• 제목/요약/키워드: Pulse UV

검색결과 119건 처리시간 0.025초

Pulse UV 장치를 이용한 원유비축시설 발생폐수의 난분해성 유기오염물질 제거 (Removal of Non-biodegradable Organic Contaminants in Wastewater from crude oil reserve base Using Pulse UV System)

  • 손진식;박순호;정의택
    • 상하수도학회지
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    • 제25권6호
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    • pp.861-867
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    • 2011
  • Wastewater from crude oil reserve base usually contains large amount of non-biodegradable contaminants. The conventional wastewater treatment progress can hardly meet the regulation of wastewater effluent quality. This study investigated the removal of non-biodegradable organic contaminants in wastewater from crude oil reserve base using a pulse UV treatment. The modified process incorporating pulse UV process was set up to treat the wastewater from crude oil reserve base. The treatment process is composed with coagulation and flocculation, micro-bubble flotation, sand filter, pulse UV system, and GAC filter. The results show CODMn was effectively removed by the process with pulse UV system and it can meet the wastewater effluent regulation. The single effect of pulse UV process in CODMn removal was not significant(9~15% based on sand filtered effluent), however with the subsequent activated carbon filter the removal ratio CODMn was increased up to 28% compared to the process without pulse UV syetem.

펄스 UV 램프를 이용한 미생물 소독 및 2-MIB 제거 특성 (Characteristics of Disinfection and Removal of 2-MIB Using Pulse UV Lamp)

  • 안영석;양동진;채선하;임재림;이경혁
    • 상하수도학회지
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    • 제23권1호
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    • pp.69-75
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    • 2009
  • The characteristics of disinfection and organic removal were investigated with pulse UV lamp in this study. The intensity and emission wavelength of pulse UV Lamp were compared with low pressure UV lamp. The emission spectrum range of pulse UV lamp was between 200 and 400 nm while the emission spectrum of low pressure UV lamp was only single wavelength of 254nm. 3 Log inactivation rate of B. subtilis spore by pulse UV and low pressure UV irradiation was determined as $44.71mJ/cm^2$ and $57.7mJ/cm^2$, respectively. This results implied that wide range of emission spectrum is more effective compared to single wavelength emission at 254nm. 500ng/L of initial 2-MIB concentration was investigated on the removal efficiency by UV only and $UV/H_2O_2$ process. The removal efficiency of UV only process achieved approximately 80% at $8,600mJ/cm^2$ dose. 2-MIB removal rate of $UV/H_2O_2$ (5 mg/L $H_2O_2$) process was 25 times increased compared to UV only process. DOC removal efficiency for the water treatment plant effluent was examined. The removal efficiency of DOC by UV and $UV/H_2O_2$ was no more than 20%. Removal efficiency of THMFP(Trihalomethane Formation Potential), one of the chlorination disinfection by-products, is determined on the UV irradiation and $UV/H_2O_2$ process. Maximum removal efficiency of THMFP was approximately 23%. This result indicates that more stable chemical structures of NOM(Natural Organic Matter) than low molecule compounds such as 2-MIB, hydrogen peroxide and other pollutants affect low removal efficiency for UV photolysis. Consequently, pulse UV lamp is more efficient compared to low pressure lamp in terms of disinfection due to it's broad wavelength emission of UV. Additional effect of pulse UV is to take place the reactions of both direct photolysis to remove micro organics and disinfection simultaneously. It is also expected that hydrogen peroxide enable to enhance the oxidation efficiency on the pulse UV irradiation due to formation of OH radical.

Pulse UV 장치를 이용한 먹는 물의 이취미 유발물질 제거효과에 관한 연구 (Removal of taste and odor causing compounds in drinking water using Pulse UV System)

  • 손진식;박순호;정의택
    • 상하수도학회지
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    • 제26권2호
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    • pp.219-228
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    • 2012
  • Problems due to the taste and odor in drinking water are common in treatment facilities around the world. Taste and odor are perceived by the public as the primary indicators of the safely and acceptability of drinking water, and are mainly caused by the presence of two semi-volatile compounds-2-methylisoborneol(2-MIB) and geosmin. Conventional treatment processes in water treatment plants, such as coagulation, sedimentation and chlorination have been found to be ineffective for the removal of 2-MIB and geosmin. Pulse UV system is a new UV irradiation system that is a non-mercury lamp-based alternative to currently used continuous wave systems for water disinfection. This study shows pulse UV system to be effective in treatment of these two compounds. Geosmin removal efficiency of UV process alone achieved approximately 70% at 10sec contact time. 2-MIB removal efficiency of UV only process achieved approximately 60% at 10sec contact time. The addition of $H_{2}O_{2}$ 7mg/L increased geosmin and 2-MIB removal efficiency upto approximately 94% and 91%, respectively.

자외선 카메라 개발을 위한 직류 연면방전 특성 (Characteristics of DC Surface Discharge for the Development of UV Camera)

  • 방만식;최재형;김우진;김영석;김상현
    • 조명전기설비학회논문지
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    • 제25권5호
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    • pp.98-103
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    • 2011
  • Recently, UV(ultra-violet rays) camera has attracted a great deal of interest from the view point of easy judgement in inspections and diagnoses of the safety of power equipment. Especilly, UV camera is applied the inspection of UV with corona discharge. One of the most important and difficult problems is the basic research of filter design, materials and corona discharge. In this paper, we will report on the UV generation, corona pulse count and the polarity effect of positive and negative DC surface discharge in air. Also, corona discharge characteristics are analyzed using prototype UV camera of Korea. UV generation and corona pulse count due to surface discharge in positive needle is higher than that of negative needle.

UV 극초단 레이저 펄스의 발생과 증폭 (UV ultra-short laser pulse generation and amplification)

  • 이영우
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2004년도 춘계종합학술대회
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    • pp.324-326
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    • 2004
  • 엑시머 레이저로 여기되는 분포제환 색소레이저(DFDL: Distributed Feedback Dye Laser)로부터 616nm의 레이저 펄스를 얻고, 이를 제2고조파 발생에 의한 파장변환을 통해 308nm의 극초단 자외 광펄스를 얻었다. 또한 3단의 XeCl 엑시머 레이저 증폭기를 구성하여 자외 광펄스의 증폭을 행하였다.

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피코초 펄스 레이저를 이용한 사파이어 웨이퍼 스크라이빙에 관한 연구 (A Study on Sapphire Wafer Scribing Using Picosecond Pulse laser)

  • 문재원;김도훈
    • 한국레이저가공학회지
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    • 제8권2호
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    • pp.7-12
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    • 2005
  • The material processing of UV nanosecond pulse laser cannot be avoided the material shape change and contamination caused by interaction of base material and laser beam. Nowadays, ultra short pulse laser shorter than nanosecond pulse duration is used to overcome this problem. The advantages of this laser are no heat transfer, no splashing material, no left material to the adjacent material. Because of these characteristics, it is so suitable for micro material processing. The processing of sapphire wafer was done by UV 355nm, green 532nm, IR 1064nm. X-Y motorized stage is installed to investigate the proper laser beam irradiation speed and cycles. Also, laser beam fluence and peak power are calculated.

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오염물질에 따른 변압기부싱 모델의 기중 코로나 방전 특성 (Corona Discharge Characteristics of Transformer Bushing Model with Contaminnations in Air)

  • 방만식;김우진;김영석;김상현
    • 조명전기설비학회논문지
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    • 제26권5호
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    • pp.91-96
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    • 2012
  • The surface of bushing is contaminated with rain, dust, salt and others. A bushing with contaminations in air is serious problem in insulation. Therefore, it is important to understand the inspection and diagnoses of the safety. The ultra-violet rays(UV) camera has attracted interest from the view point of easy judgement. In this paper, we will report on the corona discharge characteristics of surface flashover model with contaminations in air. Also, UV images of discharge and corona pulse count in air are analyzed using prototype UV camera of Korea and a UV sensor with an optic lens. These results are studied at both AC and DC voltage under a non-uniform field.

자외선 피코초 레이저를 이용한 Low-k 웨이퍼 인그레이빙 특성에 관한 연구 (A Study of Low-k Wafer Engraving Processes by Using Laser with Pico-second Pulse Width)

  • 문성욱;배한성;홍윤석;남기중;곽노흥
    • 반도체디스플레이기술학회지
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    • 제6권1호
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    • pp.11-15
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    • 2007
  • Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355 nm and 80 MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using a laser with UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repletion rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20\;{\mu}m$ and $10\;{\mu}m$ at more than 500 mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed in laser material process.

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변형률 속도 효과를 고려한 355 nm UV 레이저 구리재질의 싱글 펄스 전산해석 (Computational Analysis of 355 nm UV Laser Single-Pulsed Machining of Copper Material Considering the Strain Rate Effect)

  • 이정한;오재용;박상후;신보성
    • 한국기계가공학회지
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    • 제9권3호
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    • pp.56-61
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    • 2010
  • Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.