• Electrical & Electronic Materials
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• v.15 no.9
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• pp.10-14
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• 2002

Plasma processing plays a significant role in semiconductor devices technology. Development of new plasma systems, such as high-density plasma reactors, required development of plasma theory to understand a whole process mechanism and to be able to explain and to predict processing results. A most important task in this way is to establish interconnections between input process parameters (working gas, pressure flow rate input power density) and a various plasma subsystems (electron gas, volume and heterogeneous gas chemistry, transport), which are closely connected one with other. It will allow select optimal ways for processes optimizations.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.10
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• pp.221-227
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• 2016

This study was conducted to identify sensory processing factors that affect motor and process skills of children with cerebral palsy. A total of 36 children with cerebral palsy who attended at the J pediatric development center and the N rehabilitation hospital in Seoul participated. Pearson's correlation coefficients were used to test the relationship between motor skills, process skills and sensory processing abilities of children. Moreover, hierarchical multiple regression was used to identify the sensory processing factors influencing motor and process skills. Motor skills of children with cerebral palsy were correlated with auditory filtering, low energy/weakness, and visual/auditory sensitivity of sensory processing items, whereas process skills were correlated with tactile sensitivity and taste/smell sensitivity. The hierarchical regression model for motor skills revealed movement sensitivity, auditory filtering, and low energy/weakness as significant factors influencing sensory processing items. However, no factors were shown to influence process skills. The results of this study will be useful as a basic resource for rehabilitation of children with cerebral palsy. However, further studies evaluating a larger population should be conducted to verify the results presented herein.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.55 no.1
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• pp.26-30
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• 2006

For the purpose of developing capacitive humidity sensor having interdigital electrodes, interdigital electrode was modeled and simulated to obtain capacitance and sensitivity as a function of geometric parameters like the structural gap and thickness. For the development of ASIC, switched capacitor signal processing circuits for capacitive humidity sensor were designed and simulated by Cadence using $0.25{\mu}m$ CMOS process parameters. The signal processing circuits are composed of amplifier for voltage gain control, and clock generator for sensor driving and switch control. The characteristics of the fabricated sensors are; 1) sensitivity is 9fF/%R.H., 2) temperature coefficient of offset(TCO) is $0.4%R.H./^{\circ}C$, 3) nonlinearity is 1.2%FS, 4) hysteresis is 1.5%FS in humidity range of $3%R.H.{\sim}98%R.H.$. The response time is 50 seconds in adsorption and 70 seconds in desorption. Fabricated process used in this capacitive humidity sensor having interdigital electrode are just as similar as conventional IC process technology. Therefore this can be easily mass produced with low cost, simple circuit and utilized in many applications for both industrial and environmental measurement and control system, such as monitoring system of environment, automobile, displayer, IC process room, and laboratory etc.

• Laser Solutions
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• v.13 no.4
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• pp.7-13
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• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• Journal of the Korea Institute of Military Science and Technology
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• v.9 no.3
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• pp.5-11
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• 2006

This paper is launched to get an exact bore-sighting value in the process of assembling for a dual-barrel weapon. Image processing method with a CCD(Charged Coupled Device) camera is chosen for the error reduction of bore-sighting. The results of this method by using a CCD camera and the testing target method are described in this paper. After the performance of the dual-barrel weapon and that of the fire-control system in the dual barrel weapon system is confirmed, the bore-sighting which is a part of the process in the system assembly is accomplished. In this process, the position of the barrel is identified by using the testing target method that is an existing bore-sighting method. Then, the fixing line of the fire-control system is checked by a day-optical part. The precision of the bore-sighting is required within several mils, however the manual method using the naked eyes makes it worse. Therefore, a CCD camera is installed in the eyepieces. Next, we can get an image of the sighting and the center coordinate values of the laser-pointer from each barrel by image processing method. A required bore-sighting value is calculated from the eccentricity of the center coordinate. Finally, It can be applied to adopt this result in the assembling process of the dual-barrel weapon.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.984-990
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• 2013

Pick and placement systems need high speeds and reliability for the position alignment process of semiconductor packages in picking up and placing them on placement trays. Image processing is usually adopted for position aligning where finding out the most suitable method is considered most important aspect of the process. This paper proposes a method for judging the performance of different image processing algorithms based on the PCI (Process Capability Index). The PCI is an index which represents the error distribution acquired from many experimental data. The bigger the index, the more reliable the results or the lower the deviation. Two compared and candidate methods are Hough Transform and PCA (Principal Component Analysis), both of which are very suitable for oblong or rectangular type packages such as BGA's. Comparing the two approaches through a CPI with enough experimental results leads to the conclusion that the PCA is much better than the Hough Transform in not only reliability, but also processing speed.

• Laser Solutions
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• v.14 no.4
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• pp.14-20
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• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.2
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• pp.123-129
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• 2022

Quartz (SiO2) has high abrasion and heat resistances and excellent chemical and mechanical properties; therefore, it is used in various industries, such as machinery, chemistry, optics, and medicine. Quartz is a high-hardness and brittle material and is classified as the topmost difficult-to-cut material, which is because of the cracking or chipping at the edge during processing. Corner wear, such as cracks and chippings that occur during cutting, is a major cause for the deterioration in the machining quality. Therefore, many researchers are investigating various techniques to process quartz effectively. However, owing to the mechanical properties of quartz, most studies have been conducted on grinding, micromachining, and microdrilling. Few studies have been conducted on quartz processing. The purpose of this study was to analyze the machining characteristics according to the machining factors during the slot machining of quartz using a cubic boron nitride (CBN) tool and to select the optimal machining conditions using the Taguchi method. The machining experiment was performed considering three process variables: the spindle speed, feed rate, and depth of cut. The cutting force and surface roughness were analyzed according to the processing conditions.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.10a
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• pp.574-575
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• 2021

Re-manufacturing is the process of recovering the function and performance of the original product through a re-assembly process such as a new product assembly process after reprocessing by recovering used products or parts that are in the disposal stage at the end of their lifespan. One of the manufacturing methods. The remanufacturing industry is important not only in terms of environmental protection, but also in terms of economics. The success or failure of the industry as a whole depends on trust in products and price competitiveness. Image processing systems are used to reduce labor costs and improve product reliability in the product manufacturing process. In this study, foreign substances and defects that are difficult to identify with the human eye are detected by using the pre-processing step of determining whether to recycle the drum and image processing immediately before shipment after regenerating the drum to regenerate the waste drum.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.5
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• pp.672-677
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• 2010

The goal of this study is to simplify the measurement process of the flat zone length produced by a flexible disk grinding system for the process automation. The image of workpiece in the grinding process is obtained, and the cutting speed and the feeding speed are controlled carefully to maximize the flat zone length. The gradient, the inflection point and the length of the line in the image are calculated, and the length is also measured by using a projector. Processing conditions and inversely proportional to flat zone length was changing. The flat zone length is estimated by Neural network algorithm considering the process conditions with the estimated error range as 0.06~3.61%, the Neural network algorithm for the grinding process estimation is found to be useful for building the process automation database.