• IEMEK Journal of Embedded Systems and Applications
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• v.14 no.1
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• pp.33-41
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• 2019

We propose an embedded solution to design a high-speed and high-accuracy 16bit analog-digital signal processing interface for the control systems using various external analog signals. Choosing TMS320F28377D micro controller unit (MCU) featuring high-performance processing in the 32-bit floating point operation, low power consumption, and various I/O device supports, we design and build the proposed system that supports both 16-bit analog-digital converter (ADC) interface and high precision digital-analog converter (DAC) interface. The ADC receives voltage-level differential signals from fully differential amplifiers, and the DAC communicates with MCU through 50 MHz bandwidth high-fast serial peripheral interface (SPI). We port the boot loader and device drivers to the implemented board, and construct the firmware development environment for the application programming. The performance of the entire implemented system is demonstrated by analog-digital signal processing tests, and is verified by comparing the test results with those of existing similar systems.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.10
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• pp.9-16
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• 1999

When the conventional IPD (inter-poly-dielctrics) layer with ONO(oxide-nitride-oxide) structure was used in the Flash EEPROM cell, its data retention characteristics were significanfly degraded because the top oxide of the ONO layer was etched off due to the cleaning process used in the gate oxidation process for the peripheral MOSFETs. When the IPD layer with the ONON(oxide-nitride-oxide-nitride) was used there, however, its data retention characteristics were much improved because the top nitride of the ONON layer protected the top oxide from being etched in the cleaning process. For the modelling of the data retention characteristics of the Flash EEPROM cell with the ONON IPD layer, the decrease of the threshold voltage cue to the charge loss during the bake was here given by the empirical relation ${\Delta}V_t\; = \;{\beta}t^me^{-ea/kT}$ and the values of the ${\beta}$=184.7, m=0.224, Ea=0.31 eV were obtained with the experimental measurements. The activation energy of 0.31eV implies that the decrease of the threshold voltage by the back was dur to the movement of the trapped electrons inside the inter-oxide nitride layer. On the other hand, the results of the computer simulation using the model were found to be well consistent with the results of the electrical measurements when the thermal budget of the bake was not high. However, the latter was larger then the former in the case of the high thermal budger, This seems to be due to the leakage current generated by the extraction of the electrons with the bake which were injected into the inter-oxide niride later and were trapped there during the programming, and played the role to prevent the leakage current. To prevent the generation of the leakage current, it is required that the inter-oxide nitride layer and the top oxide layer be made as thin and as thick as possible, respectively.

• Journal of Sensor Science and Technology
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• v.6 no.1
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• pp.6-15
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• 1997

This paper presents the multi-objective optimal design of thermopile sensor having beam or membrane structure. The thermopile sensor is composed of $Si_{3}N_{4}/SiO_{2}$ dielectric membrane, Al-polysilicon thermocouples and $RuO_{2}$ thin film for black body. The sensing method is based on the Seebeck effect which is originated from the temperature difference of the two positions, black body and silicon rim. The objective functions of the presented design are sensitivity, detectivity and thermal time constant. The modelling of the sensor is proposed including the package. The multi-objective optimization technique is applied to the design of the sensor not only inspecting the modelling equation but also simulating mathematical programming method. Especially, fuzzy optimization technique is adapted to get the optimal solution which enables the designer to reach the more practical solution. The design constraint of the voltage output originated from the change of the environmental temperature is included for practical use.

• The Journal of the Convergence on Culture Technology
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• v.4 no.3
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• pp.287-291
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• 2018

The CNTFET, which is attracting attention as a next-generation semiconductor device, can obtain ballistic or near-ballistic transport at a lower voltage than that of conventional MOSFETs by depositing CNTs between the source and drain of the device. In order to increase the performance of the CNTFET, a large number of CNTs must be deposited at a high density in the CNTFET. Thus, various manufacturing processes to increase the density of the CNTs have been developed. Recently, the Directional Shrinking Transfer Method was developed and showed that the current density of the CNTFET device could be increased up to 150 uA/um. So, this method enhances the possibility of implementing a CNTFET-based integrated circuit. In this paper, we will discuss how to evaluate the performance of the CNTFET device compared to a MOSFET at the circuit level when the CNTFET is fabricated by the Directional Shrinkage Transfer Method.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.10
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• pp.46-53
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• 2011

This paper presents an equalizer reducing CCI(cell-to-cell interference) in MLC NAND flash memory. The CCI is a critical factor which affects occurring data errors in a cell, when surrounding cells are programed. We derived a characteristic equation for CCI considering write procedure of data that is similar with signal equalizing. The model considers the floating gate capacitance coupling effect, the direct field effect, and programming methods of the MLC NAND flash memory. We verify the proposed equalizer comparing with the measured data of 1-block MLC NAND flash memory. As the simulation result, the equalizer shows an error correction ratio about 60% under 20nm NAND process.

• Proceedings of the KIEE Conference
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• 2002.11d
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• pp.197-199
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• 2002

The invention of VHDL(Very High Speed Integrated Circuit Hardware Description Language), Technical language of Hardware, is a kind of turning point in digital circuit designing, which is being more and more complicated and integrated. Because of its excellency in expression ability of hardware, VHDL is not only used in designing Hardware but also in simulation for verification, and in exchange and conservation, composition of the data of designs, and in many other ways. Especially, It is very important that VHDL is a Technical language of Hardware standardized by IEEE, intenational body with an authority. The biggest problem in modern circuit designing can be pointed out in two way. One is a problem how to process the rapidly being complicated circuit complexity. The other is minimizing the period of designing and manufacturing to survive in a cutthroat competition. To promote the use of VHDL, more than a simple use of simulation by VHDL, it is requested to use VHDL in composing logical circuit with chip manufacturing. And, by developing the quality of designing technique, it can contribute for development in domestic industry related to ASIC designing. In this paper in designing SMPS(Switching mode power supply), programming PWM by VHDL, it can print static voltage by the variable load, connect computer to chip with byteblaster, and download in Max(EPM7064SLCS4 - 5)chip of ALTER. To achieve this, it is supposed to use VHDL in modeling, simulating, compositing logic and product of the FPGA chip. Despite its limit in size and operating speed caused by the specific property of FPGA chip, it can be said that this method should be introduced more aggressively because of its prompt realization after designing.

• Proceedings of the KOSOMBE Conference
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• v.1998 no.11
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• pp.191-192
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• 1998

We report on the design of a low-noise 40 channel SQUID system for biomagnetism. We used low-noise SQUID sensor with the pickup coil integrated on the same wafer as the SQUID. The SQUID electronics were simplified by increasing the voltage output of the SQUID. The SQUID insert was designed to have low thermal load, minimizing the liquid helium loss. The digital signal processing provides versatile analysis tools and the software is based on the object-oriented programming. For the effective localization of the source location, solutions of the inverse problems based on the lead-field and the simulated anneal ins were studied.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.10
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• pp.2209-2216
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• 2011

In this paper, we design a 32-bit eFuse OTP memory for PMICs using MagnaChip's $0.18{\mu}m$ process. We solve a problem of an electrical shortage between an eFuse link and the VSS of a p-substrate in programming by placing an n-well under the eFuse link. Also, we propose a WL driver circuit which activates the RWL (read word-line) or WWL (write word-line) of a dual-port eFuse OTP memory cell selectively when a decoded WERP (WL enable for read or program) signal is inputted to the eFuse OTP memory directly. Furthermore, we reduce the layout area of the control circuit by removing a delay chain in the BL precharging circuit. We'can obtain an yield of 100% at a program voltage of 5.5V on 94 manufactured sample dies when measured with memory tester equipment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.35-38
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• 2002

In this paper, the characteristics of channel hot electron (CHE) injection for the write operation in a NOR-type SONOS flash memory with common source line were investigated. The thicknesses of he tunnel oxide, the memory nitride， and the blocking oxide layers for the gate insulator of the fabricated SONOS devices were $34{\AA}$, $73{\AA}$, and $34{\AA}$, respectively. The SONOS devices compared to floating gate devices have many advantages, which are a simpler cell structure, compatibility with conventional logic CMOS process and a superior scalability. For these reasons, the introduction of SONOS device has stimulated. In the conventional SONOS devices, Modified Folwer-Nordheim (MFN) tunneling and CHE injection for writing require high voltages, which are typically in the range of 9 V to 15 V. However CHE injection in our devices was achieved with the single power supply of 5 V. To demonstrate CHE injection, substrate current (Isub) and one-shot programming curve were investigated. The memory window of about 3.2 V and the write speed of $100{\mu}s$ were obtained. Also, the disturbance and drain turn-on leakage during CHE injection were not affected in the SONOS array. These results show that CHE injection can be achieved with a low voltage and single power supply, and applied for the high speed program of the SONOS memory devices.

• Safety and Health at Work
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• v.4 no.3
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• pp.156-159
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• 2013

Background: Cardiac pacemakers are known to be susceptible to strong electromagnetic fields (EMFs). This in vivo study investigated occurrence of electromagnetic interference with pacemakers caused by common environmental sources of EMFs. Methods: Eleven volunteers with a pacemaker were exposed to EMFs produced by two mobile phone base stations, an electrically powered commuter train, and an overhead high voltage transmission lines. All the pacemakers were programmed in normal clinically selected settings with bipolar sensing and pacing configurations. Results: None of the pacemakers experienced interference in any of these exposure situations. However, often it is not clear whether or not strong EMFs exist in various work environments, and hence an individual risk assessment is needed. Conclusions: Modern pacemakers are well shielded against external EMFs, and workers with a pacemaker can most often return to their previous work after having a pacemaker implanted. However, an appropriate risk assessment is still necessary after the implantation of a pacemaker, a change of its generator, or major modification of its programming settings.