• E2M - 전기 전자와 첨단 소재
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• 제15권9호
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• pp.10-14
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• 2002

Plasma processing plays a significant role in semiconductor devices technology. Development of new plasma systems, such as high-density plasma reactors, required development of plasma theory to understand a whole process mechanism and to be able to explain and to predict processing results. A most important task in this way is to establish interconnections between input process parameters (working gas, pressure flow rate input power density) and a various plasma subsystems (electron gas, volume and heterogeneous gas chemistry, transport), which are closely connected one with other. It will allow select optimal ways for processes optimizations.

• 한국산학기술학회논문지
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• 제17권10호
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• pp.221-227
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• 2016

본 연구의 목적은 뇌성마비의 아동의 운동기술과 처리기술에 영향을 미치는 감각처리 요인을 증명하여 뇌성마비 아동을 위한 재활 치료 중재 시 임상적 고려 사항을 파악하고자 하였다. 서울시 소재 J 소아발달센터와 N 재활병원 병원에 내원 중인 뇌성마비 아동 36명을 대상으로 운동 및 처리기술 평가와 단축형 감각 프로파일 검사를 실시하였다. Pearson의 상관계수를 이용하여 뇌성마비 아동의 운동기술과 처리기술 및 감각처리능력과의 상관관계를 검증하였고, 위계적 다중회귀분석을 통해 운동기술과 처리기술에 영향을 주는 주된 감각처리 요인들을 검증하였다. 연구 결과, 운동기술은 감각처리 항목 중 청각여과하기, 활력부족/허약, 시/청각 민감성 항목과 유의미한 상관성을 나타내었다. 처리기술은 촉각민감성, 맛/냄새 민감성 항목과 유의미한 상관성을 나타내었다. 위계적 다중회귀 모형에서 운동기술에 영향을 주는 주요 요인은 움직임 민감성, 청각여과하기, 활력부족/허약 항목이었다. 처리기술에 영향을 주는 요인은 본 연구의 모형에서는 확증되지 않았다. 이번 연구는 뇌성마비 아동을 대상으로 일상생활 활동시 운동기술과 처리기술에 영향을 주는 감각처리 요인들의 관련성과 주요 요인을 검증하여 재활치료를 위한 기초자료를 제공하는데 그 의의가 있다. 추후 연구에서는 더 많은 뇌성마비 아동의 집단을 대상으로 연구가 진행되어 본 연구에서 확인되지 못한 처리기술에 영향을 주는 감각처리 요인들을 검증해볼 필요가 있다.

• 전기학회논문지P
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• 제55권1호
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• pp.26-30
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• 2006

For the purpose of developing capacitive humidity sensor having interdigital electrodes, interdigital electrode was modeled and simulated to obtain capacitance and sensitivity as a function of geometric parameters like the structural gap and thickness. For the development of ASIC, switched capacitor signal processing circuits for capacitive humidity sensor were designed and simulated by Cadence using $0.25{\mu}m$ CMOS process parameters. The signal processing circuits are composed of amplifier for voltage gain control, and clock generator for sensor driving and switch control. The characteristics of the fabricated sensors are; 1) sensitivity is 9fF/%R.H., 2) temperature coefficient of offset(TCO) is $0.4%R.H./^{\circ}C$, 3) nonlinearity is 1.2%FS, 4) hysteresis is 1.5%FS in humidity range of $3%R.H.{\sim}98%R.H.$. The response time is 50 seconds in adsorption and 70 seconds in desorption. Fabricated process used in this capacitive humidity sensor having interdigital electrode are just as similar as conventional IC process technology. Therefore this can be easily mass produced with low cost, simple circuit and utilized in many applications for both industrial and environmental measurement and control system, such as monitoring system of environment, automobile, displayer, IC process room, and laboratory etc.

• 한국레이저가공학회지
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• 제13권4호
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• pp.7-13
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• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• 한국군사과학기술학회지
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• 제9권3호
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• pp.5-11
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• 2006

This paper is launched to get an exact bore-sighting value in the process of assembling for a dual-barrel weapon. Image processing method with a CCD(Charged Coupled Device) camera is chosen for the error reduction of bore-sighting. The results of this method by using a CCD camera and the testing target method are described in this paper. After the performance of the dual-barrel weapon and that of the fire-control system in the dual barrel weapon system is confirmed, the bore-sighting which is a part of the process in the system assembly is accomplished. In this process, the position of the barrel is identified by using the testing target method that is an existing bore-sighting method. Then, the fixing line of the fire-control system is checked by a day-optical part. The precision of the bore-sighting is required within several mils, however the manual method using the naked eyes makes it worse. Therefore, a CCD camera is installed in the eyepieces. Next, we can get an image of the sighting and the center coordinate values of the laser-pointer from each barrel by image processing method. A required bore-sighting value is calculated from the eccentricity of the center coordinate. Finally, It can be applied to adopt this result in the assembling process of the dual-barrel weapon.

• 제어로봇시스템학회논문지
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• 제19권11호
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• pp.984-990
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• 2013

Pick and placement systems need high speeds and reliability for the position alignment process of semiconductor packages in picking up and placing them on placement trays. Image processing is usually adopted for position aligning where finding out the most suitable method is considered most important aspect of the process. This paper proposes a method for judging the performance of different image processing algorithms based on the PCI (Process Capability Index). The PCI is an index which represents the error distribution acquired from many experimental data. The bigger the index, the more reliable the results or the lower the deviation. Two compared and candidate methods are Hough Transform and PCA (Principal Component Analysis), both of which are very suitable for oblong or rectangular type packages such as BGA's. Comparing the two approaches through a CPI with enough experimental results leads to the conclusion that the PCA is much better than the Hough Transform in not only reliability, but also processing speed.

• 한국레이저가공학회지
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• 제14권4호
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• pp.14-20
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• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

• 한국기계가공학회지
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• 제21권2호
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• pp.123-129
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• 2022

Quartz (SiO2) has high abrasion and heat resistances and excellent chemical and mechanical properties; therefore, it is used in various industries, such as machinery, chemistry, optics, and medicine. Quartz is a high-hardness and brittle material and is classified as the topmost difficult-to-cut material, which is because of the cracking or chipping at the edge during processing. Corner wear, such as cracks and chippings that occur during cutting, is a major cause for the deterioration in the machining quality. Therefore, many researchers are investigating various techniques to process quartz effectively. However, owing to the mechanical properties of quartz, most studies have been conducted on grinding, micromachining, and microdrilling. Few studies have been conducted on quartz processing. The purpose of this study was to analyze the machining characteristics according to the machining factors during the slot machining of quartz using a cubic boron nitride (CBN) tool and to select the optimal machining conditions using the Taguchi method. The machining experiment was performed considering three process variables: the spindle speed, feed rate, and depth of cut. The cutting force and surface roughness were analyzed according to the processing conditions.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2021년도 추계학술대회
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• pp.574-575
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• 2021

재제조(Re-manufacturing)는 제품의 수명이 다하여 폐기단계에 있는 사용 후 제품이나 부품을 회수하여 재처리 후 신제품 조립공정과 같은 재조립 과정을 거쳐 본래 가지고 있던 제품의 기능 및 성능을 회복하도록 하는 제조방법의 하나이다. 재재조 산업은 환경보호 측면 뿐만 아니라 경제적 측면 또한 중요하다. 산업전반의 성패는 제품에 대한 신뢰 및 가격 경쟁력에 달려있다. 제품 제조 공정에서 인건비를 줄이고 제품의 신뢰도를 향상시키기 위해 영상처리 시스템을 이용한다. 본 연구에서는 폐드럼을 재생하기 위해 전처리 단계인 재활용 여부 판단 단계 및 드럼을 재생한 후 출고직전 영상처리를 이용하여 사람의 육안으로 식별이 어려운 이물질 및 불량을 검출한다.

• 한국생산제조학회지
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• 제19권5호
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• pp.672-677
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• 2010

The goal of this study is to simplify the measurement process of the flat zone length produced by a flexible disk grinding system for the process automation. The image of workpiece in the grinding process is obtained, and the cutting speed and the feeding speed are controlled carefully to maximize the flat zone length. The gradient, the inflection point and the length of the line in the image are calculated, and the length is also measured by using a projector. Processing conditions and inversely proportional to flat zone length was changing. The flat zone length is estimated by Neural network algorithm considering the process conditions with the estimated error range as 0.06~3.61%, the Neural network algorithm for the grinding process estimation is found to be useful for building the process automation database.