• Title/Summary/Keyword: Self-inductance effect

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Effective Protection Methods of Household Electric Appliances. from Lightning Surges (가정용 전기기구의 효과적인 뇌서지 보호기법)

  • 이복희;강성만;엄주홍;이수봉;길형준;구본완;안창환
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.53 no.3
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    • pp.149-156
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    • 2004
  • This paper deals with the effective protection method for the household electric appliances against lightning surges invading from the Power lines. Direct or induced lightning is the main cause of the breakdown of household electric appliance. The most effective protection method is to install SPDs(surge protective devices) at household electric appliances. If SPDs were not installed at most household electric appliances, it is necessary to install SPDs on the mains. Therefore the propagation aspect and protection methods of lighting surges coming into household electric appliances through the mains was experimentally investigated. The in actual-sized test circuits results of protection method for 8 household electric appliances including computer monitors and TV set could be summarized as follows: The breakdown characteristics of household electric appliances from lightning surges were significantly changed with the their input impedance. Namely, the types of input impedance are classified into infinite, resistive or inductive impedances. Especially, the monitor for computer with inductive input impedance from lightning surges was relatively weak against lightning surges. It was confirmed that the self inductance of branch circuits on the mains have protection effect for household electric appliances against lightning surges invading from the power lines. Also the varistors installed at cabinet panel or circuit-breaker were more effective than multi-tap outlet with varistors. When installed varistors in cabinet panel and multi-tap outlet together, the surge protection effect is much more excellent in technical and economical aspects.

A Study on the Design and Fabrication of GHz Magnetic Thin Film Inductor Utilizing Co90Fe10/SiO2 Multilayer (Co90Fe10/SiO2 Multilayer를 이용한 GHz 자성박막 인덕터 설계 및 제작에 관한 연구)

  • 공기준;윤의중;진현준;박노경;문대철
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.25 no.5B
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    • pp.985-991
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    • 2000
  • In this paper, the optimum structure of 2GHz magnetic thin film planar inductor were designed and fabricated to reduce the inductor area and to maximize the inductance L and quality factor Q of the inductor. The optimum design was performed utilizing Co90Fe10 layer multilayered with SiO2 layers to avoid the eddy-current skin effect and considering new lumped element model. New magnetic thin film inductors operating at 2GHz were fabricated on a Si substrate utilizing photo-lithography and lift-off techniques. The frequency characteristics of L, Q, and impedance in more than fifty identical inductors were measured using an RF Impedance Analyzer(HP4291B with HP16193A test fixture). The self-resonant frequencies(SRF) of the inductors were measured by a Vector Network Analyzer(HP8510). The developed inductors have SRF of 1.8 to 2.3GHz, L of 47 to 68nH, and Q of 70 to 80 near 1GHz. Finally, high frequency, high performance, planar micro-inductor(area=30.8 x 30.8il$^2$) with maximized L and Q were fabricated succefully.

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Radio Frequency Circuit Module BGA(Ball Grid Array) (Radio Frequency 회로 모듈 BGA(Ball Grid Array) 패키지)

  • Kim, Dong-Young;Jung, Tae-Ho;Choi, Soon-Shin;Jee, Yong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.37 no.1
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    • pp.8-18
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    • 2000
  • We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

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