• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1715-1718
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• 2007

New ITO thin film of good performance has been developed by brand-new, plasma-damage-free sputtering process at the room temperature. The room temperature-processed ITO films with optimized conditions as neutral beam acceleration bias of -30V and In & Sn composition ratio of 99:01 gives lower resistivity as $4.22{\times}10^{-4}{\Omega}-cm$ and higher transmittance over 90% a wavelength of 550 nm. The transmission electron microscope (TEM) images of the films show a nano-crystalline structure.

• Journal of Mechanical Science and Technology
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• v.16 no.8
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• pp.1064-1071
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• 2002

Stainless steel pipe of type 304 the with a wall thickness of 26.9 mm and the outer diameter 406.4 mm is welded by manual arc welding process. Mechanical properties and fracture toughness of type 304 stainless steel are investigated in the temperature ranging from room temperature to -162$^{\circ}C$ The results obtained are summarized as follows. The tensile strength noticeably increases as the temperature becomes lower while the yield strength is relatively insensitive to temperature. The Charpy impact energy and CTOD values become higher in the case that crack propagation direction is aligned to the transverse axis upon the rolling direction than longitudinal direction. The drop of fracture toughness is associated with the noticeable diminution of plastic component as temperature seduces from room temperature to -162$^{\circ}C$ .

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2002.10a
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• pp.347-353
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• 2002

The compressive residual stress, which is induced by shot peening process, seems to be an important factor of increasing the fatigue strength. And then it was showed that residual stress was disappearenced at the high temperature. The fatigue characteristic study of a SUP9 spring steel processed shot peening is performed by considering the high temperature service conditions in the range of room temperature through $180^{\circ}C$ in the range of stress ratio of 0.3 by means of opening mode displacement. The fatigue resistance characteristics and fracture strength at high temperature is considerable lower than that of room temperature in the early stage and stable of fatigue crack growth region.

• Elastomers and Composites
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• v.50 no.1
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• pp.30-34
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• 2015

Thermo-mechanical treatment process of a compressed open-cell rigid polyurethane foam (OC-RPUF), which was fabricated for the vacuum insulation panel (VIP), was studied to obtain an optimum condition for the dimensional stability by the relaxation of compressive stress. Thermo-mechanical deformation of the sample OC-RPUF was shown to occur from about $120^{\circ}C$. Yield stress of 0.36 MPa was shown at about 10% yield strain. And, densification of the foam started to occur from 75% compressive strain and could be continued up to max. 90%. Compression set of the sample restored after initial compression to 90% at room temperature was ca. 82%. Though the expansion occurred to about twice of the originally compressed thickness in case of temperature rise to $130^{\circ}C$, it could be overcome and the dimensional stability could be maintained if the constant load of 0.3 MPa was applied. As the result, a thermo-mechanical treatment process, i.e, annealing process at temperature of $130{\sim}140^{\circ}C$ for about 20 min as is the maximum compressed state at room temperature, should be required for dimensional stability as an optimum condition for the use of VIP core material.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Journal of the Korean Institute of Gas
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• v.25 no.6
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• pp.35-44
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• 2021

The PR (Photo Resist) process in the semiconductor process is a process that uses a mixture of flammable substances. Due to the process equipment is installed in a clean room and when flammable substances leak, there is a high risk of suffocation, fire, and explosion. It is necessary to analyze the impact of accidents that may occur during operation and to evaluate whether the safety of workers can be guaranteed. In this study, the value of radiant heat and temperature change at the monitor point set up virtual inside the clean room was confirmed through CFD simulation of 10 leak and fire scenarios using the FLACS CFD - Fire Module. A fire that occurs inside a clean room transfers high radiant heat to the inter-story structure, but its scope is quite limited, and it is unlikely that it will collapse in a single fire accident. There was no scenario in which two stairs leading to the exit were exposed to high radiant heat at the same time due to a fire accident, therefore workers were able to escape in case of a fire. In addition, it was confirmed that the level of radiant heat and temperature rise rapidly decreased as they moved downstairs. According to the API 520 standard, workers exposed to 6.31 kW/m² of radiant heat that workers can withstand for 30 seconds were confirmed that it was possible to sufficiently escape from the inside.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.46-49
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• 2008

Drawing process of the high carbon steel wire with high speed is usually performed at room temperature using multi pass. Tn the multi pass drawing, temperature rise affects the mechanical properties of the final product. The excessive temperature rise during the deformation promotes the occurrence of delamination, and deteriorates the torsion property and durability of wire. This paper investigates the occurrence of delamination in the wire through the torsion test and the evaluation of wire temperature. The excessive wire temperature ieads to the occurrence of delamination. Based on the calculation of the wire temperature, a new pass schedule, that can prevent the delamination due to the excessive wire temperature rise, is designed through the isothermal pass schedule.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.332-336
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• 2007

Temperature is an essential process variable in nanoimprint lithography(NIL) where the temperature varies between room temperature and above the glass transition temperature. To simulate NIL process, we employ both the Nose-Poincare method for temperature controlled molecular dynamics(MD) and force field for polymer material i.e. polymethyl methacrylate(PMMA), which is most widely selected as NIL resist. Nose-Poincare method, which convinces the conservation of Hamiltonian structure and time-reversal symmetry, overcomes the drawbacks inherent in the conventional methods such as Nose thermostat and Nose-Hoover thermostat. Thus, this method exhibits enhanced numerical stability even when the temperature fluctuation is large. To describe PMMA, we adopt the force field which account for bond stretch, bending, torsion, inversion, partial charge, and van der Waals energy.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.401-405
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• 2007

Due to the low densities and high specific strength and stiffness, magnesium alloy sheets are very attractive lightweight materials for automotive and electrical products. However, the magnesium alloy sheets should be usually formed at elevated temperature because of their poor formability at room temperature. For the use of the magnesium alloy sheets for an industrial, their mechanical properties at elevated temperature and appropriate forming process conditions have to be developed. In this study, non-isothermal simulation of a square cup drawing of magnesium alloy sheets have been conducted to evaluate a proper forming process conditions such as the tool temperature, the tool shoulder radius, friction between the blank and the tools. According to this study, appropriate forming process conditions of square cup drawing at elevated temperature from magnesium alloy sheets are suggested.

• Transactions on Electrical and Electronic Materials
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• v.16 no.4
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• pp.187-189
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• 2015

A charge-trap flash (CTF) thin film transistor (TFT) memory is proposed at a low-temperature process (≤ 450℃). The memory cell consists of a sputtered oxide-nitride-oxide (ONO) gate dielectric and Schottky barrier (SB) source/drain (S/D) junctions using nickel silicide. These components enable the ultra-low-temperature process to be successfully achieved with the ONO gate stacks that have a substrate temperature of room temperature and S/D junctions that have an annealing temperature of 200℃. The silicidation process was optimized by measuring the electrical characteristics of the Ni-silicided Schottky diodes. As a result, the Ion/Ioff current ratio is about 1.4×10⁵ and the subthreshold swing and field effect mobility are 0.42 V/dec and 14 cm²/V·s at a drain voltage of −1 V, respectively.