• 한국전기전자재료학회논문지
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• 제29권2호
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• pp.125-130
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• 2016

In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $25^{\circ}C$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $55^{\circ}C$ when the optimal heat dissipation design was applied.