• Nuclear Engineering and Technology
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• v.54 no.11
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• pp.4146-4158
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• 2022

Ultra-high performance concrete (UHPC) has been widely utilized in military and civil protective structures to resist intensive loadings attributed to its excellent properties, e.g., high tensile/compressive strength, high dynamic toughness and impact resistance. At present, aiming to improve the defects of the traditional vertical concrete cask (VCC), i.e., the external storage facility of spent fuel, with normal strength concrete (NSC) shield, e.g., heavy weight and difficult to fabricate/transform, the feasibility of UHPC applied in the shield of VCC is numerically examined considering its high radiation and corrosion resistance. Firstly, the finite element (FE) analyses approach and material model parameters of NSC and UHPC are verified based on the 1/3 scaled VCC tip-over test and drop hammer test on UHPC members, respectively. Then, the refined FE model of prototypical VCC is established and utilized to examine its dynamic behaviors and damage distribution in accidental tip-over and end-drop events, in which the various influential factors, e.g., UHPC shield thickness, concrete ground thickness, and sealing methods of steel container are considered. In conclusion, by quantitatively evaluating the safety of VCC in terms of the shield damage and vibrations, it is found that adopting the 300 mm-thick UHPC shield instead of the conventional 650 mm-thick NSC shield can reduce about 1/3 of the total weight of VCC, i.e., about 50 t, and 37% floor space, as well as guarantee the structural integrity of VCC during the accidental drop simultaneously. Besides, based on the parametric analyses, the thickness of concrete ground in the VCC storage site is recommended as less than 500 mm, and the welded connection is recommended for the sealing method of steel containers.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.5
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• pp.367-372
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• 2020

As packaging processes for atomic gyroscope vapor cells, the glass tube tip-off process, anodic bonding, and paste sealing have been widely studied. However, there are stability issues in the alkali metal which are caused by impurity elements and leakage during high-temperature processes. In this study, we investigated the applicability of a vapor cell low-temperature packaging process by depositing Au on a Pyrex cell in addition to forming an Au-Sn thin film on a cap to cover the cell, followed by laser irradiation of the Au/Au-Sn interface. The mechanism of the thin film bonding was evaluated by XRD, while the packaging reliability of an Ne gas-filled vapor cell was characterized by variation of plasma discharge behavior with time. Furthermore, we confirmed that the Rb alkaline metal inside the vapor cell showed no color change, indicating no oxidation occurred during the process.

• Journal of the Korean Magnetics Society
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• v.21 no.3
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• pp.108-115
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• 2011

Principles in the synthesis of small-sized high-quality crystals for the experimental condensed matter physics will be discussed in this paper. Synthesis process and cautions will be introduced especially for the synthesis methods which can be easily accessible to researchers. Starting from the solid state reaction which is the most common synthesis method, I will explain the quartz tube sealing that is crucial for making polycrystalline materials as well as single crystals in various conditions. Finally, basics of single crystal growth and various techniques will be introduced on the whole for the researchers who are not familiar with the material synthesis.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.1
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• pp.75-80
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• 2006

We have fabricated a carbon nanotube field emission display(CNT-FED) panel with a 2 inch diagonal size using a screen printing method and in-situ vacuum sealing technology. The field emission properties of CNT FED panel with square-type CNT emitters. As results, the square-characterized and compared with those of the line-type CNT emitters. As results, the square-type CNT emitters showed much larger emission current and more stable I-V characteristics. Light emission started to be occurred at an electric field of 3.5 V/${\mu}m$ corresponding to the anode-cathode voltage of 700 V. The vacuum level inside of the in-situ vacuum sealed panel was obtained with $1.4 {\times} 10^{-5}$ torr. The sealed panel showed the similar I-V characteristics with the unsealed one and the uniform light emission with very high brightness at a current density of $243 {\mu}A/ cm^2$ obtained by the electric field of 10 V/${\mu}m$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.192-192
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• 2010

DAPAS (Development of Advanced Power system by Applied Superconductivity technologies) program that the, superconductivity national program has been started one of the 21C frontier programs from 2001 in Korea. The 3rd phase of DAPAS program was started at April 2007, and the ultimate goal of HTS cable project is to develop 154kV, 1GVA class HTS cable. The structure of 154kV, 1GVA HTS cable is single core with cold dielectric insulation. The cable core consists of the former, conduction layer, electrical insulation layer, shielding layer. The cable cryostat consists of two corrugated seamless aluminum tubes as its high sealing reliability, the tubes separated through a spacer arrangement. Outdoor termination was developed by LS cable and cryogenic system by CVE for 154kV, 1GVA class HTS cable. The 154kV, 1GVA HTS cable will be installed and be tested in KEPCO Gochang Testing Center from June 2010.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.129-132
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• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}\;pa{\cdot}m^3/cm^2$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.5
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• pp.515-520
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• 2004

We report on the development of a Piezoelectric valvc that is designed to have a high reliability for fluid control systems, such as mass flow control, transportation and chemical analysis. The valve was fabricated using a MCA(multilayer ceramic actuator), which has a low consumption power, high resolution and accurate control. The fabricated valve is composed of MCA, a valve actuator die and an seat die. The design of the actuator dic was done by FEM(finite element method) modeling, respectively. And, the valve seat die with 6 trenches was made. and the actuator die, which possible to optimize control to MCA, was fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the scat/actuator die structure. PDMS(poly dimethylsiloxane) sealing pad was fabricated to minimize a leak-rate. It was also bonded to scat die and stainless steel package. The flow rate was 9.13 sccm at a supplied voltage of 100 V with a 50 % duty ratio and non-linearity was 2.24 % FS. From these results, the fabricated MCA valve is suitable for a variety of flow control equipments, a medical bio-system, semiconductor fabrication process, automobile and air transportation industry with low cost, batch recess and mass production.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.08a
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• pp.48-52
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• 2003

Low melting crystalline solder glasses for CRT sealing were prepared from the composition of PbO 73.0~75.5 wt%, ZnO 12~15 wt%, $B_2O_3$ 7.0~9.0 wt%, BaO 1.5~3.5 wt%, $P_2O_5$ 1.0~2.5 wt%, $Bi_2O_3$ 0.5~20 wt%. The nucleation and crystallization of the crystalline solder glasses were studied by DTA, SEM and XRD. $2PbO{\cdot}ZnO{\cdot}B_2O_3$ crystalline phase was formed from glass matrix by heat-treatment of glass frits Crystalline solder glasses developed from this paper have good firing condition of $430{\sim}440^{\circ}C$ for 10min and good physical properties

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.28 no.12
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• pp.477-482
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• 2016

Airtight containers have been widely used in many industries and household. They need a packing for sealing between the inside and outside. Previous packing materials have some drawbacks like stench, stickiness, and difficulty of applying to automated manufacturing systems. So, a new packing material which is harmless and suitable for automation is needed. This study performed a hot plate welding process of thermoplastic elastomer (TPE) as the packing material. The hot plate welding process included a phase change process of solidification and melting. The porosity-enthalpy method was adopted in order to simulate phase change problems. The TPE showed non-Newtonian fluid characteristics during the melting process. Since properties of SEBS are not well-defined, we established TPE properties by observing the melting behavior of TPE. In order to find an optimized condition, a parametric study including packing thickness, shapes, hot plate temperature, and thermal resistance, was conducted.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.594-597
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• 2004

본 연구에서는 진공 인라인 실장 기술을 이용하여 제작한 플라즈마 디스플레이 패널(PDP)의 전기적 광학적 특성을 측정하여, 일반적인 실장 방법을 이용한 PDP의 특성과 비교 분석하였다. 본 실험에 사용된 패널은 Screen Printer를 이용한 상 하부전극과 하판 유전체, 상판 투명유전체, 격벽 및 E-Beam Evaporation 방법을 이용하여 증착한 MgO 보호막으로 이루어져 있으며, 분위기 온도 $430^{\circ}C$, Ne-Xe(4%) 400[torr]압력 하에서 실장하였다. 높은 분위기 온도로 인하여 MgO에 Crack이 발생하였으나 지속적인 연구를 진행하여 최적의 실장 조건을 확립할 수 있었다. 이러한 진공 인라인 실장 기술은 추가적인 Annealing 공정이 필요하지 않아 공정의 단축을 모색할 수 있으며, MgO의 수화를 제거함으로써 일반적인 실장 방법을 이용한 패널보다 더 우수한 전기적 광학적 특성을 얻을 수 있었다.