• Journal of the Korea Concrete Institute
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• v.15 no.2
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• pp.197-208
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• 2003

This paper is to determine the possibility of re-using waste concrete from Incheon city area. The strength test was conducted with five aggregate compounds which was replaced a natural aggregate with recycled aggregate. After checking the physical characteristics of recycled aggregate compounds, the mix design of recycled concrete was conducted. For the relatively comparison between natural and recycled compounds, while the unit aggregate weight was changed, other conditions were fixed. The freezing and thawing test which included fly-ash and super-plastezer were performed to check the durability and workability when recycling waste concrete. In the physical characteristics of recycled aggregate, it was found that the specific gravity of recycled coarse aggregate and recycled fine aggregate satisfied the first grade of recycle specification(KS), and all compounds of recycled aggregate also satisfied the second grade of absorption specification, Especially up to the 50% substitution of recycled aggregate is equal to or a bit lower than that of convention aggregate. In comparison with conventional concrete, the recycled concrete is lower than maximum by 7% in compressive strength decreasing rate after freezing-thawing test. From now, although most of recycled concrete was used to the building lot, subgrade, asphalt admixture, through the result. It was proved that possibility of re-using recycled aggregate as the substructure of bridge, retaining wall, tunnel lining and concrete structure which is not attacked the drying shrinkage severely.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.38 no.2
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• pp.193-202
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• 2018

This paper proposed a crack spacing calculation formulation which is an important parameter for calculating the crack width, that is the main factor for verification of serviceability limit states and durability performance evaluation of reinforced concrete members. The basic equation of average crack spacing is derived by considering the bond characteristics which is the governing equation for the analysis of cracking behavior in reinforced concrete members. In order to consider the effect of the cover thickness and concrete compressive strength, the crack spacing measured in 124 direct tensile tests performed by several researchers was analyzed and each coefficient was proposed. And, correlation analysis was performed from 80 specimen data where the maximum and average crack spacing were simultaneously measured, and a correlation coefficient that can easily predict the maximum crack spacing from the average crack spacing was proposed. The results of the proposed average crack spacing equation and maximum crack spacing correlation were compared with those current design code specification. The comparisons of proposed equations and the Korean design codes show that the proposed formulation for the average crack spacing and the maximum crack spacing improves the accuracy and reliability of prediction compared to the corresponding provisions of the Korean Concrete Structural Design Code and Korean Highway Bridge Design Code (Limit States Design).

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Structural Engineering and Mechanics
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• v.70 no.1
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• pp.67-80
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• 2019

Strengthening with near surface mounted carbon fibre reinforced polymers (NSM-CFRP) is a strengthening technique that have been used for several decades to increase the load carrying capacity of reinforced concrete members. In Iraq, many concrete buildings and bridges were subjected to a wide range of damage as a result of the last war and many other events. Accordingly, there is a progressive increase in the strengthening of concrete structures, bridges in particular, by using CFRP strengthening techniques. Near-surface mounted carbon fibre polymer has been recently proved as a powerful strengthening technique in which the CFRP strips are sufficiently protected against external environmental conditions especially the high-temperature rates in Iraq. However, this technique has not been examined yet under repeated loading conditions such as traffic loads on bridge girders. The main objective of this research was to investigate the effectiveness of NSM-CFRP strips in reinforced concrete beams under repeated loads. Different parameters such as the number of strips, groove size, and two types of bonding materials (epoxy resin and cement-based adhesive) were considered. Fifteen NSM-CFRP strengthened beams were tested under concentrated monotonic and repeated loadings. Three beams were non-strengthened as reference specimens while the remaining were strengthened with NSM-CFRP strips and divided into three groups. Each group comprises two beams tested under monotonic loads and used as control for those tested under repeated loads in the same group. The experimental results are discussed in terms of load-deflection behavior up to failure, ductility factor, cumulative energy absorption, number of cycles to failure, and the mode of failure. The test results proved that strengthening with NSM-CFRP strips increased both the flexural strength and stiffness of the tested beams. An increase in load carrying capacity was obtained in a range of (1.47 to 4.49) times that for the non-strengthened specimens. Also, the increase in total area of CFRPs showed a slight increase in flexural capacity of (1.02) times the value of the control strengthened one tested under repeated loading. Increasing the total area of CFRP strips resulted in a reduction in ductility factor reached to (0.71) while the cumulative energy absorption increased by (1.22) times the values of the strengthened reference specimens tested under repeated loading. Moreover, the replacement of epoxy resin with cement-based adhesive as a bonding material exhibited higher ductility than specimen with epoxy resin tested under monotonic and repeated loading.