• 제목/요약/키워드: RRAM

검색결과 25건 처리시간 0.02초

Investigation of Plasma Damage and Restoration in InGaZnO Thin-Film Transistors

  • 정하동;박정훈;조원주
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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    • pp.209.1-209.1
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    • 2015
  • Indium gallium zinc oxide (IGZO), indium zinc oxide (IZO) 그리고 zinc tin oxide (ZTO) 같은 zinc oxide 기반의 산화물 반도체는 높은 이동도, 투과도 그리고 유연성 같은 장점을 갖고 있어, display application의 backplane 소자로 적용되고 있다. 또한 최근에는 산화물 반도체를 이용한 thin-film transistor (TFT) 뿐만아니라 resistive random access memory (RRAM), flash memory 그리고 pH 센서 등 다양한 반도체 소자에 적용을 위한 연구가 활발히 진행 중이다. 그러나 zinc oxide 기반의 산화물 반도체의 전기 화학적 불안정성은 위와 같은 소자에 적용하는데 제약이 있다. 산화물 반도체의 안정성에 영향을 미치는 다양한 요인들 중 한 가지는, sputter 같은 plasma를 이용한 공정 진행 시 active layer가 plasma에 노출되면서 threshold voltage (Vth)가 급격하게 변화하는 plasma damage effect 이다. 급격한 Vth의 변화는 동작 전압의 불안정성을 가져옴과 동시에 누설전류를 증가시키는 결과를 초래 한다. 따라서 본 연구에서는, IGZO 기반의 TFT를 제작 후 plasma 분위기에 노출시켜, power와 노출 시간에 따른 전기적 특성 변화를 확인 하였다. 또한, thermal annealing을 적용하여 열처리 온도와 시간에 따른 Vth의 회복특성을 조사 하였다. 이러한 결과는 추후 산화물 반도체를 이용한 다양한 소자 설계 시 유용할 것으로 기대된다.

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Resistive Switching Properties of N and F co-doped ZnO

  • Kim, Minjae;Kang, Kyung-Mun;Wang, Yue;Chabungbam, Akendra Singh;Kim, Dong-eun;Kim, Hyung Nam;Park, Hyung-Ho
    • 마이크로전자및패키징학회지
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    • 제29권2호
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    • pp.53-58
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    • 2022
  • One of the most promising emerging technologies for the next generation of nonvolatile memory devices based on resistive switching (RS) is the resistive random-access memory mechanism. To date, RS effects have been found in many transition metal oxides. However, no clear evidence has been reported that ZnO-based resistive transition mechanisms could be associated with strong correlation effects. Here, we investigated N, F-co-doped ZnO (NFZO), which shows bipolar RS. Conducting micro spectroscopic studies on exposed surfaces helps tracking the behavioral change in systematic electronic structural changes during low and high resistance condition of the material. The significant difference in electronic conductivity was observed to attribute to the field-induced oxygen vacancy that causes the metal-insulator Mott transition on the surface. In this study, we showed the strong correlation effects that can be explored and incorporated in the field of multifunctional oxide electrons devices.

RF 스퍼터링 시스템을 이용하여 증착한 비정질 Ga2O3 박막의 스퍼터링 파워에 따른 특성 평가 (The Effect of Sputtering Power on Amorphous Ga2O3 Deposited by RF Sputtering System)

  • 김형민;박상빈;김경환;홍정수
    • 한국전기전자재료학회논문지
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    • 제36권5호
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    • pp.488-493
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    • 2023
  • The effect of sputtering power on the amorphous Ga2O3 thin film deposited using the radio frequency sputtering system was evaluated. Amorphous Ga2O3 is cheaper and more efficiently fabricated than crystalline Ga2O3, and is studied in various fields such as RRAM, photodetector, and flexible devices. In this study, amorphous Ga2O3 was deposited by radio frequency sputtering system and represented a transmittance of over 80% in the visible light region and a homogeneous and dense surface. The optical band gap energy decreased as the sputtering power increased owing to the quantum size effect. Thus, the specific band gap of amorphous Ga2O3 can be obtained by adjusting the sputtering power, it indicates amorphous Ga2O3 can be used in various fields.

산소 분압의 변화에 따른 Cr-Doped SrZrO3 페로브스카이트 박막의 저항변화 특성 (Resistive Switching Behavior of Cr-Doped SrZrO3 Perovskite Thin Films by Oxygen Pressure Change)

  • 양민규;박재완;이전국
    • 한국재료학회지
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    • 제20권5호
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    • pp.257-261
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    • 2010
  • A non-volatile resistive random access memory (RRAM) device with a Cr-doped $SrZrO_3/SrRuO_3$ bottom electrode heterostructure was fabricated on $SrTiO_3$ substrates using pulsed laser deposition. During the deposition process, the substrate temperature was $650^{\circ}C$ and the variable ambient oxygen pressure had a range of 50-250 mTorr. The sensitive dependences of the film structure on the processing oxygen pressure are important in controlling the bistable resistive switching of the Cr-doped $SrZrO_3$ film. Therefore, oxygen pressure plays a crucial role in determining electrical properties and film growth characteristics such as various microstructural defects and crystallization. Inside, the microstructure and crystallinity of the Cr-doped $SrZrO_3$ film by oxygen pressure were strong effects on the set, reset switching voltage of the Cr-doped $SrZrO_3$. The bistable switching is related to the defects and controls their number and structure. Therefore, the relation of defects generated and resistive switching behavior by oxygen pressure change will be discussed. We found that deposition conditions and ambient oxygen pressure highly affect the switching behavior. It is suggested that the interface between the top electrode and Cr-doped $SrZrO_3$ perovskite plays an important role in the resistive switching behavior. From I-V characteristics, a typical ON state resistance of $100-200\;{\Omega}$ and a typical OFF state resistance of $1-2\;k{\Omega}$, were observed. These transition metal-doped perovskite thin films can be used for memory device applications due to their high ON/OFF ratio, simple device structure, and non-volatility.

Unusual ALD Behaviors in Functional Oxide Films for Semiconductor Memories

  • Hwang, Cheol Seong
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.77.1-77.1
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    • 2013
  • Atomic layer deposition (ALD) is known for its self-limiting reaction, which offers atomic-level controllability of the growth of thin films for a wide range of applications. The self-limiting mechanism leads to very useful properties, such as excellent uniformity over a large area and superior conformality on complex structures. These unique features of ALD provide promising opportunities for future electronics. Although the ALD of Al2O3 film (using trimethyl-aluminum and water as a metal precursor and oxygen source, respectively) can be regarded as a representative example of an ideal ALD based on the completely self-limiting reaction, there are many cases deviating from the ideal ALD reaction in recently developed ALD processes. The nonconventional aspects of the ALD reactions may strongly influence the various properties of the functional materials grown by ALD, and the lack of comprehension of these aspects has made ALD difficult to control. In this respect, several dominant factors that complicate ALD reactions, including the types of metal precursors, non-metal precursors (oxygen sources or reducing agents), and substrates, will be discussed in this presentation. Several functional materials for future electronics, such as higher-k dielectrics (TiO2, SrTiO3) for DRAM application, and resistive switching materials (NiO) for RRAM application, will be addressed in this talk. Unwanted supply of oxygen atoms from the substrate or other component oxide to the incoming precursors during the precursor pulse step, and outward diffusion of substrate atoms to the growing film surface even during the steady-state growth influenced the growth, crystal structure, and properties of the various films.

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