• 한국산업융합학회 논문집
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• 제21권5호
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• pp.191-195
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• 2018

By using an ANSYS product suite (CFX, Ansys Multiphysics), which is a powerful tool for multiphysics analysis of complicated physical phenomena, we performed a structural stress analysis based on fluid flow and heat transfer phenomena within a quick connect/disconnect (QC/DC) bellows system. Considering the extremely low temperatures in the QC/DC environment, an approach to the problem based on complex multi-physics phenomena, where different phenomena interact with each other, is crucial. Therefore, we use a numerical analysis technique where fluid-thermal-structural interactions are combined. In conclusion, when low temperature fluids flow inside bellows, the expected service life is conspicuously reduced due to the thermal stress caused by heat transfer. Therefore, in future research, a structure with considerably reduced thermal stress by robust design optimization will be derived.