• Journal of the Korean institute of surface engineering
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• v.47 no.1
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• pp.1-6
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• 2014

The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.521-530
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• 1999

The corrosion resistance and the hardness of the tin-nickel alloy deposits electroplated in pyrophosphate bath were invesitigated according to electrolysis conditions and microstructure of the alloy. The weight loss of alloy deposits increased with the Sn content of single phase (Ni-Sn) alloy showing the lowest weight loss in the alloy with 54∼57wt% Sn. On the other hand, the multiphase alloy with 35∼42wt% Sn showed the highest one. The CASS test result was consistent with that of immersion test, and was good agreement with the corrosion data of polarization measurements. The hardness of alloy deposits decreased with the increase of Sn ratio in bath due to the grain size increase of the alloy. However, it increased noticeably with decreasing current density in the bath condition of low Sn ratio (0.1)

• Journal of the Korean Electrochemical Society
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• v.16 no.1
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• pp.19-29
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• 2013

Effects of current density, electrodeposition temperature and solution pH on properties of Cu thin films electrodeposited from pyrophosphate bath were investigated. Current efficiency was decreased with increasing current density and increased with increasing temperature. But solution pH slightly influenced on current efficiency and current efficiency was measured to be above 90% at both room temperature and $55^{\circ}C$. Residual stress of Cu thin film electrodeposited at room temperature was decreased with increasing current density, while current density reaches to 60 $mA/cm^2$ or more, stress became close to zero. Cu thin films electrodeposited at $55^{\circ}C$ exhibited the residual stress range of 0~40 MPa. At room temperature, dendritic surface morphology was observed above the current density of 30 $mA/cm^2$ and at $55^{\circ}C$, above the current density of 100 $mA/cm^2$. Cu thin films electrodeposited from bath solution with room temperature and $55^{\circ}C$ mainly consisted of (111) peaks. Specially, Cu thin film electrodeposited at 30 $mA/cm^2$ and $55^{\circ}C$ exhibited strong preferred orientation of (111) peaks.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.153-153
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• 2009

첨가제를 사용한 피로인산구리 도금욕에서 마그네슘 합금상에 직접 구리도금을 실시하였다. 피로인산구리 도금욕에서 첨가제가 마그네슘 합금 도재에 미치는 영향에 대하여 연구하였다. 연구에 따른 첨가제를 포함하는 피로인산구리 도금욕에서 구리도금층의 적합성을 확인하기 위하여 기존의 마그네슘 모재에 구리를 도금하기 위한 방법인 징케이트 처리 후 시안구리도금욕에서 구리도금하는 방법과 비교 고찰 하였다.

• Journal of the Korean institute of surface engineering
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• v.30 no.3
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• pp.202-212
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• 1997

The composition and the microstructure of the Sn-Ni alloy electrodeposited in pyrophosphate bath were investigated according to the electrolysis conditions. The cathode current efficiency increased with the addition of $NH_4CI$ and glycine, while it decreased with the increase of current density. The Sn content of the alloy deposits increased with the increase of $NH_4CI$ in the bath. The alloys with 51~71wt.% Sn had the NiSn single phase structure. The preferred orientation of the single phase alloys changed from (110) to (110)+(101) with the increase of current density and cathode overpotential. The single phase alloys with 50~60wt.%Sn had the smooth surface structure with fine crystallite, while the multiphase alloys showed the surface structure with crystal size and cracks at high curret density.

• Journal of Magnetics
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• v.12 no.3
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• pp.124-128
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• 2007

Co/Cu GMR multilayers were electrodeposited from various electrolytes using the dual bath technique to achieve high sensitive GMR multilayers. GMR ratio and sensitivity were strongly influenced by solution compositions and electrodeposition parameters where GMR and sensitivity of 12% and 0.052%/Oe were achieved from pyrophosphate baths. The effect of plating conditions on properties of Co/Cu multilayers may be attributed to crystallinity and grain size of deposits, and the ability of plating solutions to deposit contiguous films at lower nano thicknesses.

• Journal of the Korean institute of surface engineering
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• v.26 no.5
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• pp.245-254
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• 1993

The effects of pulse current electrolysis conditions on the composition and the microstructure of Ag-Sn alloy were studied by using a pyrophosphate bath. Both cathode current efficiency and throwing power of alloy deposits formed under pulse plating conditions, decreased with increasing mean current density, and lower than those under D.C. electrolysis condition. Tin content of Ag-Sn alloy decreased noticebly with in-creasing the mean current density, while it increased with the increase of On-time from 1 to 10 ms. The pre-ferred orientation of Ag-Sn alloy changed with increasing cathode overpotential in the sequence of (100)longrightarrow(100)+(111)longrightarrow(111) at $20^{\circ}C$ and (110)longrightarrow(111)longrightarrow(111)+(100) at $30^{\circ}C$. The effective crystal grain size of the alloy was decreased by decreasing temperature from $30^{\circ}C$ to $20^{\circ}C$ and the surface structure of them was related to the preferred orientation.

• Journal of Electrical Engineering and Technology
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• v.10 no.4
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• pp.1746-1751
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• 2015

In this study low voltage Plasma Electrolytic Oxidation (PEO) was utilized to eliminate high voltage PEO drawbacks such as high cost, dimensional deformation and porosity. Low voltage PEO produces a thin coating which causes low corrosion resistance. In order to solve such problem, 0.1~0.6M pyrophosphates were added in a bath containing 1.4M NaOH, and 0.35M Na₂SiO₃. 70 V PEO was conducted at 25℃ for 3 minutes. Chemical composition, morphology and corrosion resistance of the anodized coating were analyzed. The anodized film was composed of MgO, Mg₂SiO₄, and Mg₂O₇P₂. The morphology of film showed appropriately dense structure and low porosity in the anodized layers. It is found that low voltage Plasma Electrolytic Oxidation in cooperation with phosphating treatment can provide a good corrosion protection for the AZ31B magnesium alloy.

• Journal of the Korean institute of surface engineering
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• v.49 no.5
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• pp.416-422
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• 2016

We have investigated the effects of applied potential, deposition time and electrolyte types on shapes and physical properties of Cu dendrites by potentiostatic electrodeposition. Finer shape of dendrites was observed at less cathodic potential by 100mV than at the limiting current, due to 'effective overpotential'. The shape of copper dendrite is related to the deposition time, too. The dendrite depositing for 10 min showed the finest shape. The finer dendrite has the less apparent density and the larger specific surface area. Dendrite from chloride solution has the lowest density and the largest surface area among three plating solutions, sulfate, chloride and pyrophosphate.

• Journal of the Korean Electrochemical Society
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• v.18 no.1
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• pp.7-16
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• 2015

Effects of chemical composition ($Cu^{2+}$, $K_4P_2O_7$ and additive concentrations) of baths on properties of Cu thin films electrodeposited from pyrophosphate copper bath were investigated. Current efficiency was increased to be near 100% with increasing $Cu^{2+}$ concentrations from 0.02 to 0.3M. Decrease of current efficiency was observed in the range of 1.5~1.8M $K_4P_2O_7$ concentration, but current efficiency of about 100% was measured in the ranges of both 0.9~1.3M and 2.1~2.4M. The change of additive concentration did not influenced current efficiency. Residual stress of electrodeposited Cu thin films was measured to be about 20 MPa below 0.15 M $Cu^{2+}$ concentration and increased with the increase of it to 0.25 M. Maximum residual stress of 120MPa was observed at 0.25M $Cu^{2+}$ concentration. On the other hand, residual stress decreased from 80 to near 0 MPa as $K_4P_2O_7$ concentration varied from 0.9 to 2.4M and but The change of additive concentration did not affected on residual stress. $Cu^{2+}$ and $K_4P_2O_7$ concentrations significantly affect on surface morphology of electrodeposited Cu thin films, but additive concentration slightly affected. From XRD analysis, the microstructures of electrodeposited Cu thin film was affected from the changes of $Cu^{2+}$ and $K_4P_2O_7$ concentrations, but not from that of additive concentration. Strong preferred orientation of (111) peak was observed with increasing $Cu^{2+}$ and $K_4P_2O_7$ concentrations.