• 한국전산유체공학회:학술대회논문집
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• 2008.08a
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• pp.60.2-60.2
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• 2008

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 2006.07a
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• pp.419-419
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• 2006

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 2006.07a
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• pp.723-723
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• 2006

• Proceedings of the KIPE Conference
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• 2006.06a
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• pp.131-133
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• 2006

A high efficiency half bridge converter for PDP in whole operation load range is proposed in this paper. The ZVS(Zero Voltage Switching) in whole load range and high efficiency in low load range is achieved because the proposed converter is switched by fixed frequency asymmetrical duty ratio and resonant operation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.489-490
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.485-486
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1059-1060
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1063-1064
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• 2011

• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.124-129
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• 2006

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1542-1543
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• 2007

This paper presents the effect of driving waveform for piezoelectric bend mode inkjet printhead with optimized mechanical design. Experimental and theoretical studies on the applied driving waveform versus jetting characteristics were performed. The inkjet head has been designed to maximize the droplet velocity, minimize voltage response of the actuator and optimize the firing frequency to eject ink droplet. The head design was carried out by using mechanical simulation. The printhead has been fabricated with Si(100) and SOI wafers by MEMS process and silicon direct bonding method. To investigate how performance of the piezoelectric ceramic actuator influences on droplet diameter and droplet velocity, the method of stroboscopy was used. Using the water based ink of viscosity of 11.8 cps and surface tension of 0.025N/m, it is possible to eject stable droplets through 64 nozzles average velocity of 4.05 m/s with standard deviation of 0.06 m/s and average diameter of $29.2\;{\mu}m$ with standard variation of $0.5\;{\mu}m$.