• Journal of The Korean Association of Information Education
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• v.23 no.4
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• pp.303-314
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• 2019

Since 2019, the informatics education is being conducted for elementary school 5th, 6th grade students through the curriculum revised 2015. But, informatics education is implemented from the lower grades of elementary school in many countries. The purpose of this study was to suggest the direction in the choice of programming language considering characteristics for lower grades student. In order to achieve the goal, evaluation criteria were developed considering the development characteristics of lower grades and necessary elements of educational programming language. The results of analyzing the usability of the two languages based on the criterion are as follows. First, Viscuit can be used to consider the expressive power of students with lower school age or to learn algorithms without learning about programming concepts. Second, ScratchJr is easy to learn the concept of algorithm and programming. This study is meaningful in that has presented implications considering the developmental state of the students in preparation for rhe programming education.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.7
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• pp.311-315
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• 2002

Chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD), inter-level dielectric (ILD) layers of multi-layer interconnections. In this paper, we studied the characteristics of polishing pad, which can apply shallow trench isolation (STI)-CMP process for global planarization of multi-level interconnection structure. Also, we investigated the effects of different sets of polishing pad, such as soft and hard pad. As an experimental result, hard pad showed center-fast type, and soft pad showed edge-fast type. Totally, the defect level has shown little difference, however, the counts of scratch was detected less than 2 on JR111 pad. Through the above results, we can select optimum polishing pad, so we can expect the improvements of throughput and device yield.