• Title/Summary/Keyword: SI7

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Magnetic Properties of Amorphous FeSiB and Nanocrystalline $Fe_{73}Si_{16}B_7Nb_3Cu_1$ Soft Magnetic Sheets

  • Cho, H.J.;Cho, E.K.;Song, Y.S.;Kwon, S.K.;Sohn, K.Y.;Park, W.W.
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.786-787
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    • 2006
  • The magnetic inductance of nanocrystalline $Fe_{73}Si_{16}B_7Nb_3Cu_1$ and an amorphous FeSiB powder sheet has been investigated to identify RFID performance. The powder was mixed with binder and solvent and tape-casted to form films. Results show annealing significantly influenced on the inductance of the material. The surface oxidation of the particles was the main reason for the reduced inductance. The maximum inductance of $Fe_{73}Si_{16}B_7Nb_3Cu_1$ alloy was about $88{\mu}H$ at 17.4 MHz, about 65% greater compared to the FeSiB alloy. The higher inductance in the nanocrystalline alloy indicates it may be used as a potential replacement of current RFID materials.

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Thermal Stability of the Cu/Co-Nb Multilayer Silicide Structure (Cu와 Co-Nb 이중층 실리사이드 계면의 열적안정성)

  • Lee, Jong-Mu;Gwon, Yeong-Jae;Kim, Yeong-Uk;Lee, Su-Cheon
    • Korean Journal of Materials Research
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    • v.7 no.7
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    • pp.587-591
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    • 1997
  • RBS와 XRD를 이용하여 C o-Nb이중층 실리사이드와 구리 배선층간의 열적안정성에 관하여 조사하였다. Cu$_{3}$Si등의 구리 실리사이드는 열처리시 40$0^{\circ}C$정도에서 처음 형성되기 시작하였는데, 이 때 형성되는 구리 실리사이드는 기판의 상부에 존재하던 준안정한 CoSi의 분해시에 발생한 Si원자와의 반응에 의한 것이다. 한편, $600^{\circ}C$에서의 열처리 후에는 CoSi$_{2}$층을 확산.통과한 Cu원자와 기판 Si와의 반응에 의하여 CoSi$_{2}$/Si계면에도 구리 실리사이드가 성장하였는데, 이렇게 구리 실리사이드가 CoSi$_{2}$/Si 계면에 형성되는 것은 Cu원자의 확산속도가 여러 중간층에서 Si 원자의 확산속도 보다 더 빠르기 때문이다. 열처리 결과 최종적으로 얻어진 층구조는 CuNbO$_{3}$/Cu$_{3}$Si/Co-Nb합금층/Nb$_{2}$O$_{5}$CoSi$_{2}$/Cu$_{3}$Si/Si이었다. 여기서 상부에 형성된 CuNbO$_{3}$는 Cu원자가 Nb$_{2}$O$_{5}$및 Co-Nb합금층과 반응하여 기지조직의 입계에 석출되어 형성된 것이다.

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Strained-SiGe Complementary MOSFETs Adopting Different Thicknesses of Silicon Cap Layers for Low Power and High Performance Applications

  • Mheen, Bong-Ki;Song, Young-Joo;Kang, Jin-Young;Hong, Song-Cheol
    • ETRI Journal
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    • v.27 no.4
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    • pp.439-445
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    • 2005
  • We introduce a strained-SiGe technology adopting different thicknesses of Si cap layers towards low power and high performance CMOS applications. By simply adopting 3 and 7 nm thick Si-cap layers in n-channel and p-channel MOSFETs, respectively, the transconductances and driving currents of both devices were enhanced by 7 to 37% and 6 to 72%. These improvements seemed responsible for the formation of a lightly doped retrograde high-electron-mobility Si surface channel in nMOSFETs and a compressively strained high-hole-mobility $Si_{0.8}Ge_{0.2}$ buried channel in pMOSFETs. In addition, the nMOSFET exhibited greatly reduced subthreshold swing values (that is, reduced standby power consumption), and the pMOSFET revealed greatly suppressed 1/f noise and gate-leakage levels. Unlike the conventional strained-Si CMOS employing a relatively thick (typically > 2 ${\mu}m$) $Si_xGe_{1-x}$ relaxed buffer layer, the strained-SiGe CMOS with a very thin (20 nm) $Si_{0.8}Ge_{0.2}$ layer in this study showed a negligible self-heating problem. Consequently, the proposed strained-SiGe CMOS design structure should be a good candidate for low power and high performance digital/analog applications.

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Fabrication and Characteristics of a-Si : H Photodiodes for Image Sensor (영상센서를 위한 a-Si : H 광다이오드의 제작 및 특성)

  • Park, Wug-Dong;Kim, Ki-Wan
    • Journal of Sensor Science and Technology
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    • v.2 no.1
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    • pp.29-34
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    • 1993
  • a-Si : H photodiodes for image sensor have been fabricated and characterized. Photosensitivity of a ITO/a-Si : H/Al photodiode without blocking layer was 0.7 under the applied voltage of 5 V and peak spectral sensitivity in visible region was found at 620 nm. Dark current of ITO/a-SiN : H/a-Si : H/p-a-Si : H/Al photodiode was suppressed by hole blocking layer and electron blocking layer at the value of lower than 1.5 pA to the applied voltage of 10 V. Also maximum photosensitivity was about 1 under the applied voltage of 3 V and peak spectral sensitivity was found at 540 nm.

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Tribological behavior of multi-layered diamond-like carbon films (다층 다이아몬드상 카본 필름의 윤활 및 마모 거동)

  • 김명근;이광렬;은광용
    • Journal of the Korean Vacuum Society
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    • v.7 no.1
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    • pp.59-65
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    • 1998
  • Multi-layer diamond-like carbon (DLC) films were deposited by 13.56 MHz r.f. PACVD method. Multi-layer DLC film was composed of 2.5 $mu extrm{m}$ thick pure DLC filml and 0.2$\mu\textrm{m}$ thick Si incorporated DLC (Si-DLC) film as a surface layer. Tribological behaviors of the multi-layer DLC film were investigated with a ball-on-disk type tribometer in ambient atmosphere using AISI 52100 steel ball. Low friction coefficient (<0.1) period increased with increasing the Si content in the surface Si-DLC film. The wear rate after 44,000 cycles and 158,400 cycles were the $2.5\times10^{-8}\sim1.8\times10^{-7}\textrm{mm}^3$/rev. and $7.1\times10^{-9}\sim1.8\times10^{-8}\textrm{mm}^3$/rev.,respectively. The wear rate of the multi-layer DLC film after 158,400 cycles was about 2 times smaller than that of pure DLC films of 2.7 $\mu\textrm{m}$ thickness. This high wear resistance and low friction coefficient was caused by the formation of Si oxide layer on the wear scar surface, as confirmed by the debris composition analysis. It was further shown that this si oxide debris layer on the wear scar surface is formed again even after removing the debris of the steel ball, which maintain the low friction coefficient between multi-layer DLC films and steel ball.

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Deposition and Characterization of $HfO_2/SiNx$ Stack-Gate Dielectrics Using MOCVD (MOCVD를 이용한 $HfO_2/SiNx$ 게이트 절연막의 증착 및 물성)

  • Lee Taeho;Oh Jaemin;Ahn Jinho
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.2 s.31
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    • pp.29-35
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    • 2004
  • Hafnium-oxide gate dielectric films deposited by a metal organic chemical vapor deposition technique on a $N_2-plasma$ treated SiNx and a hydrogen-terminated Si substrate have been investigated. In the case of $HfO_2$ film deposited on a hydrogen-terminated Si substrate, suppressed crystallization with effective carbon impurity reduction was obtained at $450^{\circ}C$. X-ray photoelectron spectroscopy indicated that the interface layer was Hf-silicate rather than phase separated Hf-silicide and silicon oxide structure. Capacitance-voltage measurements show equivalent oxide thickness of about 2.6nm for a 5.0 nm $HfO_2/Si$ single layer capacitor and of about 2.7 nm for a 5.7 nm $HfO_2/SiNx/Si$ stack capacitor. TEM shows that the interface of the stack capacitor is stable up to $900^{\circ}C$ for 30 sec.

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Effect of Fe, Mn Content on the Castability in Al-9wt%Si-Mg System Alloys for High Elongation (고신율 금형주조용 Al-9wt%Si-Mg계 합금의 주조특성에 미치는 Fe, Mn함량의 영향)

  • Kim, Heon-Joo;Jeong, Chang-Yeol
    • Journal of Korea Foundry Society
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    • v.33 no.6
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    • pp.233-241
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    • 2013
  • Effect of Fe and Mn contents on the castability of Al-9wt%Si-xMg-yFe-zMn alloy has been studied. The alloy was composed of ${\alpha}$-Al phase, Al+eutectic Si phase, ${\beta}$-Al5FeSi compound and chinese script ${\alpha}$-$Al_{15}(Mn,Fe)_3Si_2$ compound. ${\beta}$-$Al_5FeSi$ and ${\alpha}$-$Al_{15}(Mn,Fe)_3Si_2$ compounds assumed to effect the fluidity and shrinkage behaviors of the alloy during solidification due to the crystallization of ${\alpha}$-$Al_{15}(Fe,Mn)_3Si_2$ and ${\beta}$-$Al_5FeSi$ compounds above eutectic temperature. As Fe and Mn contents of Al-9wt%Si-0.3wt%Mg system alloy increased from 0.15wt% to 0.6wt% and from 0.3wt% to 0.7wt%, fluidity of the alloy decreased by 5.7% and 3.3%, respectively. And as Mg content of Al-9wt%Si-0.45wt%Fe-0.5wt%Mn system alloy increased from 0.3wt% to 0.4wt%, fluidity of the alloy decreased by 8.6%. When Fe content of the alloy increased from 0.15wt% to 0.6wt%, macro shrinkage ratio decreased from 6.1% to 4.1%, and micro shrinkage ratio increased from 0.04% to 0.24%. Similarly, Mn content of the alloy increased from 0.3wt% to 0.7wt%, macro shrinkage ratio decreased from 6.0% to 4.5% and micro shrinkage ratio increased from 0.12% to 0.18%. Judging from the castability of the alloy, Al-9wt%Si-0.3wt%Mg alloy with low content of Fe and Mn, 0.1wt% Fe and 0.3wt% Mn, is recommendable.

A Study on Stress Incontinence in Women in Korea (여성의 긴장성 요실금에 관한 연구)

  • Lee, Young-Sook
    • 모자간호학회지
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    • v.4 no.1
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    • pp.12-23
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    • 1994
  • This study was done to determine the situations of stress incontinence(SI) and the differences in general characteristics, obstetrical history and SI related variables between women with stress incontinence and normal women. The design for study was a descriptive study. The number of subjects consisted of 156 women who were selected by systematic random sampling in Kwangju city. Data collection was done with the modified Hendrickson's Stress Incontinence Scale(1981) which was analyzed using frequency and percentiles. The results were as follows : 1. The stress incontinence (SI) rate of the sample was 64.1% and the majority of the women(40.9%) had experienced SI for a period of five years(the mean period was 2.7 years) without any treatment or care(83.0%). The amount of SI was from one drop(40.0%) to one teaspoon(16.7%) daily. 2. Items on the SI scale had the scores ranging from 4 to 44 with a mean score of 13.7 which showed mild SI. 3. The priority of provocative factors for SI were abdominal tightening(83%), coughing(58%), laughing(52%), sneezing(40%), steeping(18%), sudden standing(17%), nose blowing(13%), heavy exercise(11%), rapid walking up-stairs(10%) and excitment (9%) in that order. 4. There were no significant differences in age, education, spouse, job and income between the women with SI and the normal women. 5. There were no significant differences in the age at the last delivery, age of last baby. number of vaginal, or cesarean deliveries, or abdominal operations between the women with SI and the normal women. It can be concluded that SI in women has a high incidence nth various provocative factors but it is relatively mild SI on a daily basis and generally there has been no treatment. It is suggested that a descriptive study of emotional problems and precipitating variables in SI women will increase the knowledge of SI.

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Magnetoresistance Effects of Magnetic Tunnel Junctions with Amorphous CoFeSiB Single and Synthetic Antiferromagnet Free Layers (비정질 CoFeSiB 단일 및 합성형 반강자성 자유층을 갖는 자기터널접합의 자기저항 효과)

  • Hwang, J.Y.;Kim, S.S.;Rhee, J.R.
    • Journal of the Korean Magnetics Society
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    • v.15 no.6
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    • pp.315-319
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    • 2005
  • To obtain low switching field ($H_{SW}$) we introduced amorphous ferromagnetic $Co_{70.5}Fe_{4,5}Si_{15}B_{10}$ single and synthetic antiferromagnet (SAF) free layers in magnetic tunnel junctions (MTJs). The switching characteristics for MTJs with structures $Si/SiO_2/Ta$ 45/Ru 9.5/IrMn 10/CoFe 7/AlOx/CoFeSiB 7 or CoFeSiB (t)/Ru 1.0/CoFeSiB (7-t)/Ru 60 (in nm) were investigated and compared to MTJs with $Co_{75}Fe_{25}$ and $Ni_{80}Fe_{20}$ free layers. CoFeSiB showed a lower saturation magnetization of $560 emu/cm^3$ and a higher anisotropy constant of $2800\;erg/cm^3$ than CoFe and NiFe, respectively. An exchange coupling energy ($J_{ex}$) of $-0.003erg/cm^2$ was observed by inserting a 1.0 nm Ru layer in between CoFeSiB layers. In the CoFeSiB single and SAF free layer MTJs, it was frond that the size dependence of the $H_{SW}$ originated from the lower $J_{ex}$ experimentally and by micromagnetic simulation based on the Landau-Lisfschitz-Gilbert equation. The CoFeSiB SAF structures showed lower $H_{SW}$ than that of NiFe, CoFe and CoFeSiB single structures. The CoFeSiB SAF structures were proved to be beneficial far the switching characteristics such as reducing the coercivity and increasing the sensitivity in micrometer to submicrometer-sized elements.

Effects of In-situ doping Concentration on the Characteristics of Porous 3C-SiC Thin Films (In-situ 도핑량이 다공성 3C-SiC 박막의 특성에 미치는 영향)

  • Kim, Kang-San;Chung, Gwiy-Sang
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.6
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    • pp.487-490
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    • 2010
  • This paper describes the elecrtical and optical characteristics of $N_2$ doped porous 3C-SiC films. Polycrystalline 3C-SiC thin films are anodized by $HF+C_2H_5OH$ solution with UV-LED exposure. The growth of in-situ doped 3C-SiC thin films on p-type Si (100) wafers is carried out by using APCVD (atmospheric pressure chemical vapor deposition) with a single-precursor of HMDS (hexamethyildisilane: $Si_2(CH_3)_6)$. 0 ~ 40 sccm $N_2$ was used for doping. After the growth of doped 3C-SiC, porous 3C-SiC is formed by anodization with $7.1\;mA/cm^2$ current density for anodization time of 60 sec. The average pore diameter is about 30 nm, and etched area is increased with $N_2$ doping rate. These results are attributed to the decrease of crystallinity by $N_2$ doping. Mobility is dramatically decreased in porous 3C-SiC. The band gaps of polycrystalline 3C-SiC films and doped porous 3C-SiC are 2.5 eV and 2.7 eV, respectively.