in the air leakage test system, temperature and time in the oil endurance test system. The separating test results for wearing which is an oil endurance test item, the wearing index of domestic produced Viton O-ring is higher than foreign product by 2%, wearing rate of Kalretz O-ring better than Viton O-ring by 17%, and particles existed in various place. The test result of air leakage which is measured through the RGA sensor used Helium, the vacuum grade was $10^-3$Torr. And the test result of oil endurance, the volume change rate was 7~15%. Hereafter, we intend to analysis the reliability test evaluation and to utilize for domestic manufacturing companies by establishing data base and developing reliability softwares.

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A Study on the Displacement Magnification Mechanism of Two-Lever System using Flexure Hinge (유연 힌지를 이용한 이중레버 시스템의 변위증폭 메카니즘에 관한 연구)

  • Jea, Wone-Soo;Ye, Sang-Don;Min, Byeong-Hyeon
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.7 no.2
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    • pp.60-65
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    • 2008
  • The high-technology industries including a semi-conductor and an information communication need an ultra-precision technology from the technological points of view. Nano technology based on an ultra-precision technology is being studied to overcome the delicate technology that may occur in the semi-conductor fields. Then, the transferring equipment with high resolution and long displacement becomes an important technology. The goal of this study is to analyze the displacement magnification mechanism driven by piezoelectric actuator which has high resolution and fast response characteristics using flexure hinge with the merits of soft displacement, negligible back-lash and stick-slip, and no-lubrication. The analyses to reduce the magnification losses occurred during the magnification process are performed using ANSYS software based on FEM. The five design variables such as arm thickness, thickness of hinge, radius of hinge, length of input side at the 1st lever and magnification ratio of 1st lever are optimized to induce the maximum magnification ratio using Taguchi method.

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인쇄전자를 위한 롤투롤 프린팅 공정 장비 기술

  • Kim, Dong-Su;Kim, Chung-Hwan;Kim, Myeong-Seop
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.15.2-15.2
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    • 2009
  • Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.

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A Study on the Structural Dynamic Modification of Sub-structure of Clean Room Considering Vibration Criteria (반도체 초정밀장비의 진동허용규제치를 고려한 지지구조의 동특성 개선에 관한 연구)

  • 손성완;이홍기;백재호
    • Journal of the Semiconductor & Display Technology
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    • v.2 no.2
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    • pp.25-30
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    • 2003
  • In the case of a vibration sensitive equipment, it require a vibration free environment to provide its proper function. Especially, lithography and inspection device, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved Giga Class semi conductor wafers. This high technology equipments require very strict environmental vibration criteria in proportion to the accuracy of the manufacturing. In this paper, the dynamic analysis and modal test were performed to evaluate the dynamic properties of the constructing clean room structure. Based on these results, a structural dynamic modification(SDM) were required to satisfiy the vibration allowable limit for pression machine. Therefore, in order to improve the dynamic stiffness of clean room structure, the VSD system which can control the force applied on structure, were adopted and its utility were proved from dynamic test results of the improved structure after a modification work.

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Study on Energy Efficiency Improvement in Manufacturing Core Processes through Energy Process Innovation (에너지 프로세스 혁신을 통한 제조 핵심 공정의 에너지 효율화 방안 연구)

  • Sang-Joon Cho;Hyun-Mu Lee;Jin-Soo Lee
    • Journal of Advanced Technology Convergence
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    • v.2 no.4
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    • pp.43-48
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    • 2023
  • Globally, there is a collaborative effort to achieve global carbon neutrality in response to climate change. In the case of South Korea, greenhouse gas emissions are rapidly increasing, presenting an urgent situation that requires resolution. In this context, this study developed a thermal energy collection device named a 'steam trap' and created an AI model capable of predicting future electricity usage by collecting energy usage data through steam traps. The average accuracy of electricity usage prediction with this AI model was 96.7%, demonstrating high precision. Consequently, the AI model enables the prediction and management of days with high electricity consumption and identifies which facilities contribute to elevated power usage. Future research aims to optimize energy consumption efficiency through efficient equipment operation using anomaly detection in steam traps and standardizing energy management systems, with the ultimate goal of reducing greenhouse gas emissions.

Development of Iron Core Type Linear Motor for Machine Tool (공작기계용 철심형 리피어모터 기술 개발)

  • Joung, Jae-Han;Park, Jae-Wan;Lee, Sang-Ryong
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.9
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    • pp.82-89
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    • 2002
  • There is an intensifying demand fur linear motors in vast range of industry applications such as in factory automation and semi-conductor manufacturing equipment due to their high positioning accuracy, high static stiffness, high thrust and excellent dynamic characteristics. This paper presents an iron core type linear motor for machine tool whose rated thrust is up to 6000N. For electromagnetic field and dynamic analysis, finite element method (FEM) is implemented to predict motor performance. Various design parameters are considered to reduce thrust ripple and to improve dynamic performance with the least sacrifice of effective thrust. Experimental results on thrust and static stiffness are also followed to confirmed the validity of the analysis.

Micro Pattern Screen Printing (미세 패턴 스크린 프린팅)

  • Choi Y.J.;Jung K.I.;Lee T.M.;Kim Y.S.;Kim K.Y.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.589-590
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    • 2006
  • Recently, research for the micro printing technology has begun to get into the spotlight. It is due to the superior price competitiveness to existent semi-conductor process for manufacturing some parts of display unit, electronic paper, RF-ID information device, and so on. This paper present screen printing process not for paper publication but for parts of electronics such as PDP wall, LCD CF, and so on. There are two major issues. The first one is how to get a fine and even line pattern. The other one is how to get the same patterns in large area. In this research, we present the design, equipment, and process control of screen printing in order to overcome these issues.

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