• 헤리티지:역사와 과학
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• 제50권3호
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• pp.4-29
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• 2017

본 글은 중국 자료의 편년을 통해 한국식동검문화의 개시 연대를 파악하는 데 목적을 두었다. 여기에서는 한반도의 한국식동검과 중국의 동주식동검에 동일한 구분마연 기술이 존재하는 점을 주목하였다. A1식 구분마연 기술이 관찰되는 동주식동검은 '1958년 산동성 안구시 수습품'으로 전해져 명확한 출토양상을 파악할 수 없다. 때문에 비교자료인 제남 좌가와 1호묘 출토 동주식동검과 공반품을 제시하였다. 공반품은 청동무기, 청동예기 등이 출토되어 유적의 연대는 춘추-전국시대 과도기~전국시대 전기로 편년된다. 출토된 양 동검은 형식학적 유사성 및 편년적 위치를 동일하게 설정할 수 있게 된다. 따라서 한반도 제유적 출토의 한국식동검은 중국 출토 A1식 구분마연 기술의 동주식동검과 일정기간 병행되어 성립되는 것으로 볼 수 있다. 또한 A2식 구분마연 기술이 확인되는 산서성 만영묘전 61M1호묘의 연대는 전국시대 전기~중기로 편년되며 A1식 구분마연 기술과 연동되어 전개되는 것으로 확인된다. 결국 중국 자료의 편년을 통해 볼 때 한국식동검문화의 개시 연대는 춘추-전국시대 과도기~전국시대 전기로 이해되고, 기원전 5~4세기로 편년된다. 이와 같은 연대는 기원전 6~5세기로 편년되는 심양 정가와자 6512호묘에 후행되며 요령식동검문화와 한국식동검문화는 자연스럽게 연동되는 것을 알 수 있다. 나아가 A1식 구분마연 기술은 한반도 서남부지역과 중국 산동반도, A2식 구분마연 기술은 한반도 남부지역과 중국 산서지역 및 일본 북부구주지역에 분포한다. 구분마연 기술의 무기형청동기를 통해 볼 때 중국 산동반도(중원지역) ${\leftrightarrows}$ 한반도 서남부지역(서북부지역) ${\leftrightarrows}$ 일본 북부구주지역은 하나의 교통로(전파 경로)로 설정된다. 이는 한반도를 중심으로 구분마연 기술이 출현하고, 지역적 확산이 전개되는 바이다.

• Applied Microscopy
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• 제47권2호
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• pp.77-83
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• 2017

Drastic development of ubiquitous devices requires more advanced batteries with high specific capacitance and high rate capability. Large-area microstructure characterization across the stacks of cathode, electrolyte and anode might reveal the origin of the instability or degradation of batteries upon cycling charge. In this study, sample preparation methods to observe the cross-section view of the electrodes for battery in SEM and several imaging tips are reviewed. For an accurate evaluation of the microstructure, ion milling which flats the surface uniformly is recommended. Pros and cons of cross-section polishing (CP) with Ar ion and focused ion beam (FIB) with Ga ion were compared. Additionally, a modified but new cross-section milling technique utilizing precision ion polishing system (PIPS) which can be an alternative method of CP is developed. This simple approach will make the researchers have more chances to prepare decent large-area cross-section electrode for batteries.

• 한국초전도ㆍ저온공학회논문지
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• 제8권1호
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• pp.9-14
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• 2006

Sample preparation plays a critical role in microstructure analysis using TEM. Although TEM specimen has been usually prepared by jet-polishing or Ar-ion beam milling technique. these methods could not be applied to YBCO CC which is composed of IBAD or RABiTS substrates, several buffet layers, and YBCO superconducting layer because of big difference in mechanical strengths between the metallic phase and oxide phases. To obtain useful cross-sectional information such as interface between the phases or second phases in YBCO CC, it is prerequisite to secure the large area of thin section in the cross-sectional direction. The superconducting layer or the buffer layers are relatively weak and fragile compared to the metallic substrate such as Ni-5wt%W RABiTS of Hastelloy-based IBAD, and preferential removal of weak ceramic phases during polishing steps makes specimen preparation almost impossible. Tripod polisher and small jig were home-made and employed to sample preparation. The polishing angle was maintained <$1^{\circ}$ throughout the polishing steps using 2 micrometers attached to the tripod plate. TEM specimens with large and thin area could be secured and used for RABiTS/IBAD substrate analyses. In some cases, additional Ar-beam ion milling with low beam current and impinging angle was used for less than 30 sec. to remove debris or polishing media attacked to the specimens.

• 대한치과의사협회지
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• 제49권1호
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• pp.22-32
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• 2011

This paper reviewed the following subheadings and a few selected references in each section were discussed: ${\cdot}$ Sealant placed over caries; is it possible? Initial caries which is not sticky during proving is possible to be placed with sealants. ${\cdot}$ Prophylaxis of fissure; which method is most effective? Mechanical preparation with fissurotomy or resin polishing bur is one of the most effective method to clean the pit and fissure. ${\cdot}$ Glassionomer cement as a sealant; GIC, wheather it released fluoride or not, cannot be as cost-effective as resin-based sealants. ${\cdot}$ Sealant products; Color(white vs opaque), fluoride(containing vs not), filler component(filled vs non-filled) do not influenced the quality and retention of sealants. ${\cdot}$ Use of intermediate bonding agent to improve retention; Intermediate bonding may increase the retention rate of sealants ${\cdot}$ Penetration method of sealants; Several methods including waiting before light curing are recommended.

• Applied Microscopy
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• 제39권3호
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• pp.277-281
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• 2009

Practical difficulties for preparing a good crosssectional specimen of GaN-based materials for transmission electron microscopy have arisen due to large difference of mechanical properties between hard ceramic substrate and soft GaN-layered materials. Uneven polishing, sudden cracking, delamination, and selective sputtering during the conventional wedge polishing technique are often encountered as experimental hindrances. The preparation technique based on Strecker's method can be applied to overcome these difficulties, which eventually leads to mechanically stable TEM samples independent of the mechanical properties of materials. The basic idea is to use hard ceramic dummy filler for embedding the sample of interest into the dummy frame. In this study, we applied this technique into preparing cross-sectional TEM specimen of the GaN-based materials with mechanical instability and demonstrated usefulness of this hard dummy filler method in which the possible modifications of the sample of interest during the preparation must be avoidable. In addition, practical precautions during the preparation were discussed.

• 한국정밀공학회지
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• 제18권12호
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• pp.192-199
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• 2001

Chemical mechanical planarization (CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There hale been serious problems in CMP in terms of repeatability and deflects in patterned wafers. Especial1y, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasives and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using CeO$_2$is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method fur developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• 펄프종이기술
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• 제44권4호
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• pp.16-24
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• 2012

To characterize the coating structure, diverse methods such as mercury intrusion, nitrogen adsorption and oil absorption methods have been developed and widely employed. These indirect techniques, however, have some limitation to explain the actual coating structure. Recently microscopic observation methods have been tried for analyzing structural characteristics of coating layers. Preparation of the undamaged cross section of a coating layer is essential for obtaining high quality image for analysis. In this study, distortion-free cross-section of the coating layer was prepared using a grinding and polishing technique. The coated paper was embedded in epoxy resin and cured. After curing the resin block it was ground with abrasive papers and then polished with diamond particle suspension and nylon cloth. Polished coating layer was sufficient enough to obtain undamaged cross sectional images with scanning electron microscope under backscattered electron image mode. In addition, the SEM images allowed distinction of the coating layer components. Also S/B latex film formed between pigment particles was visualized by osmium tetroxide staining. Pore size distribution and pore orientation were evaluated by image analysis from SEM cross-sectional images.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• 헤리티지:역사와 과학
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• 제53권4호
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• pp.170-187
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• 2020

고성 삼덕리유적에서는 청동기시대 후기의 묘역식 지석묘와 석관묘가 발굴되었으며 적색마연토기, 석촉, 석검 등의 부장품이 출토되었다. 고성 삼덕리유적에서 출토된 적색마연토기는 약 50~160㎛ 두께의 안료층이 남아 있으나 대다수의 토기 표면에서 안료층의 박리, 박락현상이 관찰되었다. 적색마연토기의 태토는 중립의 석영, 장석, 각섬석 등으로 구성되어 있으며 부분적으로 철산화물의 불투명 광물도 확인되었다. 6호 석관묘에서 출토된 적색마연토기는 비짐으로 각섬석, 장석이 다량 포함되어 있어 다른 무덤에 부장된 적색마연토기와 차이를 보였다. 적색 안료는 태토와 유사한 광물 조성을 보이고 있으나 적철석(hematite)이 상당량 함유되어 있고, 미립의 석영, 장석, 각섬석 등이 관찰되었다. 광물 조성으로 볼 때 소성 온도는 900℃ 내외였을 것으로 추정된다. 삼덕리 일대 3km 이내에는 장석과 각섬석이 우세한 섬록암과 화강섬록암이 노출된 지역이 확인되므로 이 일대에서 토기 제작을 위한 원료를 채취하였을 가능성이 높다. 적색마연토기는 성형 후 안료를 물에 풀어서 토기 전면에 채색한 후 마연 기법으로 마무리한 것으로 판단된다. 태토와 안료층의 소결 상태를 고려할 때 채색 후 소성하였던 것으로 생각되며 '성형-반건조-채색-마연'의 과정을 거친 후 소성되었을 것으로 추정된다. 다만 토기에 도포하는 안료의 농도, 채색 시점과 방법에 따라 적색마연토기의 표면과 단면 상태가 다르게 나타나는 것으로 확인되었다. 대부분의 삼덕리유적 토기들은 안료층과 태토층이 뚜렷하게 구분되었으나 안료가 태토층에 스며들어가 안료와 태토가 뚜렷이 구분되지 않는 토기편도 관찰되었다. 이는 미립질의 안료가 묽은 농도로 도포되었거나 성형 직후 도포되었기 때문으로 보인다. 또한 대부분의 적색마연토기에서는 안료층의 박락과 마모현상이 관찰되었고 안료층이 일부만 잔존하는 경우도 많았다. 이는 안료를 도포하고 마연 처리한 토기에서 마모에 의한 손상이 더 쉽게 발생한다고 보고되고 있어 삼덕리유적 적색마연토기도 매장 환경에서 풍화에 의해 마모와 박락이 진행된 것으로 생각되며, 매장주체부 출토품보다 고분 외곽에 뿌려진 잔편에서 이러한 손상이 가속화되어 나타났다.