• Journal of Korean Institute of Industrial Engineers
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• v.39 no.5
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• pp.367-373
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• 2013

In this article, we deal with a design problem for determining the levels of noise factors in the Taguchi method. First, the proposed levels by Taguchi method is reviewed in case of smaller-the-better performance characteristics. We obtain the optimal levels of noise factors minimizing the mean square error of SN(signal to Noise) ratio and compare the optimal levels with the levels proposed by Taguchi method under the first and second order models. Secondly, the concept of V-optimality is applied to determining the levels of noise factors.

• Design & Manufacturing
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• v.2 no.5
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• pp.25-29
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• 2008

Almost all injection molds have multi-cavity runner system for mass production, which are designed with geometrically balanced runner system in order to accomplish filling balance between cavity to cavity during processing. However, even though geometrically balanced runner is used, filling imbalance have been observed. Filling imbalance could be decreased by modifying processing conditions such as injections rate, mold temperature, injection pressure, melt temperature that are related to shear, viscosity. In this study, a series of experiment was conducted to investigate filling imbalance variation when modifying runner layout and ploymer and to determine which processing condition influences as the primary cause of filling imbalance in geometrically balanced runner system. The filling imbalance was desreased up to result range of $3{\leq}DFI{\leq}8(%)$ by using a new runner system for balanced filling.

• Journal of Korean Society for Quality Management
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• v.45 no.2
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• pp.293-306
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• 2017

Purpose: In this study, an optimal design level of influencing factors on semiconductor polishing process was determined to minimize flexion of both sides on wafers. Methods: First, significant interactions are determined by the stepwise regression method. ANOVA analysis on SN ratio and mean of dependent variable are performed to draw mean adjustment factors. In addition, the optimal levels of mean adjustment factors are decided by comparing means of each level of mean adjustment factors. Results: As a result of ANOVA, a mean adjustment factor was determined as a width of formed flexion on the plate. The mean of the difference has the nearest to 0 in the case when the width of formed flexion has level 2 (4mm). Conclusion: Optimal design levels of semiconductor polishing process are determined as follows; (i) load applied to the wafer carrier has a level 1 (3psi), (ii) load applied to the wafer has a level 1(3psi), (iii) the amount of slurry supplied during polishing has a level 3 (300 co/min), (iv) the width of formed flexion on the plate has level 2 (4mm).

• Design & Manufacturing
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• v.1 no.1
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• pp.13-16
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• 2007

Almost all injection molds have multi-cavity runner system for mass production, which are designed with geometrically balanced runner system in order to accomplish filling balance between cavity to cavity during processing. However, even though geometrically balanced runner is used, filling imbalance have been observed. Filling imbalance could be decreased by modifying processing conditions such as injections rate, mold temperature, injection pressure, melt temperature that are related to shear, viscosity. In this study, a series of experiment was conducted to investigate filling imbalance variation when modifying runner layout and polymer and to determine which processing condition influences as the primary cause of filling imbalance in geometrically balanced runner system.

• Journal of the Korean Society for Heat Treatment
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• v.2 no.2
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• pp.33-37
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• 1989

In order to improve hardness uniformity of standard-hardness blocks. experimental procedure was designed using Taguchi Method. For this purpose the following factors were studied: austenitizing temperature, tempering condition, grinding condition, subzero treatment, lapping time, $15{\mu}m$ polishing time, final polishing time. These factors were processed and then ten hardness values were measured on each specimen. SN (signal to noise) ratio for each condition was calculated with standard variations of these values. Finally, from the calculated value of ANOVA on SN ratios, the lapping time was found to be the main factor Better uniformity with longer lapping time implies that residual stress that was formed after quenching is a dominent parameter that affects on the uniformity of hardness. Therefore, step-quenching method was adapted to minimize the residual stress. By this modification of quenching procedure, the hardness uniformity was improved remarkably and the yield ratio was increased from 55% to 88%.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2009.10a
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• pp.647-653
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• 2009

Taguchi parameter design is an approach to reducing performance variation of quality characteristic value in products and processes. Taguchi has used SN (Signal to Noise) ratio to achieve the appropriate set of operating conditions where variability around target is low in the Taguchi parameter design. This paper describes the prediction technique of vehicle performance using parameter analysis to reduce man hour and test development period as well as to achieve stable NVH performance. Design engineer could efficiently decide the design variable using parameter analysis database in early design stage. These improvements can reduce the time needed to develop better vehicles.

• Journal of Korean Society for Quality Management
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• v.27 no.2
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• pp.101-111
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• 1999

The purpose of Taguchi's robust design lies in quality improvement by making the performance of a system robust against noise. Robust design with continuous performance characteristics has been the subject of much interest. However relatively little work has been done for discrete characteristics such as 0-1, good-medium-bad, etc. This paper is concerned with robust design of a discrete dynamic system. We first investigate the Taguchi method for robust design with discrete dynamic characteristics and discuss his standard error probability (SEP). Then we propose a generalized SEP, which makes it possible to encompass a wider class of robust design problems. An illustration is also given by example.

• 제어로봇시스템학회:학술대회논문집
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• 1994.10a
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• pp.1.1-5
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• 1994

In the single sweep record of event-related potential (ERP), the peak latency of P300, which is one of the most prominent positive peaks in the ERP record, might fluctuate according to the recording conditions. The fluctuation of the peak latency (measurement fluctuation) is the summation of the fluctuation caused by physiological factor (physiological fluctuation) and one by noise of background EEG (noise fluctuation). We propsed a method for estimating the interval of the physiological fluctuation based on a limited number of single sweep records. The noise fluctuation was estimated by using the relationship between the signal-to-noise (SN) ratio and the noise fluctuation based on the P300 model and the background EEG model. The interval estimate of the physiological fluctuation were obtained by subtracting the interval estimate of the noise fluctuation from that of the measurement fluctuation. The proposed method was tested by using simulation data of ERP and applied to actual ERP and data of normal subjects, and gave satisfactory results.

• Journal of Korean Society for Quality Management
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• v.45 no.4
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• pp.1003-1020
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• 2017

Purpose: The purpose of this study is to find the optimum working conditions for spot welding of wire Cu alloys to achieve high-level quality. The parts subject to spot welding are brush card assemblies, which are the main module of the electric movement method of the car seat. Methods: In this study, the signal-to-noise ratio(SN ratio) and the loss function [L(y)] are used as Taguchi method for dynamic characteristics. Results: The results of the study are as follows. First, the analysis of variance using SN ratio showed 6 significant factors(p = 0.1% or less) among 7 factors except press force. Second, the optimal design of the dynamic characteristics is the tip exchange cycle: 50,000 ea., the welding time is 110 ms, the pressing force is 11 kgf/cm2, the rise time is 40 ms, and the tip dressing is 3,000 ea., Tip angle is 12o and electric current is 1,800 A. Conclusion: The validity of the spot welding process of the manufacturer's brush card assembly was verified and proved to be consistent with the study results. The results of this study are expected to standardize the welding conditions and guarantee the quality level required by the customers.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.31-39
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• 2021

In this paper, warpage analysis that separates PCB for PoP (Package on Package) into unit and substrate using FEM (Finite Element Method), analysis of the effect of layer thickness on warpage, and SN (Signal-to-Noise) ratio by Taguchi method was carried. According to the analysis result, the contribution of the circuit layer on warpage was very high in the unit PCB, and the contribution of the outer layer was particularly high. On the other hand, the substrate PCB had a high influence of the circuit layer on warpage, but it was relatively low compared to the unit PCB, and the influence of the solder resist was rather increased. Therefore, considering the unit PCB and the substrate PCB at the same time, it is desirable to design the PCB for PoP layer-by-layer structure so that the outer and inner circuit layers are thick, the top solder resist is thin, and the thickness of the bottom solder resist is between 5 ㎛ and 25 ㎛.