• 제목/요약/키워드: RF device

검색결과 639건 처리시간 0.029초

Frequency Tunable and Miniaturized Zeroth-Order Resonant(ZOR) Antenna Design by Metamaterial (메타 물질을 이용하여 소형화와 주파수 가변이 가능한 영차 공진 안테나)

  • Jang, Young-Soo;Choi, Jae-Hyurk;Lim, Sung-Joon
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • 제21권8호
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    • pp.900-904
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    • 2010
  • In this paper, a frequency tunable zeroth-order resonant(ZOR) antenna has been implemented. The ZOR characteristics of the proposed antenna is realized by using a composite right-and left-handed(CRLH) transmission line which consists of a rectangular slot on the ground plane of a mushroom structured antenna in order to minimize the antenna size. In addition, the tunable devices are introduced on the slotted ground plane for frequency tuning capability. Depending on the on and off states of the tunable device on the slotted ground plane, a shunt inductance value of the CRLH transmission line is changed and its resonant frequency becomes tunable. From the experimental results, the resonant frequency of the proposed antenna is changed from 4.92 GHz to 2.96 GHz. Additionally, the proposed antenna's size is reduced by 94.24 % compared with the half-wavelength patch antenna.

Front-End Module of 18-40 GHz Ultra-Wideband Receiver for Electronic Warfare System

  • Jeon, Yuseok;Bang, Sungil
    • Journal of electromagnetic engineering and science
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    • 제18권3호
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    • pp.188-198
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    • 2018
  • In this study, we propose an approach for the design and satisfy the requirements of the fabrication of a small, lightweight, reliable, and stable ultra-wideband receiver for millimeter-wave bands and the contents of the approach. In this paper, we designed and fabricated a stable receiver with having low noise figure, flat gain characteristics, and low noise characteristics, suitable for millimeter-wave bands. The method uses the chip-and-wire process for the assembly and operation of a bare MMIC device. In order to compensate for the mismatch between the components used in the receiver, an amplifier, mixer, multiplier, and filter suitable for wideband frequency characteristics were designed and applied to the receiver. To improve the low frequency and narrow bandwidth of existing products, mathematical modeling of the wideband receiver was performed and based on this spurious signals generated from complex local oscillation signals were designed so as not to affect the RF path. In the ultra-wideband receiver, the gain was between 22.2 dB and 28.5 dB at Band A (input frequency, 18-26 GHz) with a flatness of approximately 6.3 dB, while the gain was between 21.9 dB and 26.0 dB at Band B (input frequency, 26-40 GHz) with a flatness of approximately 4.1 dB. The measured value of the noise figure at Band A was 7.92 dB and the maximum value of noise figure, measured at Band B was 8.58 dB. The leakage signal of the local oscillator (LO) was -97.3 dBm and -90 dBm at the 33 GHz and 44 GHz path, respectively. Measurement was made at the 15 GHz IF output of band A (LO, 33 GHz) and the suppression characteristic obtained through the measurement was approximately 30 dBc.

Design of RFID Packaging for Construction Materials (건축자재용 RFID 패키징 설계)

  • Shin, Jae-Hui;Hwang, Suk-Seung
    • The Journal of the Korea institute of electronic communication sciences
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    • 제8권6호
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    • pp.923-931
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    • 2013
  • RFID (Radio Frequency Identification), which is a kind of the electronic tag, is a wireless access device using the radio frequency for recognizing the ID information. It has a variety of application such as the bus card, gate access card, distribution industry, and management of construction materials. The performance and size of RFID depend on the penetrability, recognition ratio, memory size, multi tag recognition, external pollution dust, and exterior impact, and RFID requires the packaging to protect itself considered above factors. Recently, RFID is diversely employed to effectively manage construction materials and the RFID packaging, which is robust to the external impact, is required to attach RFID on construction materials. In this paper, we propose the construction material RFID packaging designed to be robust for the external impact and to be practicable for change of the broken RFID. For the change of RFID, we separate the cast and body of the packaging. Also, we present the detail drawing for the proposed construction material RFID packaging and implement the performance evaluation of the packaging manufactured using 3D printer.

SnS2/p-Si Heterojunction Photodetector (SnS2/p-Si 이종접합 광 검출기)

  • Oh, Chang-Gyun;Cha, Yun-Mi;Lee, Gyeong-Nam;Jung, Bok-Mahn;Kim, Joondong
    • The Transactions of The Korean Institute of Electrical Engineers
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    • 제67권10호
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    • pp.1370-1374
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    • 2018
  • A heterojunction $SnS_2/p-Si$ photodetector was fabricated by RF magnetron sputtering system. $SnS_2$ was formed with 2-inch $SnS_2$ target. Al was applied as the front and the back metal contacts. Rapid thermal process was conducted at $500^{\circ}C$ to enhance the contact quality. 2D material such as $SnS_2$, MoS2 is very attractive in various fields such as field effect transistors (FET), photovoltaic fields such as photovoltaic devices, optical sensors and gas sensors. 2D material can play a significant role in the development of high performance sensors, especially due to the advantages of large surface area, nanoscale thickness and easy surface treatment. Especially, $SnS_2$ has a indirect bandgap in the single and bulk states and its value is 2 eV-2.6 eV which is considerably larger than that of the other 2D material. The large bandgap of $SnS_2$ offers the advantage for the large on-off current ratio and low leakage current. The $SnS_2/p-Si$ photodetector clearly shows the current rectification when the thickness of $SnS_2$ is 80 nm compared to when it is 135 nm. The highest photocurrent is $19.73{\mu}A$ at the wavelength of 740 nm with $SnS_2$ thickness of 80 nm. The combination of 2D materials with Si may enhance the Si photoelectric device performance with controlling the thickness of 2D layer.

Co-Deposition법을 이용한 Yb Silicide/Si Contact 및 특성 향상에 관한 연구

  • Gang, Jun-Gu;Na, Se-Gwon;Choe, Ju-Yun;Lee, Seok-Hui;Kim, Hyeong-Seop;Lee, Hu-Jeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.438-439
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    • 2013
  • Microelectronic devices의 접촉저항의 향상을 위해 Metal silicides의 형성 mechanism과 전기적 특성에 대한 연구가 많이 이루어지고 있다. 지난 수십년에 걸쳐, Ti silicide, Co silicide, Ni silicide 등에 대한 개발이 이루어져 왔으나, 계속적인 저저항 접촉 소재에 대한 요구에 의해 최근에는 Rare earth silicide에 관한 연구가 시작되고 있다. Rare-earth silicide는 저온에서 silicides를 형성하고, n-type Si과 낮은 schottky barrier contact (~0.3 eV)를 이룬다. 또한, 비교적 낮은 resistivity와 hexagonal AlB2 crystal structure에 의해 Si과 좋은 lattice match를 가져 Si wafer에서 high quality silicide thin film을 성장시킬 수 있다. Rare earth silicides 중에서 ytterbium silicide는 가장 낮은 electric work function을 갖고 있어 낮은 schottky barrier 응용에서 쓰이고 있다. 이로 인해, n-channel schottky barrier MOSFETs의 source/drain으로써 주목받고 있다. 특히 ytterbium과 molybdenum co-deposition을 하여 증착할 경우 thin film 형성에 있어 안정적인 morphology를 나타낸다. 또한, ytterbium silicide와 마찬가지로 낮은 면저항과 electric work function을 갖는다. 그러나 ytterbium silicide에 molybdenum을 화합물로써 높은 농도로 포함할 경우 높은 schottky barrier를 형성하고 epitaxial growth를 방해하여 silicide film의 quality 저하를 야기할 수 있다. 본 연구에서는 ytterbium과 molybdenum의 co-deposition에 따른 silicide 형성과 전기적 특성 변화에 대한 자세한 분석을 TEM, 4-probe point 등의 다양한 분석 도구를 이용하여 진행하였다. Ytterbium과 molybdenum을 co-deposition하기 위하여 기판으로 $1{\sim}0{\Omega}{\cdot}cm$의 비저항을 갖는 low doped n-type Si (100) bulk wafer를 사용하였다. Native oxide layer를 제거하기 위해 1%의 hydrofluoric (HF) acid solution에 wafer를 세정하였다. 그리고 고진공에서 RF sputtering 법을 이용하여 Ytterbium과 molybdenum을 동시에 증착하였다. RE metal의 경우 oxygen과 높은 반응성을 가지므로 oxidation을 막기 위해 그 위에 capping layer로 100 nm 두께의 TiN을 증착하였다. 증착 후, 진공 분위기에서 rapid thermal anneal(RTA)을 이용하여 $300{\sim}700^{\circ}C$에서 각각 1분간 열처리하여 ytterbium silicides를 형성하였다. 전기적 특성 평가를 위한 sheet resistance 측정은 4-point probe를 사용하였고, Mo doped ytterbium silicide와 Si interface의 atomic scale의 미세 구조를 통한 Mo doped ytterbium silicide의 형성 mechanism 분석을 위하여 trasmission electron microscopy (JEM-2100F)를 이용하였다.

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ZnO Based All Transparent UV Photodetector with Functional SnO2 Layer (SnO2 기능성 박막을 이용한 ZnO 기반의 투명 UV 광검출기)

  • Lee, Gyeong-Nam;Lee, Joo-Hyun;Kim, Joondong
    • The Transactions of The Korean Institute of Electrical Engineers
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    • 제67권1호
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    • pp.68-74
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    • 2018
  • All transparent UV photodetector based on ZnO was fabricated with structure of NiO/ZnO/$SnO_2$/ITO by using RF and DC magnetron sputtering system. ZnO was deposited with 4 inch ZnO target (purity 99.99%) for a quality film. In order to build p-n junction up, p-type NiO was formed on n-type ZnO by using reactive sputtering method. The indium tin oxide (ITO) which is transparent conducting oxide (TCO) was applied as a transparent electrode for transporting electrons. To improve the UV photodetector performance, a functional $SnO_2$ layer was selected as an electron transporting and hole blocking layer, which actively controls the carrier movement, between ZnO and ITO. The photodetector (NiO/ZnO/$SnO_2$/ITO) shows transmittance over 50% as similar as the transmittance of a general device (NiO/ZnO/ITO) due to the high transmittance of $SnO_2$ for broad wavelengths. The functional $SnO_2$ layer for band alignment effectively enhances the photo-current to be $15{\mu}A{\cdot}cm^{-2}$ (from $7{\mu}A{\cdot}cm^{-2}$ of without $SnO_2$) with the quick photo-responses of rise time (0.83 ms) and fall time (15.14 ms). We demonstrated the all transparent UV photodetector based on ZnO and suggest the route for effective designs to enhance performance for transparent photoelectric applications.

A Study on the Preparation and Properties of $RuO_2$ Thin Films for Ferroelectric Memory Device Applications (강유전체 메모리 소자 응용을 위한 $RuO_2$ 박막의 제작과 특성에 관한 연구)

  • 강성준;정양희
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 한국해양정보통신학회 2000년도 추계종합학술대회
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    • pp.494-498
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    • 2000
  • RuO$_2$ thin films are prepared by RF magnetron reactive sputtering and their characteristics of crystallization, microstructure, surface roughness and resistivity are studied with various $O_2$/ (Ar+O$_2$) ratios and substrate temperatures. As $O_2$/(Ar+O$_2$) ratio decreases and substrate temperature increases, the preferred growing plane of RuO$_2$ thin films are changed from (110) to (101) plane. With increase of the $O_2$/(Ar+O$_2$) ratio from 20% to 50%, the surface roughness and the resistivity of RuO$_2$ thin films increase from 2.38nm to 7.81 nm, and from 103.6 $\mu$$\Omega$-cm to 227 $\mu$$\Omega$-cm, respectively, but the deposition rate decreases from 47 nm/min to 17 nm/min. On the other hand, as the substrate temperature increases from room temperature to 500 $^{\circ}C$, resistivity decreases from 210.5 $\mu$$\Omega$-cm to 93.7 $\mu$$\Omega$-cm. RuO$_2$ thin film deposited at 300 $^{\circ}C$ shows a excellent surface roughness of 2.38 nm. As the annealing temperature increases in the range between 400 $^{\circ}C$ and 650 $^{\circ}C$, the resistivity decreases because of the improvement of crystallinity. We find that RuO$_2$ thin film deposited at 20% of $O_2$/(Ar+O$_2$) ratio and 300 t of substrate temperature shows excellent combination of surface smoothness and low resistivity so that it is well Qualified for bottom electrodes for ferroelectric thin films.

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Fabrication of Pt Thin-film Type Microheater for Thermal Microsensors and Its Characteristics (열형 마이크로센서용 백금박막형 미세발열체의 제작과 그 특성)

  • 정귀상;홍석우
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • 제13권6호
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    • pp.509-513
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    • 2000
  • The physical and electrical characteristics of MgO and Pt thin-films on it deposited by reactive sputtering and rf magnetron sputtering respectively were analyzed with annealing temperature and time by four point probe SEM and XRD. Under annealing conditions of 100$0^{\circ}C$ and 2 hr, MgO thin-film had the properties of improving Pt adhesion to SiO$_2$and insulation without chemical reaction to Pt thin-film and the sheet resistivity and the resistivity of Pt thin-film deposited on it were 0.1288 Ω/ and 12.88 $\mu$$\Omega$.cm respectively. We made Pt resistance pattern on SiO$_2$/Si substrate by life-off method and fabricated Pt thin-film type microheater for thermal microsensors by Pt-wire Pt-paste and SOG(spin-on-glass). In the temperature range of 25~40$0^{\circ}C$ we estimated TCR(temperature coefficient of resistance) and resistance ratio of thin-film type Pt-RTD(resistance thermometer device). We obtained TCR value of 3927 ppm/$^{\circ}C$ close to the bulk Pt value. Resistance values were varied linearly within the range of the measurement temperature. The thermal characteristics of fabricated thin-films type Pt micorheater were analyzed with Pt-RTD integrated on the same substrate. The heating temperature of Pt microheater could be up to 40$0^{\circ}C$ with 1.5 watts of the heating power.

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ZnO Nanoparticle Based Dye-Sensitized Solar Cells Devices Fabricated Utilizing Hydropolymer at Low Temperature (저온에서 Hydropolymer를 이용한 ZnO 나노입자 염료 감응형 태양전지)

  • Kwon, Byoung-Wook;Son, Dong-Ick;Park, Dong-Hee;Yang, Jeong-Do;Choi, Won-Kook
    • Korean Journal of Materials Research
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    • 제20권9호
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    • pp.483-487
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    • 2010
  • To fabricate $TiO_2$ nanoparticle-based dye sensitized solar cells (DSSCs) at a low-temperature, DSSCs were fabricated using hydropolymer and ZnO nanoparticles composites for the electron transport layer around a low-temperature ($200^{\circ}C$). ZnO nanoparticle with 20 nm and 60 nm diameter were used and Pt was deposited as a counter electrode on ITO/glass using an RF magnetron sputtering. We investigate the effect of ZnO nanoparticle concentration in hydropolymer and ZnO nanoparticle solution on the photoconversion performance of the low temperature fabricated ($200^{\circ}C$) DSSCs. Using cis-bis(isothiocyanato)bis(2,20 bipyridy1-4,40 dicarboxylato) ruthenium (II) bis-tetrabutylammonium (N719) dye as a sensitizer, the corresponding device performance and photo-physical characteristics are investigated through conventional physical characterization techniques. The effect of thickness of the ZnO photoelectrode and the morphology of the ZnO nanoparticles with the variations of hydropolymer to ZnO ratio on the photoconversion performance are also investigated. The morphology of the ZnO layer after sintering was examined using a field emission scanning electron microscope (FE-SEM). 60 nm ZnO nanoparticle DSSCs showed an incident photon-to-current conversion efficiency (IPCE) value of about 7% higher than that of 20 nm ZnO nanoparticle DSSCs. The maximum parameters of the short circuit current density ($J_{sc}$), the open circuit potential ($V_{oc}$), fill factor (ff), and efficiency ($\eta$) in the 60 nm ZnO nanoparticle-based DSSC devices were 4.93 mA/$cm^2$, 0.56V, 0.40, and 1.12%, respectively.

Development of a Comprehensive Performance Test Facility for Small Millimeter-wave Tracking Radar (소형 추적 레이다용 종합성능시험 시설 개발)

  • Kim, Hong-Rak;Kim, Youn-Jin;Woo, Seon-Keol;An, Se-Hwan
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • 제20권3호
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    • pp.121-127
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    • 2020
  • The small tracking radar targets the target in a real-time, fast-moving, fast-moving target against aircraft with a large RCS that is maneuvering at low speed and a small RCS aircraft maneuvering at high speed (fighters, drones, helicopters, etc.) It is a pulsed radar that detects and tracks. Performing a performance test on a tracking radar in a real environment is expensive, and it is difficult to quantitatively measure performance in a real environment. Describes the composition of the laboratory environment's comprehensive performance test facility and the main requirements and implementation of each configuration.Anechoic chambers to simulate the room environment, simulation target generator to simulate the signal of the room target, target It is composed of a horn antenna driving device to simulate the movement of a vehicle and a Flight Motion Simulatior (FMS) to simulate the flight environment of a tracking radar, and each design and implementation has been described.