• Journal of the Semiconductor & Display Technology
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• v.10 no.2
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• pp.65-71
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• 2011

Properties of each layer in DSSC were investigated to improve solar cell characterstics. Also in this study, low costsolar simulator system is fabricated and used. Efficiency of DSSC is better in the case of thinner semiconductive layer, because thick semiconductive layer is acted as resistor. Sc-doped ZnO thin films showed better electrical property by proper donor doping effect. Among the dyes, DSSC containing N719 showed higher efficiency, because N719 have smaller electron affinity and shallow band gap.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.272-275
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• 2000

We investigated a resistive superconducting fault current limiter (SFCL) fabricated using YBCO thin films on 2-inch diameter sapphire substrates. Nearly identical SFCL units were prepared and tested. The units were connected in series and parallel to increase the current and voltage ratings. A serial connection of the units showed significantly unbalanced power dissipation between the units. This imbalance was removed by introducing a shunt resistor to the firstly quenched unit. Parallel connection of the units increased the current rating. An SFCL module of 4 units in parallel, each of which has minimum quench current 25 Ap, was produced and successfully tested at a 220 V circuit. From the resistance increase, we estimated that the film temperature increases to 200 K in 5 msec, and 300 K in 120 msec. Successive quenches revealed that this system is stable without degradation in the current limiting capability under such thermal shocks as quenches at 220 V.

• Proceedings of the KIEE Conference
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• 2000.07b
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• pp.663-665
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• 2000

We fabricated resistive superconducting fault current limiters (SFCL) based on YBCO thin films grown on 2-inch diameter saphire substrates Two SFCLs with nearly identical properties were connected in series to investigate the simultaneous quench. There was a slight difference in the rate of voltage increase between two SFCL units when they were operated independently. This difference. however, resulted in significantly unbalanced power dissipation between the units. This imbalance was removed by connecting a shunt resistor to an SFCL in parallel. The appropriate values of the shunt resistances were $80{\Omega}$ at $75 V_{rms}$. $100{\Omega}$ at $100 V_{rms}$ and $110{\Omega}$ at $120 V_{rms}$, respectively. Increased power input at high voltages also reduced the initial imbalance in power dissipation. but with increase in film temperature to higher than 200 K.

• Journal of Sensor Science and Technology
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• v.11 no.6
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• pp.358-364
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• 2002

In this paper, we used U.V.(wavelength, 355nm) laser for adjusting Pt thin films temperature sensor to $100{\Omega}$ at $0^{\circ}C$. Internationally, A-class tolerance of temperature sensor is $0.06{\Omega}$ at $0^{\circ}C$. This is under value of $0.15^{\circ}C$, actually, so high-fine trimming technology is essential to this process. The width of trimmed lines was about $10{\mu}m$ and the best trimming of Pt thin films of $1{\sim}1.5{\mu}m$ was carried out with power : 35mW, rep. rate frequency : 200Hz and bite size : $1.5{\mu}m$. And using photolithography process, 96 resistors were fabricated in $2"{\times}2"$ substrate as the proportion of $79{\sim}90{\Omega}$ and $91{\sim}102{\Omega}$ is 42.7% and 57.3%, respectively. As result of trimming resistors to the target value of $109.73{\Omega}$ at $25^{\circ}C$, 82.3% of resistors had the tolerance within ${\pm}0.30{\Omega}$ and the others(17.7%) were within ${\pm}0.06{\Omega}$ of A-class tolerance.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.7
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• pp.1393-1398
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• 2009

Conventionally, etching is first considered for microelectronics fabrication process and is specially important in process of a-Si:H thin film transistor for LCD. In this paper, we stabilize properties of device by development of wet and dry etching process. The a-Si:H TFTs of this paper is inverted staggered type. The gate electrode is lower part. The gate electrode is formed by patterning with length of 8 ${\mu}$m${\sim}$16 ${\mu}$m and width of 80${\sim}$200 ${\mu}$m after depositing with gate electrode (Cr) 1500 ${\AA}$under coming 7059 glass substrate. We have fabricated a-SiN:H, conductor, etch-stopper and photo resistor on gate electrode in sequence, respectively. The thickness of these thin films is formed with a-SiN:H (2000 ${\mu}$m), a-Si:H(2000 ${\mu}$m) and n+a-Si:H (500 ${\mu}$m), We have deposited n-a-Si:H, NPR(Negative Photo Resister) layer after forming pattern of Cr gate electrode by etch-stopper pattern. The NPR layer by inverting pattern of upper gate electrode is patterned and the n+a-Si:H layer is etched by the NPR pattern. The NPR layer is removed. After Cr layer is deposited and patterned, the source-drain electrode is formed. In the fabricated TFT, the most frequent problems are over and under etching in etching process. We were able to improve properties of device by strict criterion on wet, dry etching and cleaning process.

• KIEE International Transactions on Electrophysics and Applications
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• v.11C no.3
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• pp.70-74
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• 2001

Admittance or impedance spectroscopy is one of the powerful tools to study dielectric relaxation and loss processes in organic and inorganic materials. In this study, the frequency dependent properties of an indium tin oxide/tris(8-hydroxyquinoline) aluminum($Alq_3$)/aluminum structure have been studied. The conductance of the $Alq_3$ film increases with the DC applied voltage up to 4V and decreases above 4V in the low frequency region. This indicates that the resistance of the device decreases with the applied bias due to the carrier injection enhancement, thereafter the injected carriers form the space charge and the additional injection of carriers is prevented. The Cole-Cole plot of the admittance takes a one-semicircle shape, which means that the device can be modeled as a parallel resistor-capacitor network. The resistance and capacitance were estimated as 8.62k${\Omega}$ and 2.7nF, respectively, at 3V in the low frequency region. The dielectric constant ( ${\epsilon}'$ ) of the $Alq_3$ film is independent of the frequency in the low frequency region below 100kHz, while the frequency dependency was observed at above 100kHz. The dielectric loss factor ( ${\epsilon}"$ ) of the $Alq_3$ film shows the dielectric dispersion below 100kHz and dielectric absorption in higher frequency domain. The dispersion is thought to be related to the hopping process of the carriers. The ${\epsilon}"$ is proportional to the reciprocal of the frequency. The dielectric relaxation time was extracted to about 0.318${\mu}s$ from the dielectric absorption spectrum.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.243-244
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• 2006

As an preliminary study for the quench protection of high temperature superconducting (HTS) cable using superconducting fault current limiter (SFCL), experimental research was carried out. The test circuit was composed of Bi-2223/Ag HTS tape and a SFCL made of YBCO thin films. In the normal state, the applied current of 56 A, which was critical current of HTS tape, could be flown through the circuit without resistive loss. Increasing the currents, the quench development of both materials was investigated from the voltage signal acquired from the resistance of the quenched superconductor. Up to around 10 times of the critical current was applied to the HTS tape and the current limiting characteristics of SFCL were investigated. In addition, for the finding out the optimal operating condition of SFCL such as the numbers of elements, a shunt resistor was applied to the SFCL and quench characteristics were analyzed as well.