• Title/Summary/Keyword: Processing Equipment

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Developing an On-line Scheduling System for Increasing Effectiveness of Public Research Facility (공공기관 연구시설장비 효율성 향상을 위한 온라인 일정계획 시스템 개발)

  • Lee, Chae-Yun;Kim, Ki-Hong;Shin, Seung-Jun
    • Journal of the Korea Safety Management & Science
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    • v.19 no.1
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    • pp.181-189
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    • 2017
  • The systematic management of technology infrastructure increasingly becomes critical as it represents the driving power for creating competitive advantage of nations and enterprises. In this sense, public facility and equipment, which is one major asset of technology infrastructure, should be managed effectively, systematically and efficiently to increase its overall equipment effectiveness. However, the manual and off-line communication was the unique way to communicate between the suppliers who provide facilities in the public sector and the customers who utilize the facilities in the industrial sector. This communication way caused invisibility of available usage time and increase of idle time, thereby decreasing the equipment effectiveness. This paper presents an web-based scheduling system that enables real-time collaboration and information sharing for increasing the equipment effectiveness. The designed system performs scheduling, facility management, order management and customer relationship management in an on-line platform, and carries out the processing and storing of relevant information in an integrated database. The paper includes a development approach to identify business process models and standardized system models by using object-modeling technique. The deliverable of the present work will contribute to increasing the equipment effectiveness by enhancing visibility, transparency and predictability by means of the integration with a legacy Enterprise Resource Planning.

Signal Processing Algorithm of FMCW RADAR using DSP (DSP를 이용한 FMCW 레이다 신호처리 알고리즘)

  • 한성칠;박상진;강성민;구경헌
    • Proceedings of the IEEK Conference
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    • 2001.06a
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    • pp.425-428
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    • 2001
  • In this paper, FMCW radar signal processing technique for the vehicle detection system are studied. And FMCW radar sensor is used as a equipment for vehicle detection. To test the performance of developed algorithm, the evaluation of the algorithm is done by simulation for signal processing technique of vehicle detection system. RADAR signal of a driving vehicle is generated by using the Matlab. Distance and velocity of vehicles are calculated with developed a1gorithm. Also the signal processing procedure is done for the virtual data with FM-AM converted noise.

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Material Processing by Laser (레이저를 이용한 재료가공)

  • 황경현;이성국
    • Korean Journal of Optics and Photonics
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    • v.1 no.1
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    • pp.98-106
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    • 1990
  • Lasers are used increasingly for specialized engineering applications such as drilling, profile cutting, welding and surface heat-treatment(hardening, alloying, annealing0 of metals and non-metals. The most important characteristics of lasers used for these materials-processing applications are reviewed, with special emphasis on the importance of the controlled heating process. In addition to these processes, some optical devices and supplementary equipment used in laser processing are introduced. Finally, some examples shows the wide variety of laser capability for substitution of traditional materials processing.

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Trends and Constraints of Grain Slurry Food Processing in Kaduna State, Nigeria

  • Dolapo, Oloyede O.;Shittu, Sarafadeen K.;Kayode, Fadele O.
    • Journal of Biosystems Engineering
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    • v.41 no.2
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    • pp.93-97
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    • 2016
  • Purpose: Grain slurry diet are described as food obtained from ground grain paste. They serve as highly nutritious food for both adults and infants in Nigeria because of their immense nutritive and economical value. However, the production of these grain slurry diets is confronted with challenges that have hampered their commercialization. This study examines the trends and constraints of grain slurry food processing in Kaduna State. Methods: A survey was conducted using a structured questionnaire to elicit information from 192 selected processors, including both men and women. The survey was structured in line with the study objectives. The information was collated and synopsized into frequency distribution. Results: These findings revealed that 80% of the respondents processed between 1.0 tons and 13.0 tons of grain slurry per month. More than 90% of the processors processed grain slurry into koko, kunu, agidi, and pito. Accordingly, 80% of the interviewed processors indicated that sieving is one of the major constraints. Furthermore, inadequate modern machinery required to perform this operation makes it highly discouraging. One of the major challenges faced by the grain slurry producers in Nigeria is the lack of processing machinery for most operations (39.1%), followed by the tedious processing nature (27.1%), high labor cost (18.1%), and lack of market (9.4%). The traditional method of grain slurry processing was more popular than using modern equipment, except milling (96.5%), which is the only mechanized unit operation in grain slurry processing. Conclusion: Grain slurry processing and marketing were found to be profitable. However, these limitations could extremely reduce the level of grain slurry production, processing, and economic returns, thereby affecting the general wellbeing of the processors. The study also raised concerns about the safety and hygiene associated with traditionally processed grain slurry diets in the investigated areas.

A study on wafer processing using backgrinding system

  • Seung-Yub Baek
    • Design & Manufacturing
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    • v.18 no.2
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    • pp.9-16
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    • 2024
  • Recently, there has been extensive research conducted on the miniaturization of semiconductors and the improvement of their integration to achieve high-quality and high-performance electronic devices. To integrate and miniaturize multiple semiconductors, thin and precise wafers are essential. The backgrinding process, which involves high-precision processing, is necessary to achieve this. The backgrinding system is used to grind and polish the back side of the wafer to reduce its thickness to ㎛ units. This enables the high integration and miniaturization of semiconductors and a flattening process to allow for detailed circuit design, ultimately leading to the production of IC chips. As the backgrinding system performs precision processing at the ㎛ unit, it is crucial to determine the stability of the equipment's rigidity. Additionally, the flatness and surface roughness of the processed wafer must be checked to confirm the processability of the backgrinding system. IIn this paper, the goal is to verify the processability of the back grinding system by analyzing the natural frequency and resonance frequency of the equipment through computer simulation and measuring and analyzing the flatness and surface roughness of wafers processed with backgrinding system. It was confirmed whether processing damage occurred due to vibration during the backgrinding process.

Comparison of PCB Surface Treatment Effect Using UV Equipment and Atmospheric Pressure Plasma Equipment (UV 장비 및 대기압 플라즈마 장비를 이용한 PCB 표면 처리 효과 비교)

  • Ryu, Sun-Joong
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.3
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    • pp.53-59
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    • 2009
  • Low pressure mercury lamp type UV equipments have been widely used for cleaning and modification of PCB surfaces. To enhance the productivity of the process, we newly developed remote DBD type atmospheric pressure plasma equipment. The productivity of both equipments could be compared by measuring surface contact angle for various transferring speed. By the result of the measurement, we could verify that the productivity of the atmospheric pressure plasma be superior to the productivity of the UV equipment. XPS experiments confirmed that the surface effect of the UV and atmospheric pressure plasma processing are similar for each other. Organic contamination level was reduced after the processing and some surface elements were oxidized for both cases. Finally, the atmospheric pressure plasma equipment was adapted to flip chip BGA's flux printing process and it was concluded that the printing uniformity be enhanced by the atmospheric pressure plasma surface treatment.

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Measurement of Nonlinear Dielectric Constant (비선형 유전율의 측정)

  • Roh, I.S.;Kang, D.H.;Lee, S.U.;Heo, J.S.
    • Proceedings of the KIEE Conference
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    • 2001.07c
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    • pp.1331-1333
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    • 2001
  • In this study a measurement equipment was designed and made for the nonlinear dielectric constants in dielectrics. The determining method of the nonlinear dielectric constants also was proposed. The measurement equipment was consisted of the wave generation part, the high voltage amplifier part, the measurement part and the data acquisition part. In this equipment the measurement control and the data processing could be conducted by computer. In order to determine the nonlinear dielectric constants alternating sign-wave electric fields are applied to dielectrics with different magnitude and the waves of the electric fields and the response from dielectrics are stored in computer memories. The harmonics of dielectric displacement are obtained by the Fourier transformation of these waves. The nonlinear dielectric constants are determined at the relatively low-field region. The experiment for PZT ceramic samples was done by the equipment and the determining method and as the result meaningful data were obtained.

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