• Journal of the Microelectronics and Packaging Society
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• 제12권1호
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• pp.35-40
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• 2005

The oxidation of pure Sn and Sn-0.7Cu, Sn-3.5Ag, Sn-lZn, and Sn-9Zn alloys at $150^{\circ}C$ was investigated. Both the chemical nature and the amount of oxides were characterized using electrochemical reduction analysis by measuring the electrolytic reduction potential and total transferred electrical charges. X-ray photoelectron spectroscopy (XPS) was also conducted to support the results of reduction analysis. The effect of Cu, Ag and Zn addition on surface oxidation of Sn alloys is reported. For Sn, Sn-0.7Cu and Sn-3.5Ag, SnO grew first and then the mixture of SnO and $SnO_2$ was found. $SnO_2$ grew predominantly for a long-time aging. For Zn containing Sn alloys, both ZnO and $SnO_2$ were formed. Zn promotes the formation of $SnO_2$. Sn oxide growth rate of Pb-free solder alloys was also discussed in terms of alloying elements.

• Corrosion Science and Technology
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• 제6권6호
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• pp.316-321
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• 2007

The effect of annealing on the pitting corrosion resistance of anodized Al-Mg alloy (AA5052) processed by equal-channel angular pressing (ECAP) was investigated by electrochemical techniques in a solution containing 0.2 mol/L of $AlCl_3$ and also by surface analysis. The Al-Mg alloy was annealed at a fixed temperature between 473 and 573 K for 120 min in air after ECAP. Anodizing was conducted for 40 min at $100-400A/m^2$ at 293 K in a solution containing 1.53 mol/L of $H_2SO_4$ and 0.0185 mol/L of $Al_2(SO_4)_3$. The internal stress generated in anodic oxide films during anodization was measured with a strain gauge to clarify the effect of ECAP on the pitting corrosion resistance of anodized Al-Mg alloy. The time required to initiate the pitting corrosion of anodized Al-Mg alloy was shorter in samples subjected to ECAP, indicating that ECAP decreased the pitting corrosion resistance. However, the pitting corrosion resistance was greatly improved by annealing after ECAP. The time required to initiate pitting corrosion increased with increasing annealing temperature. The strain gauge attached to Al-Mg alloy revealed that the internal stress present in the anodic oxide films was compressive stress, and that the stress was larger with ECAP than without. The compressive internal stress gradually decreased with increasing annealing temperature. Scanning electron microscopy showed that cracks occurred in the anodic oxide film on Al-Mg alloy during initial corrosion and that the cracks were larger with ECAP than without. The ECAP process of severe plastic deformation produces large internal stresses in the Al-Mg alloy; the stresses remain in the anodic oxide films, increasingthe likelihood of cracks. It is assumed that the pitting corrosion is promoted by these cracks as a result of the higher internal stress resulting from ECAP. The improvement in the pitting corrosion resistance of anodized AlMg alloy as a result of annealing appears to be attributable to a decrease in the internal stresses in anodic oxide films

• Proceedings of the Korean Society For Composite Materials Conference
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• 한국복합재료학회 2003년도 추계학술발표대회 논문집
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• pp.46-49
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• 2003

Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties, Until now, strengthening of the copper at toy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the at toy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conduct ing material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the copper matrix composites of high strength and electric conductivity In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process in order to manufacture the intermediary materials for the carbon nanofiber reinforced Cu matrix nanocomposite and align mechanism as well as optimized drawing process parameters are verified via experiments and numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of $10~20\mu\textrm{m}$ In length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber. Optimal parameter for drawing process was obtained by experiments and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc Lower reduction areas provides the less rupture of cu tube is not iced during the drawing process. Optimal die angle was between 5 degree and 12 degree. Relative density of carbon nanofiber embedded in the copper tube is higher as drawing diameter decrease and compressive residual stress is occurred in the copper tube. Carbon nanofibers are moved to the reverse drawing direct ion via shear force caused by deformation of the copper tube and alined to the drawing direction.

• Asia-Pacific Journal of Business Venturing and Entrepreneurship
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• 제7권3호
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• pp.17-25
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• 2012

Wire bonding process in making semiconductor needs the most precise control and Critical To Quality(CTQ). Thus, it is regarded to be the most essential step in packaging process. In this process, pure gold wire is used to connect the chip and PCB(substrate or lead frame). However, the price of gold has been skyrocketing continuously for a long period of time and is expected to further increase in the near future. This phenomenon situates us in an unfavorable condition amidst the competitive environment. To avoid this situation, many semiconductor material making companies developed new types of wires: Au.Ag wire is one material followed by many others. This study is aimed to optimize the parameter in wire bonding with the use of 6sigma and QFD(Quality Function Deployment). 6sigma process is a good means to not only solve the problem, but to increase productivity. In order to find the key factor, we focused on VOB(Voice of Business) and VOC(Voice of Customer). The main factors from VOB, VOC are called CTQ. However, there were times when these main factors were far from offering us the correct answer, thus making the situation more difficult to handle. This study shows that QFD aids in deciding which of the accurate factors to undertake. Normally QFD is used in designing and developing products. 6sigma process is held more effective when it used with QFD.

• Journal of Periodontal and Implant Science
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• 제32권3호
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• pp.615-630
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• 2002

Various long-term studies have shown that titanium implants as abutments for different types of prostheses have become a predictable adjunct in the treatment of partially or fully edentulous patients. The continuous exposure of dental implants to the oral cavity with all its possible contaminants creates a problem. A lack of attachment, together with or caused by bacterial insult, may lead to peri-implantitis and eventual implant failure. Removal of plaque and calculus deposits from dental titanium implants with procedures and instruments originally made for cleaning natural teeth or roots may cause major alterations of the delicate titanium oxide layer. Therefore, the ultimate goal of a cleaning procedure should be to remove the contaminants and restore the elemental composition of the surface oxide without changing the surface topography and harming the surrounding tissues. Among many chemical and mechanical procedure, air-powder abrasive have been known to be most effective for cleaning and detoxification of implant surface. Most of published studies show that the dental laser may be useful in the treatment of pen-implantitis. $CO_2$ laser and Soft Diode laser were reported to kill bacteria of implant surface. The purpose of this study was to obtain clinical guide by application these laser to implant surface by means of Non-contact Surface profilometer and X-ray photoelectron spectroscopy(XPS) with respect to surface roughness and atomic composition. Experimental rough pure titanium cylinder models were fabricated. All of them was air-powder abraded for 1 minute and they were named control group. And then, the $CO_2$ laser treatment under dry, hydrogen peroxide and wet condition or the Soft Diode laser treatment under Toluidine blue O solution condition was performed on the each of the control models. The results were as follows: 1. Mean Surface roughness(Ra) of all experimental group was decreased than that of control group. But it wasn't statistically significant. 2. XPS analysis showed that in the all experimental group, titanium level were decreased, when compared with control group. 3. XPS analysis showed that the level of oxygen in the experimental group 1, 3($CO_2$ laser treatment under dry and wet condition) and 4(Soft Diode laser was used under toluidine blue O solution) were decreased, when compared with control group. 4. XPS analysis showed that the atomic composition of experimental group 2($CO_2$ laser treatment under hydrogen peroxide) was to be closest to that of control group than the other experimental group. From the result of this study, this may be concluded. Following air-powder abrasive treatment, the $CO_2$ laser in safe d-pulse mode and the Soft Diode laser used with photosensitizer would not change rough titanium surface roughness. Especially, $CO_2$ laser treatment under hydrogen peroxide gave the best results from elemental points of view, and can be used safely to treat peri-implantitis.

• Journal of the Microelectronics and Packaging Society
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• 제12권2호
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• pp.121-128
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• 2005

Solder joints in microelectronic devices are frequently operated at an elevated temperature in service. They also experience plastic deformation caused by temperature excursion and difference in thermal expansion coefficients. Deformed solders can go through a recovery and recrystallization process at an elevated temperature, which would alter their microstructure and mechanical properties. In this study, to predict the changes in mechanical properties of Pb-free solder joints at high temperatures, the high temperature microhardness of several Pb-free and composite solders was measured as a function of temperature, deformation, and annealing condition. Solder alleys investigated include pure Sn, Sn-0.7Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu, Sn-2.8Ag-7.0Cu (composite), and Sn-2.7Ag-4.9Cu-2.9Ni (composite). Numbers are all in wt.$\%$ unless specified otherwise. Solder pellets were cast at two cooling rates (0.4 and $7^{\circ}C$/s). The pellets were compressively deformed by $30\%$ and $50\%$ and annealed at $150^{\circ}C$ for 2 days. The microhardness was measured as a function of indentation temperature from 25 to $130^{\circ}C$. Their microstructure was also evaluated to correlate with the changes in microhardness.

• Journal of Korea Game Society
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• 제6권4호
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• pp.55-61
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• 2006

Graphics rendering pipeline (application, geometry, and rasterizer) is the core of real-time graphics which is the most important functionality for computer games. Usually this rendering process is completed by both the CPU and the GPU, and a bottleneck can be located either in the CPU or the GPU. This paper focuses on reducing the bottleneck between the CPU and the GPU. We are proposing a method for improving the performance of parallel processing for real-time graphics rendering by separating the CPU operations (usually performed using a thread) into two parts: pure CPU operations and operations related to the GPU, and let them operate in parallel. This allows for maximizing the parallelism in processing the communication between the CPU and the GPU. Some experiments lead us to confirm that our method proposed in this paper can allow for faster graphics rendering. In addition to our method of using a dedicated thread for GPU related operations, we are also proposing an algorithm for balancing the graphics pipeline using the idle time due to the bottleneck. We have implemented the two methods proposed in this paper in our networked 3D game engine and verified that our methods are effective in real systems.

• Journal of the Korean Chemical Society
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• 제17권4호
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• pp.306-313
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• 1973

With the intention of obtaining technical data for the industrial production of ${\gamma}-MnO_2$ for dry cell depolarizer by electrolytic oxidation of acidic manganese sulfate solution made from domestic rhodochrosite, optimum conditions of ore leaching, purification of leached solution and electrolytic oxidation of divalent manganes to tetravalent were investigated using simulated micro pilot plant having a production capacity of 4 kg of $MnSO_4$ per day. The nature and quality of the products were investigated by means of chemical analysis, DTA, X-ray diffraction and electron microscopy. The cell activity of $MnO_2$were examined by cell discharging character measurements. The optimum electrolysis conditions were as follow: Temperature of the electrolyte, above $90^{\circ}C$; current density, 0.7${\sim}A/dm^2$; anode materials, graphite or lead ; concentration of electrolyte, $MnSO_4 50{\sim}150g/l $ g/l and $H_2SO_4/MnSO_4 = 0.15{\sim}0.25$. Under the best condition the current efficiency was 99% and the products were almost pure ${\gamma}-MnO_2$. The cell discharging character were good and almost the same as that of regular grade commercial electrolytic manganese dioxide.

• Korean Journal of Heritage: History & Science
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• 제33권
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• pp.366-396
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• 2000

This research paper has examined the question of the year of the publication of the wood block print, Mukujeonggwang Dae Darani Gyeong(Pure light Dharani Sutra). Published in Korea sometime before 751, it is known to be the oldest existing document printed with wood blocks in the world. Recently, a Chinese scholar claimed that this sutra was translated into Chinese in 701 and printed in Reoyang, China, in 702. These claims have lead to international symposiums and research papers on the Mukujeonggwang Dae Darani Gyeong. However, although diverse opinions and research were presented by various scholars, they all seem to be far fetched and do not answer the essential question of the sutra. The evidence in historic records shows that the translation into Chinese was done in 704 and not in 701. After it was translated into Chinese, it came to Korea and was printed with wood blocks. When Sokkatap was built in 751, a copy was placed in the pagoda. Moreover, the inscription on the sarira casket states that the construction of the pagoda was based on the theory of Jotapsasang contained in the sutra. Thus this proves that Mukujeonggwang Dae Darani Gyeong had to have been printed before 751.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• 제28권3호
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• pp.157-163
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• 2022

The demands for Home Meal Replacement (HMR) products are continuously increasing owing to the convenience of instant food and online food delivery. Ready-to-heat (RTH) products have received massive attention in the HMR industry because these products can be easily warmed using a microwave oven. However, the conventional microwave packaging should be opened before microwave heating to prevent bursting or food loss owing to the steam-pressure build-up inside the package. Open packaging might lead to non-uniform food heating and cross-contamination. Therefore, packaging materials that are able to release steam without opening are of interest to the HMR industry. In this study, polylactic acid(PLA)/polyethylene glycol(PEG)/nanoclay composite films were manufactured using an extrusion method as packaging materials with a smart steam-releasing function. The introduction of PEG to the PLA imparted a steam self-releasing feature to the composite films owing to the morphology change of composite films during microwave heating. Further, PEG increased the ductility of PLA, which in turn prevented bursting caused due to the steam-pressure build-up. The uniform dispersion of nanoclay obtained by a twin-screw extrusion led to stronger mechanical properties. Therefore, the smart composite films developed here can be applied as microwave packaging materials with a self-releasing function.