• Title/Summary/Keyword: RAMAN

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Electrochemical Properties of SiOx Anode for Lithium-Ion Batteries According to Particle Size and Carbon Coating (입자 크기 및 탄소 코팅에 따른 리튬이온배터리용 SiOx 음극활물질의 전기화학적 특성)

  • Anna Park;Byung-Ki Na
    • Korean Chemical Engineering Research
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    • v.62 no.1
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    • pp.19-26
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    • 2024
  • In this study, the electrochemical properties of SiOx@C composite materials were prepared to alleviate volume expansion and cycle stability of silicon and to increase the capacity of anode material for LIBs. SiO2 particles of 100, 200, and 500 nm were synthesized by the Stӧber method, and reduced to SiOx (0≤x≤2) through the magnesiothermic reduction method. Then, SiOx@C anode materials were synthesized by carbonization of PVC on SiOx. The physical properties of prepared SiOx and SiOx@C anode materials were analyzed by XRD, SEM, TGA, Raman spectroscopy, XPS and BET. The electrochemical properties were investigated by cycling performance, rate performance, CV and EIS test. As a result, the SiOx@C-7030 manufactured by coating carbon at SiOx : C = 70 : 30 on a 100 nm SiOx with the smallest particle size showed the best electrochemical properties with a discharge capacity of 1055 mAh/g and a capacity retention rate of 81.9% at 100 cycles. It was confirmed that cycle stability was impoved by reducing particle size and carbon coating.

Catalytic Effects on Graphitized Carbon Fibers of Graphitization Catalysts Introduced during Hot-Water Stretching (열수 연신시 흑연화 촉매 도입에 따른 탄소섬유의 흑연화 촉진효과)

  • Hyun-Jae Cho;Hye Rin Lee;Byoung-Suhk, Kim;Yong-Sik, Chung
    • Composites Research
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    • v.37 no.3
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    • pp.162-169
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    • 2024
  • In this study, PAN(polyacrylonitrile)-based precursor fibers were produced through a wet-spinning process, and their morphologies and graphitization behavior were investigated in the presence of two graphitization catalysts (Ca, Ni). The graphitization catalysts were introduced into the formed pores during hot-water stretching of wet-spun PAN-based precursor fibers. The catalytic effects of graphitization catalysts were examined through crystal structure and Raman analysis. At a relatively low temperature of 1500℃, the graphitization was not significantly affected, whereas at a high temperature of 2400℃, the obtained ID/IG value of graphite fiber (GF-Ni100) was decreased by about twice (~0.28) compared to the untreated fibers (GF-AS~0.54). By comparing the ID/IG values (GF-Ca100~0.42: GF-Ni100~0.28) of Ca and Ni graphitization catalyst, it was found that the degree of graphitization of Ni graphitization catalyst showed higher influence than that of Ca graphitization catalyst. Moreover, 2D band was also observed, indicating that the graphite plane structures composed of multiple layers were developed. XRD results confirmed that the crystal inter-planar distance (d002) of the graphite crystal was slightly decreased after the treatment with the graphitization catalyst, But, the crystal size of Ca-treated graphite fiber (GF-Ca100) was increased by up to ~5 nm.

Highly Doped Nano-crystal Embedded Polymorphous Silicon Thin Film Deposited by Using Neutral Beam Assisted CVD at Room Temperature

  • Jang, Jin-Nyeong;Lee, Dong-Hyeok;So, Hyeon-Uk;Hong, Mun-Pyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.154-155
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    • 2012
  • The promise of nano-crystalites (nc) as a technological material, for applications including display backplane, and solar cells, may ultimately depend on tailoring their behavior through doping and crystallinity. Impurities can strongly modify electronic and optical properties of bulk and nc semiconductors. Highly doped dopant also effect structural properties (both grain size, crystal fraction) of nc-Si thin film. As discussed in several literatures, P atoms or radicals have the tendency to reside on the surface of nc. The P-radical segregation on the nano-grain surfaces that called self-purification may reduce the possibility of new nucleation because of the five-coordination of P. In addition, the P doping levels of ${\sim}2{\times}10^{21}\;at/cm^3$ is the solubility limitation of P in Si; the solubility of nc thin film should be smaller. Therefore, the non-activated P tends to segregate on the grain boundaries and the surface of nc. These mechanisms could prevent new nucleation on the existing grain surface. Therefore, most researches shown that highly doped nc-thin film by using conventional PECVD deposition system tended to have low crystallinity, where the formation energy of nucleation should be higher than the nc surface in the intrinsic materials. If the deposition technology that can make highly doped and simultaneously highly crystallized nc at low temperature, it can lead processes of next generation flexible devices. Recently, we are developing a novel CVD technology with a neutral particle beam (NPB) source, named as neutral beam assisted CVD (NBaCVD), which controls the energy of incident neutral particles in the range of 1~300eV in order to enhance the atomic activation and crystalline of thin films at low temperatures. During the formation of the nc-/pm-Si thin films by the NBaCVD with various process conditions, NPB energy directly controlled by the reflector bias and effectively increased crystal fraction (~80%) by uniformly distributed nc grains with 3~10 nm size. In the case of phosphorous doped Si thin films, the doping efficiency also increased as increasing the reflector bias (i.e. increasing NPB energy). At 330V of reflector bias, activation energy of the doped nc-Si thin film reduced as low as 0.001 eV. This means dopants are fully occupied as substitutional site, even though the Si thin film has nano-sized grain structure. And activated dopant concentration is recorded as high as up to 1020 #/$cm^3$ at very low process temperature (< $80^{\circ}C$) process without any post annealing. Theoretical solubility for the higher dopant concentration in Si thin film for order of 1020 #/$cm^3$ can be done only high temperature process or post annealing over $650^{\circ}C$. In general, as decreasing the grain size, the dopant binding energy increases as ratio of 1 of diameter of grain and the dopant hardly be activated. The highly doped nc-Si thin film by low-temperature NBaCVD process had smaller average grain size under 10 nm (measured by GIWAXS, GISAXS and TEM analysis), but achieved very higher activation of phosphorous dopant; NB energy sufficiently transports its energy to doping and crystallization even though without supplying additional thermal energy. TEM image shows that incubation layer does not formed between nc-Si film and SiO2 under later and highly crystallized nc-Si film is constructed with uniformly distributed nano-grains in polymorphous tissues. The nucleation should be start at the first layer on the SiO2 later, but it hardly growth to be cone-shaped micro-size grains. The nc-grain evenly embedded pm-Si thin film can be formatted by competition of the nucleation and the crystal growing, which depend on the NPB energies. In the evaluation of the light soaking degradation of photoconductivity, while conventional intrinsic and n-type doped a-Si thin films appeared typical degradation of photoconductivity, all of the nc-Si thin films processed by the NBaCVD show only a few % of degradation of it. From FTIR and RAMAN spectra, the energetic hydrogen NB atoms passivate nano-grain boundaries during the NBaCVD process because of the high diffusivity and chemical potential of hydrogen atoms.

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Silicon thin films and solar cells by HWCVD (열선 화학 기상 증착법에 의한 실리콘 박막 및 태양전지 특성)

  • Kim Sang-Kyun;Lee Jeong Chul;Jeon Sang Won;Lim Chung Hyun;Ahn Sae Jin;Yun Jae Ho;Kim Seok Ki;Song Jinsoo;Park S-J;Yoon Kyung Hoon
    • 한국신재생에너지학회:학술대회논문집
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    • 2005.06a
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    • pp.205-208
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    • 2005
  • 최근 열선 화학 기상 증착법(HWCVD)은 낮은 온도에서 TFT용 Poly Si 중착을 할 수 있다는 점과 실리콘 박막을 빠른 속도로 증착할 수 있다는 점에서 각광을 받고 있다. 본 연구에서는 HWCVD를 이용하여 태양전지를 제조하고 그 특성을 평가하였다. 조건에 따른 실리콘 박막의 특성 변화를 알기 위해 corning glass 및 실리콘 wafer에 다양한 조건에서 단위 박막(intrinsic layer)을 증착하였고 이 결과를 바탕으로 p/i/n 구조의 태양전지를 제조하였다. Ta 열선 온도는 1700-2000도였고 가스 원료인 $SiH_4$와 수소의 비율을 조절하면서 그 영향을 관찰하였다. 태양전지의 경우 p충과 n충은 PECVD로 증착하였으며 단위박막 및 태양전지 i충 증착시 기판과 열선간의 거리는 7cm, 기판 온도는 $200^{\circ}C$$250^{\circ}C$로 고정하였고 작업압력은 30mTorr였다. 단위 박막 특성 평가를 위해 암/광 전도도, SEM, Raman Scattering, FT-IR등을 사용하였으며 태양전지 특성 평가를 위해 I-V 및 Spectral response를 측정하였다. 열선 온도가 증가함에 따라 증착속도 및 결정화 분율은 증가하였다. 특히 비정질에서 결정질로 전이되는 구간은 매우 좁았으며 여러 분석 방법에서 일치되는 결과를 보였다. $SiH_4$ 유량이 늘어날수록 비정질이 결정질로 바뀌는 열선 온도가 증가하였으며 기판 온도가 낮을 경우 또한 결정으로 바뀌는 열선 온도가 증가하였다. 태양전지의 경우 열선 온도가 증가함에 따라 $V_{oc}$ 및 W가 낮아졌으며 $J_{sc}$, 는 증가하는 경향을 보였으며 결정질 비율이 증가하는 것을 관찰할 수 있었다. 이러한 경향은 quantum efficiency 결과에서도 확인할 수 있었다.용을 반복하면서 석재 내부와 외부의 암석 및 결정에 균열과 미세열극 등이 생성되어 석재 자체의 구조적 안정성에 영향을 주고 있다. 따라서 감은사지 석탑은 지리적 환경 차이로 인해 일반적인 환경의 석조물들과는 다른 형태의 풍화양상을 보이고 있어서 풍화양상 및 풍화형태에 대한 정확한 연구와 이해를 바탕으로 보존대책이 마련되어야 한다.되었다. 이런 모든 시편들을 각 탈염방법에 따라 탈염처리한 후 XRD와 SEM-EDS으로 분석한 결과 인철광과 침철광은 어떠한 변화도 보이지 않았고, 다만 적금광으로 동정된 시편만이 잔존하지 않았다. 철기 제작별 $Cl^-$ 이온 추출량과 탈염효과에 대한 비교 실험은 이온 크로마토그래피 분석 결과와 마찬가지로 단조 철제유물이 주조 철제보다 $Cl^-$ 이온을 많이 가지고 있었으며, 탈염 처리 후에는 $Cl^-$ 이온은 전혀 발견되지 않았다. 이상의 결과 $K_2CO_3$와 Sodium 용액은 탈염처리에서 가장 적합한 탈염처리 용액으로 알수가 있었으며 특히 어떠한 탈염 용액으로 유물을 처리한다 해도 철제유물에 생성된 부식물은 제거되지 않는다는 것을 알게 되었다. 따라서 보존처리자는 유물 표면의 부식 상태만을 보고 처리하기 보다는 철기제작물로 고려하여 처리하는 것이 필요하다. 또한 금속에 부식을 야기시키는 $Cl^-$ 이온과 부식물을 완전하게 제거하여 탈염처리를 하는 것이 유물 부식을 최대한 지연시킬 수 있는 것이라 생각된다.TEX>$88\%$)였다.(P=0.063). 결론: 본 연구에서는 MTHFR C/T & T/T 유전자 다형성이 위암의 발생과 그 위치에 대해 관련이 있는 것으로 여겨지고, 흡연력, 음주력과는 관련이 없는 것으로 여겨진다.험이 커지는 경향을 보였으나, 나이 및 병기, 종양의 크기, MD-BED $Gy_{10}$ 등의 예후 인자를 보정한 다변

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Preparation of Nanoporous Activated Carbon with Sulfuric Acid Lignin and Its Application as a Biosorbent (황산 가수분해 잔사 리그닌을 이용한 나노 세공 활성탄 제조 및 친환경 흡착제로의 활용 가능성 평가)

  • Hwang, Hyewon;Choi, Joon Weon
    • Journal of the Korean Wood Science and Technology
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    • v.46 no.1
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    • pp.17-28
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    • 2018
  • In this study, catalytic activation using sulfuric acid lignin (SAL), the condensed solid by-product from saccharification process, with potassium hydroxide at $750^{\circ}C$ for 1 h in order to investigate its potential to nanoporous carbon In this study, catalytic activation using sulfuric acid lignin (SAL), the condensed solid by-product from saccharification process, with potassium hydroxide at $750^{\circ}C$ for 1 h in order to investigate its potential to nanoporous carbon material. Comparison study was also conducted by production of activated carbon from coconut shell (CCNS), Pinus, and Avicel, and each activated carbon was characterized by chemical composition, Raman spectroscopy, SEM analysis, and BET analysis. The amount of solid residue after thermogravimetric analysis of biomass samples at the final temperature of $750^{\circ}C$ was SAL > CCNS > Pinus > Avicel, which was the same as the order of activated carbon yields after catalytic activation. Specifically, SAL-derived activated carbon showed the highest value of carbon content (91.0%) and $I_d/I_g$ peak ratio (4.2), indicating that amorphous large aromatic structure layer was formed with high carbon fixation. In addition, the largest changes was observed in SAL with the maximum BET specific surface area and pore volume of $2341m^2/g$ and $1.270cm^3/g$, respectively. Furthermore, the adsorption test for three kinds of organic pollutants (phenol, 2,4-Dichlorophenoxyacetic acid, and carbofuran) were conducted, and an excellent adsorption capacity more than 90 mg/g for all activated carbon was determined using 100 ppm of the standard solution. Therefore, SAL, a condensed structure, can be used not only as a nanoporous carbon material with high specific surface area but also as a biosorbent applied to a carbon filter for remediation of organic pollutants in future.

Low temperature plasma deposition of microcrystalline silicon thin films for active matrix displays: opportunities and challenges

  • Cabarrocas, Pere Roca I;Abramov, Alexey;Pham, Nans;Djeridane, Yassine;Moustapha, Oumkelthoum;Bonnassieux, Yvan;Girotra, Kunal;Chen, Hong;Park, Seung-Kyu;Park, Kyong-Tae;Huh, Jong-Moo;Choi, Joon-Hoo;Kim, Chi-Woo;Lee, Jin-Seok;Souk, Jun-H.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.107-108
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    • 2008
  • The spectacular development of AMLCDs, been made possible by a-Si:H technology, still faces two major drawbacks due to the intrinsic structure of a-Si:H, namely a low mobility and most important a shift of the transfer characteristics of the TFTs when submitted to bias stress. This has lead to strong research in the crystallization of a-Si:H films by laser and furnace annealing to produce polycrystalline silicon TFTs. While these devices show improved mobility and stability, they suffer from uniformity over large areas and increased cost. In the last decade we have focused on microcrystalline silicon (${\mu}c$-Si:H) for bottom gate TFTs, which can hopefully meet all the requirements for mass production of large area AMOLED displays [1,2]. In this presentation we will focus on the transfer of a deposition process based on the use of $SiF_4$-Ar-$H_2$ mixtures from a small area research laboratory reactor into an industrial gen 1 AKT reactor. We will first discuss on the optimization of the process conditions leading to fully crystallized films without any amorphous incubation layer, suitable for bottom gate TFTS, as well as on the use of plasma diagnostics to increase the deposition rate up to 0.5 nm/s [3]. The use of silicon nanocrystals appears as an elegant way to circumvent the opposite requirements of a high deposition rate and a fully crystallized interface [4]. The optimized process conditions are transferred to large area substrates in an industrial environment, on which some process adjustment was required to reproduce the material properties achieved in the laboratory scale reactor. For optimized process conditions, the homogeneity of the optical and electronic properties of the ${\mu}c$-Si:H films deposited on $300{\times}400\;mm$ substrates was checked by a set of complementary techniques. Spectroscopic ellipsometry, Raman spectroscopy, dark conductivity, time resolved microwave conductivity and hydrogen evolution measurements allowed demonstrating an excellent homogeneity in the structure and transport properties of the films. On the basis of these results, optimized process conditions were applied to TFTs, for which both bottom gate and top gate structures were studied aiming to achieve characteristics suitable for driving AMOLED displays. Results on the homogeneity of the TFT characteristics over the large area substrates and stability will be presented, as well as their application as a backplane for an AMOLED display.

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The role of porous graphite plate for high quality SiC crystal growth by PVT method (고품질 4H-SiC 단결정 성장을 위한 다공성 흑연 판의 역할)

  • Lee, Hee-Jun;Lee, Hee-Tae;Shin, Hee-Won;Park, Mi-Seon;Jang, Yeon-Suk;Lee, Won-Jae;Yeo, Im-Gyu;Eun, Tai-Hee;Kim, Jang-Yul;Chun, Myoung-Chul;Lee, Si-Hyun;Kim, Jung-Gon
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.25 no.2
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    • pp.51-55
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    • 2015
  • The present research is focused on the effect of porous graphite what is influenced on the 4H-SiC crystal growth by PVT method. We expect that it produces more C-rich and a change of temperature gradient for polytype stability of 4H-SiC crystal as adding the porous graphite in the growth cell. The SiC seeds and high purity SiC source materials were placed on opposite side in a sealed graphite crucible which was surrounded by graphite insulator. The growth temperature was around $2100{\sim}2300^{\circ}C$ and the growth pressure was 10~30 Torr of an argon pressure with 5~15 % nitrogen. 2 inch $4^{\circ}$ off-axis 4H-SiC with C-face (000-1) was used as a seed material. The porous graphite plate was inserted on SiC powder source to produce a more C-rich for polytype stability of 4H-SiC crystal and uniform radial temperature gradient. While in case of the conventional crucible, various polytypes such as 6H-, 15R-SiC were observed on SiC wafers, only 4H-SiC polytype was observed on SiC wafers prepared in porous graphite inserted crucible. The defect level such as MP and EP density of SiC crystal grown in the conventional crucible was observed to be higher than that of porous graphite inserted crucible. The better crystal quality of SiC grown using porous graphite plate was also confirmed by rocking curve measurement and Raman spectra analysis.

PREPARATION OF AMORPHOUS CARBON NITRIDE FILMS AND DLC FILMS BY SHIELDED ARC ION PLATING AND THEIR TRIBOLOGICAL PROPERTIES

  • Takai, Osamu
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2000.11a
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    • pp.3-4
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    • 2000
  • Many researchers are interested in the synthesis and characterization of carbon nitride and diamond-like carbon (DLq because they show excellent mechanical properties such as low friction and high wear resistance and excellent electrical properties such as controllable electical resistivity and good field electron emission. We have deposited amorphous carbon nitride (a-C:N) thin films and DLC thin films by shielded arc ion plating (SAIP) and evaluated the structural and tribological properties. The application of appropriate negative bias on substrates is effective to increase the film hardness and wear resistance. This paper reports on the deposition and tribological OLC films in relation to the substrate bias voltage (Vs). films are compared with those of the OLC films. A high purity sintered graphite target was mounted on a cathode as a carbon source. Nitrogen or argon was introduced into a deposition chamber through each mass flow controller. After the initiation of an arc plasma at 60 A and 1 Pa, the target surface was heated and evaporated by the plasma. Carbon atoms and clusters evaporated from the target were ionized partially and reacted with activated nitrogen species, and a carbon nitride film was deposited onto a Si (100) substrate when we used nitrogen as a reactant gas. The surface of the growing film also reacted with activated nitrogen species. Carbon macropartic1es (0.1 -100 maicro-m) evaporated from the target at the same time were not ionized and did not react fully with nitrogen species. These macroparticles interfered with the formation of the carbon nitride film. Therefore we set a shielding plate made of stainless steel between the target and the substrate to trap the macropartic1es. This shielding method is very effective to prepare smooth a-CN films. We, therefore, call this method "shielded arc ion plating (SAIP)". For the deposition of DLC films we used argon instead of nitrogen. Films of about 150 nm in thickness were deposited onto Si substrates. Their structures, chemical compositions and chemical bonding states were analyzed by using X-ray diffraction, Raman spectroscopy, X-ray photoelectron spectroscopy and infrared spectroscopy. Hardness of the films was measured with a nanointender interfaced with an atomic force microscope (AFM). A Berkovich-type diamond tip whose radius was less than 100 nm was used for the measurement. A force-displacement curve of each film was measured at a peak load force of 250 maicro-N. Load, hold and unload times for each indentation were 2.5, 0 and 2.5 s, respectively. Hardness of each film was determined from five force-displacement curves. Wear resistance of the films was analyzed as follows. First, each film surface was scanned with the diamond tip at a constant load force of 20 maicro-N. The tip scanning was repeated 30 times in a 1 urn-square region with 512 lines at a scanning rate of 2 um/ s. After this tip-scanning, the film surface was observed in the AFM mode at a constant force of 5 maicro-N with the same Berkovich-type tip. The hardness of a-CN films was less dependent on Vs. The hardness of the film deposited at Vs=O V in a nitrogen plasma was about 10 GPa and almost similar to that of Si. It slightly increased to 12 - 15 GPa when a bias voltage of -100 - -500 V was applied to the substrate with showing its maximum at Vs=-300 V. The film deposited at Vs=O V was least wear resistant which was consistent with its lowest hardness. The biased films became more wear resistant. Particularly the film deposited at Vs=-300 V showed remarkable wear resistance. Its wear depth was too shallow to be measured with AFM. On the other hand, the DLC film, deposited at Vs=-l00 V in an argon plasma, whose hardness was 35 GPa was obviously worn under the same wear test conditions. The a-C:N films show higher wear resistance than DLC films and are useful for wear resistant coatings on various mechanical and electronic parts.nic parts.

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Dry reforming of Propane to Syngas over Ni-CeO2/γ-Al2O3 Catalysts in a Packed-bed Plasma Reactor (충전층 플라즈마 반응기에서 Ni-CeO2/γ-Al2O3 촉매를 이용한 프로페인-합성 가스 건식 개질)

  • Sultana, Lamia;Rahman, Md. Shahinur;Sudhakaran, M.S.P.;Hossain, Md. Mokter;Mok, Young Sun
    • Clean Technology
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    • v.25 no.1
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    • pp.81-90
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    • 2019
  • A dielectric barrier discharge (DBD) plasma reactor packed with $Ni-CeO_2/{\gamma}-Al_2O_3$ catalyst was used for the dry ($CO_2$) reforming of propane (DRP) to improve the production of syngas (a mixture of $H_2$ and CO) and the catalyst stability. The plasma-catalytic DRP was carried out with either thermally or plasma-reduced $Ni-CeO_2/{\gamma}-Al_2O_3$ catalyst at a $C_3H_8/CO_2$ ratio of 1/3 and a total feed gas flow rate of $300mL\;min^{-1}$. The catalytic activities associated with the DRP were evaluated in the range of $500{\sim}600^{\circ}C$. Following the calcination in ambient air, the ${\gamma}-Al_2O_3$ impregnated with the precursor solution ($Ni(NO_3)_2$ and $Ce(NO_3)_2$) was subjected to reduction in an $H_2/Ar$ atmosphere to prepare $Ni-CeO_2/{\gamma}-Al_2O_3$ catalyst. The characteristics of the catalysts were examined using X-ray diffraction (XRD), transmission electron microscopy (TEM), field emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectrometry (EDS), temperature programmed reduction ($H_2-TPR$), temperature programmed desorption ($H_2-TPD$, $CO_2-TPD$), temperature programmed oxidation (TPO), and Raman spectroscopy. The investigation revealed that the plasma-reduced $Ni-CeO_2/{\gamma}-Al_2O_3$ catalyst exhibited superior catalytic activity for the production of syngas, compared to the thermally reduced catalyst. Besides, the plasma-reduced $Ni-CeO_2/{\gamma}-Al_2O_3$ catalyst was found to show long-term catalytic stability with respect to coke resistance that is main concern regarding the DRP process.