• Title/Summary/Keyword: Reaction-diffusion type equations

Search Result 12, Processing Time 0.022 seconds

Cure Properties of Isocyanurate Type Epoxy Resin Systems for FO-WLP (Fan Out-Wafer Level Package) Next Generation Semiconductor Packaging Materials (FO-WLP (Fan Out-Wafer Level Package) 차세대 반도체 Packaging용 Isocyanurate Type Epoxy Resin System의 경화특성연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
    • /
    • v.18 no.1
    • /
    • pp.65-69
    • /
    • 2019
  • The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

Kinetics of Silica Sorption and Desorption in Soil as affected by pH and Temperature (pH 와 온도(溫度)에 따른 토양(土壤)의 규산(硅酸) 흡(吸) · 탈착(脫着)에 대(對)한 역학적(力學的) 연구(硏究))

  • Lee, Sang-Eun;Neue, Heins Ulitz
    • Korean Journal of Soil Science and Fertilizer
    • /
    • v.25 no.4
    • /
    • pp.342-356
    • /
    • 1992
  • Kinetic studies using stirred-flow methods were conducted with the Luisiana soil at three pH levels(pH 5, 6.5, and 8) and three temperature levels(10, 25, and $40^{\circ}C$) to explore effects on the rate of silica retention and release and to find out reaction mechanisms. In this study the maximum silica retention could not be obtained for long enough experimental time. The silica sorption isorption was C type fitted well to Freundlich equation. The pH of the soil suspension increased by the silica release process at low pH treatments(pH 5 and 6.5), while decreased at high pH treatment(pH 8). From the above findings It can be deduced that the mechanism of silica retention is a multilayer forming process to change the ligand form depending on pH condition. In the proposed mechanism the sorbed silica provide new binding sites for additional sorption of silica, while the activation energy for the formation of subsequent layers increases correspondingly. The silica retention and release process were well described by first-order and parabolic diffusion equation. However, clear interpretation for silica sorption mechanism using these equations could not be made. The validity of the fraction term (Fa and Fd) included in first-order and parabolic diffusion equation requires further examinations because the temperature effect on apparent rate constant shows no constant trends among temperature treatments, while there was a good trend in Elovich and modified Freundlich equation where the fraction term was not included.

  • PDF