• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.3
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• pp.85-92
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• 2015

SiC crystals are well known for their true potential as high power devices and their crystal growth activity is actively carried out in domestic as well as in abroad. Until now the process to grow this crystal has been done by sublimation technique using radio frequency induction heating method. However in order to get better quality of SiC crystals, the stability of temperature is needed because SiC crystal tends to transform to other polytypes. So, the possibility of SiC crytals growth was evaluated by different heating method. This study aimed to observe whether the resistant heating method would show stable growth and better quality of SiC single crystal than that of RF induction heating. As a result, polycrystalline SiC crystals were grown by the growth rate of 0.02~0.5 mm/hr under the condition of $2100{\sim}2300^{\circ}C$ at the bottom side of the crucible and 10~760 torr. The polycrystalline SiC crystals with 0.25 and 0.5 mm in thickness were grown successfully without seed and characterized by optical stereo microscopic observation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.8 s.350
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• pp.6-12
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• 2006

Recently, according to the rapid development of mobile system, the development of relative mobile components has been required, and especially, with the miniaturization of mobile component, the complex with nearby components has been progressed. In this paper, multi-output VC-TCXO (Voltage Controlled-Temperature Compensated Crystal Oscillator) for WCDMA integrates the additional CMOS inverter, so it can be the normal clipped sinewave output and additional CMOS output, and also it can be satisfied the VC-TCXO's requirements for WCDMA system. And the important characteristics of reference oscillator, like phase noise and frequency short term stability, are satisfied with WCDMA(UMTS) system's requirement In this paper, however, 25MHz is used for reference frequency, similarly and practically, we think that it can be used from 10MHz to 40MHz.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.9
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• pp.862-867
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• 2009

This paper presents a study on a rectenna for rectification of incident low power microwave signals with power densities less than 2 mW/$cm^2$ at 2.45 GHz. The proposed rectenna is designed and implemented by a rectifier with voltage doubler structure and a printed Yagi antenna which suppress re-radiation of the second order harmonic of fundamental frequency. The printed Yagi antenna has a gain of about 5 dB, and the measured conversion efficiencies of the rectenna are from 32 % to 42 % when its incident power levels are from 0 dBm to 14 dBm. The developed rectenna is expected to be useful in the power transmission system.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.8B
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• pp.1464-1471
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• 1999

A wide-band high power amplifier to use for radiated electromagnetic field immunity testing of EMS(Electromagnetic Susceptibility) standards has to meet IEC1000-4-3 specification in the frequency bandwidth of 80MHz to 1000MHz. The power amplifier to be described in this paper consists of driving and power stages with wide-band matched circuits by estimated impedances. The mismatching protection circuit is inserted in it to prevent from damage of power device when the output port of power amplifier is opened or shorted by user's mistake. The characteristics of the power amplifier are obtained output power over 100watts, gain over 40dB and flatness of $\pm$0.3dB in the frequency range of 80 ~300MHz. The harmonics suppression characteristics is measured over 20dBc. This wide-band high power amplifier can be useful fur radiated electromagnetic field immunity testing of IEC 1000-4-3 standard.

• The Transactions of the Korean Institute of Power Electronics
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• v.14 no.6
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• pp.440-448
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• 2009

Facility power-line electromagnetic interference (EMI) filters are used to provide radio frequency(RF) isolation between dedicated power distribution services and noise sensitive local power distribution systems. This type of EMI filters generally needs a high current capacity and, in some special applications, a high insertion loss of a minimum 100dB from 14kHz through 10GHz per MIL-STD 220 is required. This paper deals with an analysis and design of a wideband facility power-line EMI filter with the above requirements. The characteristics of the inductor and capacitor at high frequencies are investigated. The characteristics and design method of the facility EMI filter with a high order LC network are also presented. The prototype filter is finally implemented and its performance is verified from the experimental results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.5
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• pp.397-402
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• 2010

In this paper, we studied WVTR(water vapor transmission rate) properties of $Si_3N_4$ thin film that was deposited using TCP-CVD (transformer coupled plasma chemical vapor deposition) method for the possibility of OLED(organic light emitting diode) encapsulation. Considering the conventional OLED processing temperature limit of below $80^{\circ}C$, the $Si_3N_4$ thin films were deposited at room temperature. The $Si_3N_4$ thin films were prepared with the process conditions: $SiH_4$ and $N_2$, as reactive gases; working pressure below 15 mTorr; RF power for TCP below 500 W. Through MOCON test for WVTR, we analyzed water vapor permeation per day. We obtained that WVTR property below 6~0.05 gm/$m^2$/day at process conditions. The best preparation condition for $Si_3N_4$ thin film to get the best WVTR property of 0.05 gm/$m^2$/day were $SiH_4:N_2$ gas flow rate of 10:200 sccm, working pressure of 10 mTorr, working distance of 70 mm, TCP power of 500 W and film thickness of 200 nm. respectively. The proposed results indicates that the $Si_3N_4$ thin film could replace metal or glass as encapsulation for flexible OLED.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.37-42
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• 2004

In the electronic components and devices fabrication, thin film resistors with low TCR (temperature coefficient of resistance) and high precision have been used over 3 ㎓ microwave in recent years. Ni-Cr alloys thin films resistors is one of the most commonly used resistive materials because they have low TCR and highly stable resistance. In this work, we fabricated thin film resistors using Evanohm alloys target(72Ni-20Cr-3Al-4Mn-Si) of S-type with excellent resistors properties by RF-sputtering. Also we reported the best annealing condition of thin film resistors for microwave to observe microstructure and electronic properties of thin film according to annealing conditions($200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, $500^{\circ}C$)

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.2
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• pp.325-331
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• 2010

In this study, highly miniaturized short-wavelength meander line employing eriodically patterned ground structure (PPGS) was developed for application to miniaturized on-chip passive component on GaAs MMIC (monolithic microwave integrated circuit). The meander line employing PPGS showed shorter wavelength and slow-wave characteristic compared with conventional meander line. The wavelength of the meander line employing PPGS structure was 17 % of the conventional meander line on GaAs MMIC. Due to its slow-wave structure, the meander line employing PPGS exhibited large propagation constant than conventional meander line, which resulted in larger phase shift and shunt inductance value. Above results indicate that the meander line employing PPGS is a promising candidate for application to a development of miniaturized on-chip RF components as well as inductor with a high inductance value on GaAs MMIC.

• Korean Journal of Optics and Photonics
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• v.20 no.2
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• pp.71-75
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• 2009

A compact electric field probe sensor incorporating two different electro-optic materials of $LiNbO_3$ and GaAs was proposed and fabricated, and it was used to measure the strength of the horizontal and vertical fields generated by a microstrip ring-resonator filter. The sensitivities of the sensors in $LiNbO_3$ and GaAs were $9.315{\mu}V/\sqrt{Hz}$ and ${\sim}49.346{\mu}V/\sqrt{Hz}$ respectively, and their signal to noise ratios were approximately ${\sim}50\;dB$ and ${\sim}40\;dB$ respectively. And the operating frequency range was up to ${\sim}1.2\;GHz$. The electric field profile for the test circuit was scanned and found to be in good agreement with that obtained by using the HFSS simulation.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.111-111
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• 1999

반도체 소자의 고집적화 및 고속화에 따라 다층 금속배선에서의 RC 지연이 전체 지연의 주된 요소로 되고 있다. 이런 RC 진연을 줄이기 위해서 현재 다층 금속배선의 층간 절연막으로 사용하고 있는 SiO2 박막(k~3.9)을 보다 낮은 유전상수(low-k)를 가지는 물질로 대체할 것이 요구된다. 층간 절연막으로서 가져야 할 가장 중요한 것은 낮은 유전상수와 높은 열적안정성($\geq$45$0^{\circ}C$)이다. 본 연구에서는 Toluene을 precursor로 사용한 PECVD방법으로 low-k 유사중합체 유기박막을 성장시켰으며 부동한 온도에서 성장된 박막의 특성을 비교하여 증착온도가 박막의 특성에 미치는 영향에 대하여 조사하였다. 유사중합체 유기박막은 platinum(Pt)기판과 silicon 기판위에 같이 증착되었다. Precursor는 4$0^{\circ}C$로 유지된 bubbler에 담겨지고 증발된 precursor molecules는 Argon(Ar:99.999%) carrier 가스에 의해 process reactor 내부로 유입된다. Plasma는 RF(13.56MHz generator로 연결된 susceptor 주위에 발생시켰다. Silicon 기판위에 증착한 시편으로 Fourier transform infrared (FTIR) spectra 및 열적 안정성을 측정하였고, Pt 기판위에 증착한 시편으로 Al/유기박막/Pt 구조의 capacitor를 만들어 열적안정성을 측정하였고, Pt 기판위에 증착한 시편으로는 Al/유기박막/Pt 구조의 capacitor를 만들어 K값 및 절연성을 측정하였다. Capacitance는 1MHz 주파수에서 측정하였다. 열적안정성은 30분동안 Ar 분위기에서 annealing하기 전후의 증착막의 두께의 변화를 측정함으로써 조사하였으며 유기박막의 두께는 surface profilometer로 측정하였다. 증착온도가 45$^{\circ}C$에서 15$0^{\circ}C$, 25$0^{\circ}C$로 높아짐에 따라 k값은 높아졌지만 대신 열적안정성은 좋아졌다. plasma power 30W인 경우 45$^{\circ}C$에서 증착했을 때 유전상수는 2.80으로 낮았지만 40$0^{\circ}C$에서 30분 동안 열처리한 후 두께가 49% 감소하였다. 그러나 25$0^{\circ}C$에서 증착했을 때 유전상수는 3.10으로 좀 높아졌지만 열적으로는 40$0^{\circ}C$까지 안정하였으며 45$0^{\circ}C$에서도 두께의 감소는 8%에 불과했다.