• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.421-421
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• 2012

Graphene has drawn enormous attention owing to its outstanding properties, such as high charge mobility, excellent transparence and mechanical property. Synthesis of Graphene by chemical vapor deposition (CVD) is an attractive way to produce large-scale Graphene on various substrates. However the fatal limitation of CVD process is high temperature requirement(around $1,000^{\circ}C$), at which many substrates such as Al substrate cannot endure. Therefore, we propose plasma enhanced CVD (PECVD) and decrease the temperature to $400^{\circ}C$. Fig. 1 shows the typical structure of RF-PECVD instrument. The quality of Graphene is affected by several variables. Such as plasma power, distance between substrate and electronic coil, flow rate of source gas and growth time. In this study, we investigate the influence of these factors on Graphene synthesis in vacuum condition. And the results were checked by Raman spectra and conductivity measurement.

• 마이크로전자및패키징학회지
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• 제8권1호
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• pp.13-18
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• 2001

본 연구에서 RF 플라즈마를 이용한 촉매 화학기상증착법에 의하여 탄소나노튜브를 성장시켰다. 탄소나노튜브는 Ni이 증착된 강화 유리 기판위에 $600^{\circ}C$ 이하의 공정 온도에서 성장되었으며, 성장시 성장 온도와 에칭 시간 그리고 Ni 층의 두메에 따라 탄소나노튜브 성장 특성이 다양하게 나타났다. Ni이 증착된 강화 유리기판위에 탄소나노튜브를 성장시키기 위하여 에칭 가스로는 $H_2$와 $NH_3$가스를 사용하였고, 탄소 원료로 $C_2H_2$가스를 사용하였다. 수직 배향된 탄소나노튜브의 직경과 길이는 약 150 nm와 3 $\mu\textrm{m}$ 정도의 크기로 성장되었다. 촉매 화학기상증착법을 이용하여 성장된 탄소나노튜브는 FED의 에미터로 사용이 기대된다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2007년도 춘계학술발표회 초록집
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• pp.73-73
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• 2007

Amorphous BON and Si-DLC thin films were synthesized by the RF plasma enhanced CVD method, and their oxidation behavior was studied up to $500^{\circ}C$ in air. The oxidation of both films was accompanied by evaporation of volatile species. The oxidation of BON film was preceded by nitrogen escape from the film, and oxygen penetration into the film. The oxidation of Si-DLC film was preceded by carbon escape probably as CO or $CO_2$from the film, and oxygen penetration into the film. The inwardly transported oxygen simply stayed in the oxidized BON and Si-DLC thin films.

• 대한전기학회논문지
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• 제39권10호
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• pp.1037-1043
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• 1990

Diamond thin films were synthesized from the mixed gases of methane and hydrogen on silicon substrates by RF plasma chemical vapor deposition and deposited films were investigated by SEM, X-ray diffractometry and Raman spectroscopy. It is found that high quality diamond-like carbon films were successfully synthesized by PECVD under the deposition condition of 1-10 vol% of methane concentration, 0.15-0.4torr of reactor pressure, 500W of RF power, and 5-20hr of reaction time. Especially, cubo-octahedral diamond-like carbon particles were synthesized by employing 1.0 vol % of methane concentration and 0.4torr of the reactor pressure.

• 한국표면공학회지
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• 제33권2호
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• pp.69-76
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• 2000

The rf plasma chemical vapor deposition is a common method employed for diamond or amorphous carbon deposition. Diamond possesses the strongest bonding, as exemplified by a number of unique properties-extraordinary hardness, high thermal conductivity, and a high melting tempera tore. Therefore, it is very important to investigate the synthesis of semiconducting diamond and its use as semiconductor devices. An inductively coupled rf plasma CVD system for producing amorphous carbon films were developed. Uniform temperature and concentration profiles are requisites for the deposition of high quality large-area films. The system consists of rf matching network, deposition chamber, pumping lines for gas system. Gas mixtures with methane, and hydrogen have been used and Si (100) wafers used as a substrate. Amorphous carbon films were deposited with methane concentration of 1.5% at the process pressure of S torr~20 torr, and process temperature of about $750^{\circ}C$. The nucleation and growth of the amorphous carbon films have been characterized by several methods such as SEM and XRD.

• Journal of Electrical Engineering and Technology
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• 제2권4호
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• pp.532-536
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• 2007

Carbon nanotube (CNT) properties, produced using a magnetic null discharge (MND) plasma production technology, were investigated. We firstly deposited the Fe layer 200 nm in thickness on Si substrate by the magnetic null discharge sputter method at the substrate temperature of $300도C$, and then prepared CNTs on the catalyst layer by using the magnetic null discharge (MND) based CVD method. CNTs were deposited in a gas mixture of CH4 and N2 at a total pressure of 1 Torr by the MND-CVD method. The substrate temperature and the RF power were $650^{\circ}C$ and 600W, respectively. The characterization data indicated that the proposed source could synthesize CNTs even under relatively severe conditions for the magnetic null discharge formation.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.253-253
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• 2012

Low temperature SiOx film process has being required for both silicon and oxide (IGZO) based low temperature thin film transistor (TFT) for application of flexible display. In recent decades, from low density and high pressure such as capacitively coupled plasma (CCP) type plasma enhanced chemical vapor deposition (PECVD) to the high density plasma and low pressure such as inductively coupled plasma (ICP) and electron cyclotron resonance (ECR) have been used to researching to obtain high quality silicon oxide (SiOx) thin film at low temperature. However, these plasma deposition devices have limitation of controllability of process condition because process parameters of plasma deposition such as RF power, working pressure and gas ratio influence each other on plasma conditions which non-leanly influence depositing thin film. In compared to these plasma deposition devices, neutral beam assisted chemical vapor deposition (NBaCVD) has advantage of independence of control parameters. The energy of neutral beam (NB) can be controlled independently of other process conditions. In this manner, we obtained NB dependent high crystallized intrinsic and doped silicon thin film at low temperature in our another papers. We examine the properties of the low temperature processed silicon oxide thin films which are fabricated by the NBaCVD. NBaCVD deposition system consists of the internal inductively coupled plasma (ICP) antenna and the reflector. Internal ICP antenna generates high density plasma and reflector generates NB by auger recombination of ions at the surface of metal reflector. During deposition of silicon oxide thin film by using the NBaCVD process with a tungsten reflector, the energetic Neutral Beam (NB) that controlled by the reflector bias believed to help surface reaction. Electrical and structural properties of the silicon oxide are changed by the reflector bias, effectively. We measured the breakdown field and structure property of the Si oxide thin film by analysis of I-V, C-V and FTIR measurement.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2003년도 춘계전력전자학술대회 논문집(2)
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• pp.611-615
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• 2003

In this paper, a operation characteristics and analysis of the HB(half bridge) inverter for remote plasma system are studied. the remote plasma system is cleaning system for the chemical vapor deposition (CVD) chamber in semiconductor processing. The remote plasma system is powered by the RF generator The main power stage of the RF generator is used for the HB PWM inverter with an low pass filter in the secondary circuit of the transformer. The detailed mode analysis of HB invertor was described. The operation characteristics of Remote Plasma Source are verified by simulation and experimental results.

• 한국진공학회지
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• 제2권3호
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• pp.346-354
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• 1993

고주파플라즈마 CVD법으로 CH4와 H2의 혼합가스로부터 실리콘과 석영기판 위에 다이아몬드 입자와 박막을 성장시켰다. 기판과 기판지지대 사이에 금속판을 삽입함으로써 기판의 온도와 성장된 박막의 두께를 비교적 균일하게 할 수 있었다. 방전전력이 같은 경우 성장된 박막의 형태는 반응관 압력을 증가시킴에 따라 자형면을 가진 입자로부터 미립자 도는 구성의 입자로 변화되었다. $H_2와{\;}CH_4의$ 혼합가스로부터 Si기판 위에 다이아몬드 박막을 성장시키는 경우, CH4 농도가 0.5vol% 이하가 되어야만 양질의 다이아몬드 박막을 성장시킬 수 있었다. 성장된 다이아몬드 박막은 SEM, XRD 및 Raman 분광기를 사용하여 평가하였다.

• The Korean Journal of Ceramics
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• 제3권3호
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• pp.182-186
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• 1997

Diamond-like carbon(DLC) films were deposited on silicon substreates by using an RF plasmaassisted CVD apparatus; the effects of deposition conditions such as CH4 gas pressure and substrate bias voltage on DLC film friction and wear were examined in both friction and scratch tests. In friction tests critical loads at which the friction coefficient increases abruptly depend on substrate bias voltages: critical loads deposited at a bias voltage of -100 V exceed those deposited at other bias voltages. Critical loads are correlated with DLC film hydrogen content. Critical DLC film loads in scratch tests depended considerably less than in friction tests. The friction coefficient of DLC films depends on neither substrate bias voltage nor CH4 gas pressure.