• Geophysics and Geophysical Exploration
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• v.4 no.4
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• pp.110-114
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• 2001

In order to obtain the geological information of the shallow subsurface and the characteristics of resistivity curves to the lateral extent of the gold bearing gravel layer underlaid by a thick layer, electrical resistivity surveys had been carried out in the northern area of Takaoi village, Kalimantan, Indonesia from September 30th to October 27th in 1999. The Dipole-Dipole (Dp-Dp) resistivity survey was carried out with a electrode spacing of A=3m, 5m and electrode separation index n=10, and the vertical electrical sounding (VES) of the Schlumberger type was performed at 6 sites. The interpretation of the Dp-Dp data and VES curves by computer modeling indicates 5 classified layers as the horizontal structure. And the characteristics of VES curves shows us KH type.

• Fire Science and Engineering
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• v.16 no.4
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• pp.15-19
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• 2002

This dissertation is about the development of $BaTiO_3$-type PTC(Positive Temperature Coefficient) thermistor by composition method. A multilayer-type PTC samples were fabricated under optimal conditions after setting the experimental composition equation as ($Ba_{0.95-x}$S $r_{0.05}$$Ca_{x}$ )$TiO_3$-$0.01TiO_2$-$0.01SiO_2$-$\alpha$$MnCO_3$-$\beta$N $b_2$ $O_{5}$.) and their testing results were analyzed. The optimal sin-tering and cooling temperatures were 13$50^{\circ}C$ for two hours and $100^{\circ}C$/h for an hour, respectively; By composing Ca and Mn, dopants to lower the resistivity at room temperature, and Nb, a dopant to raise peak resistivity(Ca:5 mol%, Mn:0.08 mol%, Nb:0.18 mol%), appropriately, a PTC thermistor, having the characteristics of relatively low resistivity at room temperature and high peak resistivity and a good temperature coefficient, has been developed. And we find that it is possible of application for fire detection sensor.r.r.

• Geophysics and Geophysical Exploration
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• v.7 no.4
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• pp.217-224
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• 2004

Self-potential and electrical resistivity methods were conducted for locating the auriferous mineralized zone, called Jija Vein, of Sambo mine, Limsu-ri, Haeje-myeon, Muahn-gun, Jeollanam-do. The host rocks of the mineralization include gneiss, rhyolite and felsic dyke. Ore vein is mainly fissured-filling type and sulfide minerals, such as pyrite, are disseminated in country rock. By the electrical responses from SP and surface resistivity methods., the mineralized zone is supposed to extend about 360 m directed N5W with the width of 20 m to 30 m. From resistivity tomograms using inclined borehole to surface, the ore body shape is interpreted as the width of 20 m in depth 40 m to 50 m.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.9
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• pp.1381-1387
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• 1989

For the fabrication of ohmic contact to p-type GaAs, In Liquid Metal Ions were implanted into p-type GaAs (Zn:1.5x10**19/cm**3). After the samples were processed by Infrared rapid thermal annealing (IRTA0 or Furance Annealing (FA), I-V and specific contact contact resistivity were measured. Specific contact resistivity was found to be 1.7x10**-5 \ulcorner-cm\ulcornerin IRTA 750\ulcorner, 10 sec annealed sample. The surface characteristics of the samples were investigated with SEM, RHEED, AES. From these results we can know that implanted In ions were formed mixing layer of InAs at the surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.13-16
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• 2000

(PbS)$_{1-x}$ -(CuS)$_{x}$ thin films(x=0, 0.5, 1) were grown on glass substrates by using a chemical bath deposition method. The molecular ratio of Pb to Cu for the PbS-CuS thin films(x=0.5) was measured about 7:3 by using EDX and XRF. The resistivity of non-annealed (PbS)$_{1-x}$ -(CuS)$_{x}$ thin films was about 10 $\Omega$ . cm. However, after annealing, the resistivity of PbS showed a little change, while PbS-CuS and CuS significantly decreased in the range of 0.002 to 0.005$\Omega$.cm. PbS was p-type and CuS was n-type.-type.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.1
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• pp.23-27
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• 2003

Structural properties of Cu-Ni alloy films, such as preferred orientation, crystallite size, in-ter-planar spacing, cross-sectional morphology, and electrical resistivity, are investigated in terms of tar-get configurations that are used in the film deposition by means of magnetron co-sputtering. Two different target configurations are considered in this study: a dual-type configuration in which two separate tar-gets (Cu and Ni) and different bias types (RF and DC) are used and a Ni-on-Cu type configuration in which Ni chips are attached to a Cu target. The dual-type configuration appears to have some advantages over the Ni-on-Cu type regarding the accurate control of atomic composition of the deposited Cu-Ni alloy. However, the dual-type-produced film exhibits a porous and columnar structure, the relatively large internal stress, and the high electrical resistivity, which are mainly due to the relatively low mobility of adatoms. The affects of thermal treatment and deposition conditions on the structural and electrical properties of dual-type Cu-Ni films are also discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.521-524
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• 2001

In this letter. we report on the investigation of Ti. Pt/Si/Ti Ohmic contacts to p-type 4H-SiC. The contacts were formed by a 2-step vacuum annealing at $500^{\circ}C$ for 1h. $950^{\circ}C$ for 10 min respectively. The contact resistances were measured using the transmission line model method. which resulted in specific contact resistivities in the $3.5{\times}10^{-3}$ and $6.2{\times}10^{-4}ohm/cm^{2}$, and the physical properties of the contacts were examined using x-ray diffraction. microscopy. AES(auger electron spectroscopy). AES analysis has shown that, at this anneal temperature, there was a intermixing of the Ti and Si. migration of into SiC. Overlayer of Pt had the effect of decreasing the specific contact resistivity and improving the surface morphology of the annealed contact.

• Journal of the Korean Ceramic Society
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• v.37 no.4
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• pp.345-353
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• 2000

Carbon nanofibers were prepared from the decomposition of various carbon-containing gases over pure Ni, pure Fe and their alloys with Cu. They yields, properties, and structure of carbon nanofibers obtained from the various reaction conditions were analyzed. Type of reacting gas, reaction temperature and catalyst composition were changed as the reaction variable. With Ni-Cu catalysts, the maximum yields of carbon nanofibers were obtained at temperatures between 550 and 650$^{\circ}C$ according to the reacting gas mixtures of C2H2-H2, C2H4-H2 and C3H8-H2, and the surface areas of the carbon nanofibers produced were 20∼350㎡/g. In the case of CO-H2 mixture, the rapid deposition of carbon nanofibers occurred with Fe-Cu catalyst and the maximum yield were obtained around 550$^{\circ}C$ with the range of surface areas of 140∼170㎡/g. The electrical resistivity of carbon nanofiber regarded as the key property of filler for the application of electromagnetic interference shielding was very sensitive to the type of reactant gas and the catalyst composition ranging 0.07∼1.5Ωcm at a pressure of 10000 psi, and the resistivity of carbon nanofibers produced over pure nickel catalyst were lower than those over alloy catalysts. SEM observation showed that the carbon nanofibers produced had the diameters ranging 20∼300 nm and the straight structure of carbon nanofibers changed into the twisted or helical conformation by the variation of reacting gas and catalyst composition.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.521-524
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• 2001

In this letter, we report on the investigation of Ti, Pt/Si/Ti Ohmic contacts to p-type 4H-SiC. The contacts were formed by a 2-step vacuum annealing at 500$^{\circ}C$ for 1h, 950$^{\circ}C$ for 10 min respectively. The contact resistances were measured using the transmission line model method, which resulted in specific contact resistivities in the 3.5x10$\^$-3/ and 6.2x10$\^$-4/ ohm/$\textrm{cm}^2$, and the physical properties of the contacts were examined using x-ray diffraction, microscopy, AES(auger electron spectroscopy). AES analysis has shown that, at this anneal temperature, there was a intermixing of the Ti and Si, migration of into SiC. Overlayer of Pt had the effect of decreasing the specific contact resistivity and improving the surface morphology of the annealed contact.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.248-248
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• 2010

CMOS 축소화가 32nm node를 넘어서 지속적으로 진행되기 위하여 FinFET, Surround Gate and Tri-Gate와 같은 Fully Depleted 3-Dimensional 소자들이 SCE를 다루기 위해서 많이 제안되어 왔다. 하지만 소자의 축소화를 진행함에 있어서 좁고 균일한 patterning을 형성하는 것과 동시에 낮은 Extension Region과 Contact Region에서의 Series Resistance을 제공하여야 하고 Source/Drain Contact Formation을 확보하여야 한다. 그리고 소자의 축소화가 진행됨으로써 Silicide의 응집현상과 Source/Drain Junction의 누설전류에 대한 허용범위가 점점 엄격해지고 있다. ITRS 2005에 따르면 32nm CMOS에서는 Contact Resistivity가 대략 $2{\times}10-8{\Omega}cm2$이 요구되고 있다. 또한 Three Dimensional 소자에서는 Fin Corner Effect가 Channel Region뿐만 아니라 S/D Region에서도 중대한 영향을 미치게 된다. 따라서 본 논문에서 제시하는 Novel S/D Contact Formation 기술을 이용하여 Self-Aligned Dual/Single Metal Contact을 이루어Patterning에 대한 문제점 해결과 축소화에 따라 증가하는 Contact Resistivity 문제점을 해결책을 제시하고자 한다. 이를 검증하기3D MOSFET제작하고 본 기술을 적용하고 검증한다. 또한 Normal Doping 구조를 가진3D MOSFET뿐만 아니라 SCE를 해결하기 위해서 대안으로 제시되고 있는 SB-MOSFET을 3D 구조로 제작하고, 이 기술을 적용하여 검증한다. 그리고 Silvaco simulation tool을 이용하여 S/D에 Metal이 Contact을 이루는 구조가 Double type과 Triple type에 따라 Contact Resistivity에 미치는 영향을 미리 확인하였고 이를 실험으로 검증하여 소자의 축소화에 따라 대두되는 문제점들의 해결책을 제시하고자 한다.