• 제목/요약/키워드: SMC board

검색결과 5건 처리시간 0.021초

NDB 쏘일네일링 시스템의 거동특성 평가에 관한 실험적 고찰 (An Experimental Study on the Analysis of Behavior Characteristics of the NDB Soil Nailing System)

  • 김홍택;정성필;박시삼;전경식
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 2003년도 봄 학술발표회 논문집
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    • pp.521-528
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    • 2003
  • In this study, a newly modified soil nailing technology called as the NDB(New Down and Board) soil nailing system is introduced. To improve the trafficability, workability, and economical efficiency, SMC(Sheet Molding Compound) board is adopted instead of using the concrete block facing. The SMC board has a distinct advantage of showing a fine view by directly coating with any kind of environmental photos. Composite material properties of the SMC board and cement grout are distinguished features of the NDB soil nailing system. In the present study, both laboratory tests(bending and punching failure tests) and field pull-out tests are carried out to analyze the behavior characteristics of the NDB soil nailing system, including the stress and strain distribution.

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화재이론에 기초한 천장재 종류별 위험성 분석에 관한 연구 (A Study on Risk Analysis by Type of Ceiling Material Based on Fire Theory)

  • 김혜원;김윤성;이병흔;진승현;구인혁;권영진
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2021년도 가을 학술논문 발표대회
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    • pp.116-117
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    • 2021
  • In general, when a building fire occurs, the heat flow rises by buoyancy, which affects the temperature rise of the ceiling. In addition, when the ceiling ignites, the fire spreads rapidly due to horizontal spread and radiant heat. According to the fire investigation, most of the large fires have a common characteristic that the fire spreads to the ceiling and causes many casualties. Therefore, it is considered that it is necessary to review the fire risk of ceiling materials used in buildings to prevent the spread of fire to the ceiling. Therefore, in this study, combustion characteristics such as the amount of heat released and ignition time of each SMC, DMC, and gypsum board were checked using a Cone Calorimeter, and the ignition temperature was calculated by substituting them into the fire theory. As a result, the ignition temperature of SMC was 449K, that of DMC was 1492K, and that of gypsum board was 677K.

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납땜 검사용 정밀 광학 장치 개발과 응용 (Development of precision optical system and its application)

  • 고국원;조형석;김재선;김성권
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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    • pp.36-39
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    • 1997
  • In this paper, we described an approach to design of precision optical system for visual inspection of solder joint defects of SMC(surface mount components) on PCBs(Printed Circuit Board). The illumination system, consisting of three tiered LED lamps and one main camera and four side view camera, is implemented to generated iso-contour on the solder joint according to gradient of the soldered surface. We analyze LED design parameter such as incident angle, diameter of LED ring, and so on to acquire uniform illumination.

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무장관리컴퓨터 탑재소프트웨어 개발 (Development of Operational Flight Program for Stores Management Computer)

  • 이상철;김인규;김영일
    • 한국항공우주학회지
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    • 제31권5호
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    • pp.124-133
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    • 2003
  • 본 논문은 항공기 무장의 목록관리, 무장의 활성화, 그리고 무장의 발사 및 투하를 제어하고 관리하는 무장관리컴퓨터 탑재소프트웨어 개발 시 객체지향 설계기법을 적용하는 방법을 제안한다. 무장관리컴퓨터 개발을 위해 중앙처리장치 보드는 상용화된 PowerPC 603e의 군용모델을 사용하였으며 실시간 운용체계인 VxWorks와 Tornado개발환경을 이용하여 소프트웨어를 개발하였다. 소프트웨어 개발 시 객체지향 언어인 Ada95를 사용하였으며 소프트웨어 모듈간의 독립성을 위해 세 개의 층(Layer)으로 분리하여 설계하였다. 항송전자시스템컴퓨터 시뮬레이터와 테스트 벤치를 개발하여 무장관리시스템 하드웨어/소프트웨어 통합검증테스트를 수행하였다.

신경회로망과 퍼지 규칙을 이용한 인쇄회로 기판상의 납땜 형상검사 (Solder Joint Inspection Using a Neural Network and Fuzzy Rule-Based Classification Method)

  • 고국원;조형석;김종형;김성권
    • 제어로봇시스템학회논문지
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    • 제6권8호
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    • pp.710-718
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    • 2000
  • In this paper we described an approach to automation of visual inspection of solder joint defects of SMC(Surface Mounted Components) on PCBs(Printed Circuit Board) by using neural network and fuzzy rule-based classification method. Inherently the surface of the solder joints is curved tiny and specular reflective it induces difficulty of taking good image of the solder joints. And the shape of the solder joints tends to greatly vary with the soldering condition and the shapes are not identical to each other even though the solder joints belong to a set of the same soldering quality. This problem makes it difficult to classify the solder joints according to their qualities. Neural network and fuzzy rule-based classification method is proposed to effi-ciently make human-like classification criteria of the solder joint shapes. The performance of the proposed approach is tested on numerous samples of commercial computer PCB boards and compared with the results of the human inspector performance and the conventional Kohonen network.

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