• Title/Summary/Keyword: Residual stress measurement

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Residual Stress and Elastic Modulus of Y2O3 Coating Deposited by EB-PVD and its Effects on Surface Crack Formation

  • Kim, Dae-Min;Han, Yoon-Soo;Kim, Seongwon;Oh, Yoon-Suk;Lim, Dae-Soon;Kim, Hyung-Tae;Lee, Sung-Min
    • Journal of the Korean Ceramic Society
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    • v.52 no.6
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    • pp.410-416
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    • 2015
  • Recently, a new $Y_2O_3$ coating deposited using the EB-PVD method has been developed for erosion resistant applications in fluorocarbon plasma environments. In this study, surface crack formation in the $Y_2O_3$ coating has been analyzed in terms of residual stress and elastic modulus. The coating, deposited on silicon substrate at temperatures higher than $600^{\circ}C$, showed itself to be sound, without surface cracks. When the residual stress of the coating was measured using the Stoney formula, it was found to be considerably lower than the value calculated using the elastic modulus and thermal expansion coefficient of bulk $Y_2O_3$. In addition, amorphous $SiO_2$ and crystalline $Al_2O_3$ coatings were similarly prepared and their residual stresses were compared to the calculated values. From nano-indentation measurement, the elastic modulus of the $Y_2O_3$ coating in the direction parallel to the coating surface was found to be lower than that in the normal direction. The lower modulus in the parallel direction was confirmed independently using the load-deflection curves of a micro-cantilever made of $Y_2O_3$ coating and from the average residual stress-temperature curve of the coated sample. The elastic modulus in these experiments was around 33 ~ 35 GPa, which is much lower than that of a sintered bulk sample. Thus, this low elastic modulus, which may come from the columnar feather-like structure of the coating, contributed to decreasing the average residual tensile stress. Finally, in terms of toughness and thermal cycling stability, the implications of the lowered elastic modulus are discussed.

Measurement Method of Residual Stresses in Thick Composite Cylinders (두꺼운 복합재 원통의 잔류응력 측정방법)

  • Kim, Jong-Woon;Park, Dong-Chang;Lee, Dai-Gil
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2005.04a
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    • pp.245-248
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    • 2005
  • During manufacturing thick composite cylinders, large thermal residual stresses are developed and induce catastrophic interlaminar failures. Since the residual stresses are dependent on many process parameters, such as temperature distribution during cure, cure shrinkage, winding tension, and migration of fibers, calculation of the residual stresses is very difficult. Therefore a radial-cut method have been used to measure the residual stresses in the composite cylinders. But the conventional radial-cut method needs to know numerous material properties which are not only troublesome to obtain but also vary with change of fiber arrangement during consolidation. In this paper, a new radial-cut method with cut-cylinder-bending test was proposed and the measured residual stresses were compared with calculated thermal residual stresses. It was found that the new radial-cut method which does not need to know any of material properties gave better estimation of residual stresses regardless of radial variation of material properties. Additionally, interlaminar tensile strength could be obtained by the cut-cylinder-bending test.

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A Study on the Measurement of Plastic Zone Depth using TRIZ (창의적 문제해결 이론을 이용한 소성역깊이 측정에 관한 연구)

  • Lee, Dong-Woo;Joo, Won-Sik
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.7 no.1
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    • pp.62-66
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    • 2008
  • Machine parts subjected to fluctuating or cyclic loads induce repeated stresses that often result in failure by fatigue. In such cases, the fatigue failures unfortunately sometimes occur. These may arise from a lack of knowledge with regard to the design, fabrication and operation of the machines or structures. The failure analysis provides valuable information regarding the prevention of similar failures. Furthermore, this information will be useful to improve or to develop new products. Failure stress analysis is classified into X-ray fractography. X-ray fractography has the limited applications because of material crystal size, difficult measurement method, electrolytic polishing precision, and long test time. Therefore, this study proposed the new method to improve the measurement precision of plastic zone depth and test time using TRIZ.

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The Measurement Errors of Elastic Modulus and Hardness due to the Different Indentation Speed (압입속도의 변화에 따른 탄성계수와 경도의 오차 연구)

  • Lee, Kyu-Young;Lee, Chan-Bin;Kim, Soo-In;Lee, Chang-Woo
    • Journal of the Korean Vacuum Society
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    • v.19 no.5
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    • pp.360-364
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    • 2010
  • Most research groups used two analysis methods (spectroscopy and nanotribology) to measure the mechanical properties of nano-materials: NMR (Nuclear Magnetic Resonance), IR (Infrared Spectroscopy), Raman Spectroscopy as the spectroscopy method and AFM (Atomic Force MicroScope), EFM (Electrostatic Force Microscope), KFM (Kelvin Force Microscope), Nanoindenter as the nanotribological one. Among these, the nano-indentation technique particularly has been recognized as a powerful method to measure the elastic modulus and the hardness. However, this technique are prone to considerable measurement errors with pressure conditions during measurement. In this paper, we measured the change of elastic modulus and hardness of an Al single crystal with the change of load, hold, and unload time, respectively. We found that elastic modulus and hardness significantly depend on load, hold, and unload time, etc. As the indent time was shortened, the elastic modulus value decreased while the hardness value increased. In addition, we found that elastic modulus value was more sensitive to indent load, hold, and unload time than the hardness value. We speculate that measurement errors of the elastic modulus and the hardness originate from the residual stress during indenting test. From our results, the elastic modulus was more susceptible to the residual stress than the hardness. Thus, we find that the residual stress should be controlled for the minimum measurement errors during the indenting test.

Development of Image Processing Technique for Photoelastic Fringe Analysis (광탄성 프린지해석을 위한 영상처리기법 개발)

  • 백태현;이재춘
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.10
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    • pp.2577-2584
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    • 1994
  • A method of digital image processing thechnique, which can multiply and sharpen isochromatic fringes in photoelasticity on both occasions, is developed. To test the method, photoelastic fringe patterns of a disk compressed by two diametrically opposite cocentrated loads are simulated and these patterns are processed to yield sharpened lines. The method is then aplied to measurement of residual stresses in glass bar. The procedure is proved to be capable of extraction sharpened lines accurately from photoelastic multiplied fringes, and yields good experimental results consistently and precisely.

The relationship between minority carrier life time and structural defects in silicon ingot grown with single seed

  • Lee, A-Young;Kim, Young-Kwan
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.25 no.1
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    • pp.13-19
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    • 2015
  • Among the various possible factors affecting the Minority Carrier Life Time (MCLT) of the mc-Si crystal, dislocations formed during the cooling period after solidification were found to be a major element. It was confirmed that other defects such as grain boundary or twin boundary were not determinative defects affecting the MCLT because most of these defects seemed to be formed during the solidification period. With a measurement of total thickness variation (TTV) and bow of the silicon wafers, it was found that residual stress remaining in the mc-Si crystal might be another major factor affecting the MCLT. Thus, it is expected that better quality of mc-Si can be grown when the cooling process right after solidification is carried out as slow as possible.

Evaluation of Stress Intensity Factor for A Partially Patched Crack Using an Approximate Weight Function

  • Kim, Jong-Ho;Hong, Seong-Gu;Lee, Soon-Bok
    • Journal of Mechanical Science and Technology
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    • v.17 no.11
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    • pp.1659-1664
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    • 2003
  • A cracked plate with a patch bonded on one side was treated with a crack-bridging model using weight function: assuming continuous distribution of springs acting between th crack surfaces, the stress intensity factor of the patched crack was numerically obtained. Especially in the case of a patched crack subjected to residual non-uniform stress, the stress intensity factor was easily with the corresponding approximate weight function. This paper presented the stress intensity factors for a crack partially patched within a finite plate or a patched crack initiated from a notch.

Estimation of the Stress Profile of $p^+$ Silicon Films Using Stress Measurement Structures (응력측정 구조를 이용한 $p^+$ 박막의 응력분포 추정)

  • Yang, E.H.;Yang, S.S.;Park, E.J.;Yoo, S.H.
    • Proceedings of the KIEE Conference
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    • 1994.11a
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    • pp.413-415
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    • 1994
  • In this paper, a new technique for quantitative estimation of the stress profile along the depth of $p^+$ silicon films is presented. The $p^+$ silicon cantilevers with various beam thickness and a rotating beam supported by two cantilevers are used for estimating the stress profile of the films. The average of the residual stress distribution is estimated to be 50MPa. Most of $p^+$ silicon films are subjected to the tensile stress, except the region near the frontside.

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Development of Finite Element Model for Dynamic Characteristics of MEMS Piezo Actuator in Consideration of Semiconductor Process (반도체 공정을 고려한 유한요소해석에 의한 MEMS 압전 작동기의 동특성 해석)

  • Kim, Dong Woohn;Song, Jonghyeong;An, Seungdo;Woo, Kisuk
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2013.04a
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    • pp.454-459
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    • 2013
  • For the purpose of rapid development and superior design quality assurance, sophisticated finite element model for SOM(Spatial Optical Modulator) piezo actuator of MOEMS device has been developed and evaluated for the accuracy of dynamics and residual stress analysis. Parametric finite element model is constructed using ANSYS APDL language to increase the design and analysis performance. Geometric dimensions, mechanical material properties for each thin film layer are input parameters of FE model and residual stresses in all thin film layers are simulated by thermal expansion method with psedu process temperature. $6^{th}$ mask design samples are manufactured and $1^{st}$ natural frequency and 10V PZT driving displacement are measured with LDV. The results of experiment are compared with those of the simulation and validate the good agreement in $1^{st}$ natural frequency within 5% error. But large error over 30% occurred in 10V PZT driving displacement because of insufficient PZT constant $d_{31}$ measurement technology.

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A Study on Non-destructive Stress Measurement of Steel Plate using a Magnetic Anisotropy Sensor (자기이방성센서를 이용한 강판의 비파괴 응력 계측에 관한 연구)

  • Kim, Daesung;Moon, Hongduk;Yoo, Jihyeung
    • Journal of the Korean GEO-environmental Society
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    • v.12 no.11
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    • pp.71-77
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    • 2011
  • Recently, non-destructive stress measurement method using magnetic anisotropy sensor has been applied to the construction site such as steel bridges and steel pipes. In addition, steel rib used in the tunnel construction site was found to be possible to measure the stress by non-destructive method. In this study, steel loading experiments using magnetic anisotropy sensor developed in Japan and strain gauges were conducted to derive stress sensitivity curve for domestic steel SS400. Also, additional steel loading experiments and numerical analysis were performed for evaluation of applicability for non-destructive stress measurement method using magnetic anisotropy sensor. As a result of this study, stress sensitivity curves for domestic steel SS400 were derived using output voltage measured by magnetic anisotropy sensor and average of stress measured by strain gauges depending on the measurement location. And as a result of comparing additional steel loading experiments with the numerical analysis, error level of magnetic anisotropy sensor is around 20MPa. When considering the level of the yield stress(245MPa) of steel, in case of using magnetic anisotropy sensor in order to determine the stress status of steel, it has sufficient accuracy in engineering. Especially, magnetic anisotropy sensor can easily identify the current state of stress which considers residual stress at steel structure that stress measurement sensor is not installed, so we found that magnetic anisotropy sensor can be applied at maintenance of steel structure conveniently.