• 제목/요약/키워드: Schottky contact

검색결과 164건 처리시간 0.025초

Schottky Metal에 따른 Nonpolar GaN Schottky Diode의 전기적 특성 연구

  • 김동호;이완호;김수진;채동주;양지원;심재인;김태근
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.18-18
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    • 2009
  • 최근 다양하게 연구되고 있는 무분극(nonpolar) 갈륨질화물(GaN) 소재는 자발분극(spontaneous polarization) 및 압전분극(piezoelectric polarization) 등이 발생하지 않아 높은 내부양자효율의 확보가 가능하며, 이러한 장점을 바탕으로 고효율 특성을 갖는 발광다이오드(light-emitting diode) 및 고속 전자소자 등으로의 적용을 위한 연구가 활발히 수행 중 이다. 하지만, 무분극 GaN LED의 구현 시, GaN 박막의 비등방성 성장으로 인한 박막의 막질 저하와 함께 표면에 혼재하는 Ga층과 N층에서 기인되는 절연층의 생성으로 인한 오믹전극 형성의 어려움이 대두되고 있다. 따라서, 고효율의 무분극 GaN LED 구현을 위해서는 무분극 GaN층의 질소층 제거를 위한 표면처리 공정과 더불어 금속/무분극 GaN층 간 발생되는 쇼트키 장벽층의 높이(Schottky barrier height)를 제어하는 연구가 선행되어야 한다. 본 논문에서는 무분극 GaN LED 적용을 위한 n-형 전극물질 및 오믹조건 구현을 위한 금속/무분극 GaN층간 SBH의 제어방법에 대한 연구를 수행하였다.

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희토류 금속을 이용한 니켈 실리사이드의 전기 및 물리적 특성 (Electrical and Physical Characteristics of Nickel Silicide using Rare-Earth Metals)

  • 이원재;김도우;김용진;정순연;왕진석
    • 한국전기전자재료학회논문지
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    • 제21권1호
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    • pp.29-34
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    • 2008
  • In this paper, we investigated electrical and physical characteristics of nickel silicide using rare-earth metals(Er, Yb, Tb, Dy), Incorporated Ytterbium into Ni-silicide is proposed to reduce work function of Ni-silicide for nickel silicided schottky barrier diode (Ni-silicided SBD). Nickel silicide makes ohmic-contact or low schottky barrier height with p-type silicon because of similar work function (${\phi}_M$) in comparison with p-type silicon. However, high schottky barrier height is formed between Ni-silicide and p-type substrate by depositing thin ytterbium layer prior to Ni deposition. Even though the ytterbium is deposited below nickel, ternary phase $Yb_xN_{1-x}iSi$ is formed at the top and inner region of Ni-silicide, which is believed to result in reduction of work function about 0.15 - 0.38 eV.

고온 열처리 공정이 탄화규소 쇼트키 다이오드 특성에 미치는 영향 (Effect of High Temperature Annealing on the Characteristics of SiC Schottky Diodes)

  • 정희종;방욱;강인호;김상철;한현숙;김형우;김남균;이용재
    • 한국전기전자재료학회논문지
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    • 제19권9호
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    • pp.818-824
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    • 2006
  • The effects of high-temperature process required to fabricate the SiC devices on the surface morphology and the electrical characteristics were investigated for 4H-SiC Schottky diodes. The 4H-SiC diodes without a graphite cap layer as a protection layer showed catastrophic increase in an excess current at a forward bias and a leakage current at a reverse bias after high-temperature annealing process. Moreover it seemed to deviate from the conventional Schottky characteristics and to operate as an ohmic contact at the low bias regime. However, the 4H-SiC diodes with the graphite cap still exhibited their good electrical characteristics in spite of a slight increase in the leakage current. Therefore, we found that the graphite cap layer serves well as the protection layer of silicon carbide surface during high-temperature annealing. Based on a closer analysis on electric characteristics, a conductive surface transfiguration layer was suspected to form on the surface of diodes without the graphite cap layer during high-temperature annealing. After removing the surface transfiguration layer using ICP-RIE, Schottky diode without the graphite cap layer and having poor electrical characteristics showed a dramatic improvement in its characteristics including the ideality factor[${\eta}$] of 1.23, the schottky barrier height[${\Phi}$] of 1.39 eV, and the leakage current of $7.75\{times}10^{-8}\;A/cm^{2}$ at the reverse bias of -10 V.

A Study on Contact Resistance Reduction in Ni Germanide/Ge using Sb Interlayer

  • Kim, Jeyoung;Li, Meng;Lee, Ga-Won;Oh, Jungwoo;Lee, Hi-Deok
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제16권2호
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    • pp.210-214
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    • 2016
  • In this paper, the decrease in the contact resistance of Ni germanide/Ge contact was studied as a function of the thickness of the antimony (Sb) interlayer for high performance Ge MOSFETs. Sb layers with various thickness of 2, 5, 8 and 12 nm were deposited by RF-Magnetron sputter on n-type Ge on Si wafers, followed by in situ deposition of 15nm-thick Ni film. The contact resistance of samples with the Sb interlayer was lower than that of the reference sample without the Sb interlayer. We found that the Sb interlayer can lower the contact resistance of Ni germanide/Ge contact but the reduction of contact resistance becomes saturated as the Sb interlayer thickness increases. The proposed method is useful for high performance n-channel Ge MOSFETs.

Precise Resistivity Measurement Independent Of Contact Resistance Influence And Its Applications

  • Kim, Dae-Hyun;Ryu, Hye-Yeon;Ji, Hyun-Jin;Lee, Jae-Woo;Kim, Gyu-Tae
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.146-147
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    • 2007
  • A universal four-point contact measurement method, has an advantage of non-existence of contact resistance, is demonstrated by the experiments with carbon nanotubes and ZnO nanowire. Ti/Au and Pt are tried to compare the influence of contact resistance between two different metals. These metals are selected to make Ohmic contact and Schottky contact originated from their different work functions. For precise experiments, Ti/Au and Pt are separately evaporated to form double 'four-point contact electrodes' on CNTs or ZnO, and the voltage-current characteristics are measured. This method can be applied to universal resistivity measurement for nanotubes and nanowires.

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정류성 접합에 의한 광다이오드의 특성 개선 (The Characteristic Improvement of Photodiode by Schottky Contact)

  • 허창우
    • 한국정보통신학회논문지
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    • 제8권7호
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    • pp.1448-1452
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    • 2004
  • 비정질실리콘은 빛을 받으면 자유전자와 자유정공이 무수히 발생하여 전류 또는 전압의 형태로 나타나는 광전변환 재료이다. 이를 광다이오드로 사용하기 위해서는 금속 박막(Thin film)과 결합하여 쇼트키 다이오드로 만드는 기술이 효과적이다. 본 연구에서는 광다이오드의 신뢰성 및 특성을 개선하기 위하여 크롬실리사이드를 기존의 방식과 달리 하부 전극으로 크롬금속 박막을 증착한 후 그 위에 사일렌(SiH4)가스를 사용해서 PECVD (Plasma Enhanced Chemical Vapor Deposition) 진공 증착장비로 최적의 비정질실리콘 박막을 얇게 (100$\AA$) 만들어 열처리를 통하여 크롬실리사이드 박막을 형성 한 후 광다이오드 소자를 제조한다. 이렇게 형성된 크롬실리사이드 광 다이오드를 사용하여 암전류와 광전류를 측정찬 결과 기존의 방식보다 우수한 성능이 나타났고, 공정도 단순화 할 수 있었으며 그리고 신뢰성도 개선되었다.

PLD 방법에 의해서 증착된 ZnO 박막의 전기적 특성 및 접합 특성에 관한 연구 (Electrical Characterization and Metal Contacts of ZnO Thin Films Grown by the PLD Method)

  • 강수창;신무환
    • 한국전기전자재료학회논문지
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    • 제15권1호
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    • pp.15-23
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    • 2002
  • In this study, metal/ZnO contacts were thermally annealed at different temperatures (as-dep., 400$^{\circ}C$, 600$^{\circ}C$, 800$^{\circ}C$, 1000$^{\circ}C$) for the investigation of electrical properties, and surface and interface characteristics. The analysis of the element composition and the chemical bonding state of the surface was made by the XPS(X-ray photoelectron spectroscopy). An attempt was made to establish the electrical property-microstructure relationship for the (Ti, Au)/ZnO. The Ti/ZnO contact exhibits an ohmic characteristics with a relatively high contact resistance of 4.74${\times}$10$\^$-1/ $\Omega$$\textrm{cm}^2$ after an annealing at 400$^{\circ}C$. The contact showed a schottky characteristics when the samples were annealed at higher temperature than 400$^{\circ}C$. The transition from the ohmic to schottky characteristics was contributed from the formation of the oxide layers as was confirmed by the peaks for O-O and Ti-O bondings in XPS analysis. For the Au/ZnO contact the lowest contact resistance was obtained from the as-deposited sample. The resistance was slowly increased with annealing temperature up to 600$^{\circ}C$. The ohmic characteristics were maintained eden fort 600$^{\circ}C$ annealing. The XPS analysis showed that the Au-O intensity was dramatically decreased with temperature above 600$^{\circ}C$.

InP/AnGaAs HPT's 제작을 위한 $ITO/n^+$-InP Ohmic contact 특성 연구 (Formation of ITO ohmic contact to $n^{+}$-InP for InP/lnGaAs HPT's fabrication)

  • 황용한;한교용
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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    • pp.213-216
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    • 2001
  • The use of a thin film of indium between the ITO and the $n^{+}$-InP contact layers for InP/InGaAs HPTs was studied without degrading its excellent optical transmittance properties. ITO/$n^{+}$-InP ohmic contact was successfully achieved by the deposition of Indium and thermal annealing. The specific contact resistance of about 6.6$\times$$10^{-4}$$\Omega\textrm{cm}^2$ was measured by use of the transmission line method (TLM). However, as the thermal annealing was just performed to ITO/$n^{+}$-InP contact without the deposition of Indium between ITO and $n^{+}$-InP, it exhibited schottky characteristics. In the applications, the DC characteristics of InP/InGaAs HPTs with ITO emitter contacts was compared with that of InP/InGaAs HBTs with the opaque emitter contacts.

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Pentacene을 이용한 diode의 제작 및 전기적 특성 (Fabrication and Electrical Characterization of Pentacene-based diodes)

  • 김대식;이용수;박재훈;최종선;강도열
    • 한국진공학회지
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    • 제9권4호
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    • pp.379-381
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    • 2000
  • Organic materials have potential advantages to be utilized as semiconductors in field effect transistors and light emmiting diodes. Gold, Aluminium, Silver, Chromium and Indium are used by electrodes. Gold is ohmic contact and the others are schottky contact. In this study, Pentacene and various electrode materials were deposited by Organic Molecular Beam Deposition (OMBD) and vacuum evaporation respectively. Those films were photolithographically patterned for measurements. These devices showed no degration after a 15 days of storage in laboratory environment.

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