• Title/Summary/Keyword: Semi-conductor

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Intravenous Infusion Monitoring Sensor Based on Longitudinal Electric Field Proximity Sensing Technique (종방향 전기장 근접 감지 방식 수액 주입 측정 센서)

  • Kim, Young Cheol;Ahmad, Sheikh Faisal;Kim, Hyun Deok
    • Journal of Sensor Science and Technology
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    • v.26 no.2
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    • pp.101-106
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    • 2017
  • A novel intravenous (IV) infusion monitoring sensor is presented to measure the drop rate in the drip chamber of an IV infusion set. It is based on a capacitive proximity sensor and detects the variation of the longitudinal electric field induced by the drop falling into the drip chamber. Unlike the conventional capacitor sensor with two semi-cylindrical conductor plates, the proximity sensor for IV monitoring is composed of a pair of conductor rings which are mounted on the outer surface of the drip chamber with a specific gap between them. The characteristics of the proximity sensor for IV monitoring were investigated through three dimensional electrostatic simulations. It showed quite superior performances in comparison with the conventional capacitor sensor. Especially, the proposed proximity sensor exhibits consistent sensitivity regardless of its mounting position on the drip chamber, operates normally though the drip chamber is tilted and shows robustness to the changes of the drop size and the drip factor of the IV infusion set. Thus, the proximity sensor for IV monitoring is more suitable for use in actual environment of IV therapy compared with the conventional capacitor sensor.

A Study on the Reliability Evaluation System for O-ring of Semiconductor Equipments (반도체장비용 오링의 종합 신뢰성 평가기술에 관한 연구)

  • 김동수;김광영;최병오;박화영
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.613-617
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    • 2001
  • The test items like as endurance, air leakage and oil endurance test is requested for reliability evaluation about O-ring which is a kind of core machinery accessories of semi-conduct manufacturing equipment. For verification of these, we design and manufactured a test system for endurance, air leakage and oil endurance of O-ring for semi-conduct manufacturing equipment, and also performed the test for two kinds of O-ring, as it were Viton and Kalretz. The characteristics of this test equipment consist in realization of the test conditions of semi-conduct manufacturing equipment and satisfying the test method. The test conditions are cut gas, vacuum grade, temperature and revolution numbers in the endurance test system, vacuum grade and temperature in the air leakage test system, temperature and time in the oil endurance test system. The separating test results for wearing which is an oil endurance test item, the wearing index of domestic produced Viton O-ring is higher than foreign product by 2%, wearing rate of Kalretz O-ring better than Viton O-ring by 17%, and particles existed in various place. The test result of air leakage which is measured through the RGA sensor used Helium, the vacuum grade was $10^-3$Torr. And the test result of oil endurance, the volume change rate was 7~15%. Hereafter, we intend to analysis the reliability test evaluation and to utilize for domestic manufacturing companies by establishing data base and developing reliability softwares.

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Web Based rSPC System Supporting XML Protocol (XML 프로토콜을 지원하는 웹기반 rSPC 시스템)

  • Oh, Kyoung-Je;Han, Sang-Yong
    • The KIPS Transactions:PartA
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    • v.10A no.1
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    • pp.69-74
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    • 2003
  • Accurate process control in the manufacturing industry is essential to survive in the competitive market. Statistical process control (SPC) system has been widely used to satisfy the ever-increasing quality control requirements. However, most commercial products in the market are not flexible, semi-automatic, and difficult to interface with other tools. In this paper, we propose an advanced rSPC (Real-Time SPC) system which is based on the web and supports XML protocol. We also provide a powerful graphic facility and an efficient file system to handle the data in real time. Even though the idea can be applied to any manufacturing system, our system is optimized to the semi-conductor industry and TFT/LCD industry. The system is implemented in C++ and COM/DCOM, and shows a good result.

An Empirical Study about Assessment of the JIT System: on korean semi-production firm

  • Lee, Eung-Kweon
    • International Commerce and Information Review
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    • v.7 no.2
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    • pp.75-94
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    • 2005
  • This study is focused on evaluating the computer-integrated just-in-time (CI-JIT) production system of a semi-conductor manufacturing firm in Korea. Approaching the mid-1980s, the emphasis was on low price, low-cost operations, and quality, especially in USA. American companies have shifted output to low-wage countries like the Philippines, Korea, Japan, Malaysia and allied countries that can make quality products at low prices. Korea and other Asian countries forego short-term profits to gain a solid foothold in a product market, recognizing that larger market share leads to lower cost and higher profit in the long run. They bring manufacturers and suppliers together to improve material management and operation management, using project teams that investigate topics, such as Just-In-Time(JIT)manufacturing, among others. The "Kanban" word means "card" in Japanese, and is used to indicate the desired final delivery schedule. The operation for a particular item produced is scheduled for a specific time. The same process is extended to the external suppliers. More recently, the cards are gradually being replaced by electronic procedures that follow the same concept. Its capacity must be capable of handling the various transactions required by the JIT coverage as well as some allowances for expanded applications.

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Burr Control in Meso-Punching Process

  • Shin Hong Gue;Shin Yong Seung;Kim Byeong Hee;Kim Heon Young
    • Journal of Mechanical Science and Technology
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    • v.19 no.4
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    • pp.968-975
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    • 2005
  • The shearing process for the sheet metal is normally used in the precision elements such as semi-conductor components. In these precision elements, the burr formation brings a bad effect on the system assembly and demands the additional de-burring process, so this imposes high cost on manufacturing. In this paper, we have developed the in-situ auto-aligning precision meso-punching system to investigate the burr formation mechanism and ultimately minimize burr. Firstly, we introduced the punch-die contact sensing method to align the punch and the die at initial state prior to the punching process. Secondly, by using the low-price semi-con­ductor laser, burr formed on the edges is measured intermittently during the punching process. We could, finally, make burr on the sheet metal uniformized and minimized by controlling of the precision X - Y table, $1\;{\mu}m$ resolution, and measuring burr height by semiconductor laser. Experimental results show the validity of our system for pursuing the burr-free punched elements.

인쇄전자를 위한 롤투롤 프린팅 공정 장비 기술

  • Kim, Dong-Su;Kim, Chung-Hwan;Kim, Myeong-Seop
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.15.2-15.2
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    • 2009
  • Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.

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Space Radiation Shielding Calculation by Approximate Model for LEO Satellites

  • Shin Myung-Won;Kim Myung-Hyun
    • Nuclear Engineering and Technology
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    • v.36 no.1
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    • pp.1-11
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    • 2004
  • Two approximate methods for a cosmic radiation shielding calculation in low earth orbits were developed and assessed. Those are a sectoring method and a chord-length distribution method. In order to simulate a change in cosmic radiation environments along the satellite mission trajectory, IGRF model and AP(E)-8 model were used. When the approximate methods were applied, the geometrical model of satellite structure was approximated as one-dimensional slabs, and a pre-calculated dose-depth conversion function was introduced to simplify the dose calculation process. Verification was performed with mission data of KITSAT-1 and the calculated results were also compared with detailed 3-dimensional calculation results using Monte Carlo calculation. Dose results from the approximate methods were conservatively higher than Monte Carlo results, but were lower than experimental data in total dose rate. Differences between calculation and experimental data seem to come from the AP-8 model, for which it is reported that fluxes of proton are underestimated. We confirmed that the developed approximate method can be applied to commercial satellite shielding calculations. It is also found that commercial products of semi-conductors can be damaged due to total ionizing dose under LEO radiation environment. An intensive shielding analysis should be taken into account when commercial devices are used.

The analysis of EDM characteristics for Cu-electrode using LIGA process (LIGA 공정을 이용한 Cu전극의 방전가공 특성 분석)

  • Lee, S.H.;Jung, T.S.;Chang, S.S.;Kim, J.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.05a
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    • pp.383-386
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    • 2007
  • In this study, the analysis was carried out for Electrical Discharge Machining (EDM) characteristics of the Cu electrodes by LIGA process. The shape of electrodes has 324 pins for the cavity of BGA(Ball Grid Array) type test socket mold. BGA test sockets are used in the inspection process of the semi-conductor I.C chip manufacturing. In the work, the machining performance for EDM of the electrodes was analyzed on dimensional accuracy and wear rate. The dimensional accuracy was measured for dimension of the pins, pitch size between the pins and the roundness of corner edge using optical measuring machine.

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MPC Based Feedforward Trajectory for Pulling Speed Tracking Control in the Commercial Czochralski Crystallization Process

  • Lee Kihong;Lee Dongki;Park Jinguk;Lee Moonyong
    • International Journal of Control, Automation, and Systems
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    • v.3 no.2
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    • pp.252-257
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    • 2005
  • In this work, we propose a simple but efficient method to design a target temperature trajectory for pulling speed tracking control of the crystal grower in the Czochralski crystallization process. In the suggested method, the model predictive control strategy is used to incorporate the complex dynamic effect of the heater temperature on the pulling speed into the temperature trajectory design quantitatively. The feedforward trajectories designed by the proposed method were implemented on 200 mm and 300 mm silicon crystal growers in the commercial Czochralski process. The application results have demonstrated its excellent and consistent tracking performance of pulling speed along whole bulk crystal growth.

Design and Characteristic of the AC Solenoid Valve (AC 솔레노이드 밸브의 설계 및 특성)

  • Kim, Dong-Soo;Jeon, Yong-Sik
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.3056-3061
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    • 2007
  • The technology of AC solenoid valves is now considered as a core technology in the fields of the production line of semi-conductor chips and the micro fluid chips for medical applications. And AC solenoid valves, which operate by compressed air, are characterized by high speed response, great repeatability and that the pressure on the cross sectional area of poppet is kept constant regardless of the fluctuation of the pressure exerted on the ports. In this study, AC solenoid valves that posses the high-speed responsibility and the high rate of flow have designed and analyzed through the law of equivalent magnetic circuit and Finite Element Method (FEM) respectively. In case of poppet, Flow field characteristic was analyzed by the variation of poppet and it was able to display flow field by changing the location of the poppet. Also, we verified possibility of the design through the static and dynamic pressure and the 3D distribution curve of the force by working the front poppet.

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