• Title/Summary/Keyword: Process technology

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Interconnection Technology Based on InSn Solder for Flexible Display Applications

  • Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Eom, Yong-Sung;Lee, Jin Ho
    • ETRI Journal
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    • v.37 no.2
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    • pp.387-394
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    • 2015
  • A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

Graphic Simulator for Analyzing the Remote Operation of the Advanced Spent Fuel Conditioning Process

  • Song, Tai-Gil;Kim, Sung-Hyun;Lee, Jong-Ryul;Yoon, Ji-Sup
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.1319-1322
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    • 2003
  • KAERI is developing the Advanced Spent Fuel Conditioning Process (ACP) as a pre-disposal treatment process for spent fuel. Equipment used for such a spent fuel recycling and management process must operate in intense radiation fields as well as in a high temperature. Therefore, remote maintenance has a played a significant role in this process because of combined chemical and radiological contamination. Hence suitable remote handling and maintenance technology needs to be developed along with the design of the process concepts. To do this, we developed the graphic simulator for the ACP. The graphic simulator provides the capability of verifying the remote operability of the process without fabrication of the process equipment. In other words, by applying virtual reality to the remote maintenance operation, a remote operation task can be simulated in the graphic simulator, not in a real environment. The graphic simulator will substantially reduce the cost of the development of the remote handling and maintenance procedure as well as the process equipment, while at the same time producing a process and a remote maintenance concept that is more reliable, easier to implement, and easier to understand.

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Device Design Considerations and Uniformity Improvement for Low-Temperature Poly-Si TFTs Fabricated by Sequential Lateral Solidification Technology

  • Chu, Fang-Tsun;Shih, Ding-Kang;Chen, Hung-Tse;Yeh, Yung-Hui
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.509-512
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    • 2006
  • In this paper, we proposed the novel device and process design to enhance the uniformity of low-temperature poly-Si TFTs fabricated by sequential lateral solidification (SLS). The proposed design schemes can avert the conventional two-shot SLS process-induced issues. Moreover, different design considerations between conventional excimer laser crystallization and the SLS process were also proposed and discussed.

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Process Life Cycle Assessment with Modified Allocating Method in PCB Producing Factory

  • Haepyo Chun;Kim, Young-Suk;Han, Sung-Ho;Han, Myung-Keun;Lee, Hong-Kee
    • Proceedings of the IEEK Conference
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    • 2001.10a
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    • pp.301-306
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    • 2001
  • Applying life cycle assessment in PCB (printed circuit board) production, most of environmental impacts come from outside-factory-process due to power generation, especially, and other raw material productions. Relatively, small environmental impacts of inside-factory-process make it difficult to compare them. To overcome this problem allocating environmental impacts of outside-factory-process on inside-factory-process. It helps to identify the environmental impacts of each process and find sources of environmental impacts. Also, life cycle assessment shows reduction of environmental impacts after copper recycling process.

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The Effect of Information Technology Application on Knowledge Management Process in Clinical Nurses (간호사의 정보기술(IT)활용이 지식관리활동에 미치는 영향)

  • Jeong, Seok-Hee
    • Journal of Korean Academy of Nursing Administration
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    • v.10 no.1
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    • pp.141-159
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    • 2004
  • Purpose: The purpose of this study was to investigate the degree of information technology application, and to identify the effect of information technology application en knowledge management process in clinical nurses. Method: Participants were 629 regular clinical nurses who had worked for over 1 year in general units of 9 tertiary medical hospitals including 2 national university hospitals, 5 university hospitals, and 2 hospitals founded by business enterprises. Data were collected from March to May 2003 through questionnaires. Thee structured instruments were used to collect the data: Information Technology Application scale, Knowledge Management Process Scale(Jeong, Lee, Lee, & Kim, 2003), and one for general characteristics. The data were analyzed using reliability analysis, descriptive analysis, one-way ANOVA, $Scheff{\acute{e}$ test, correlation analysis, partial correlation analysis, and multiple regression analysis with the SPSS for Windows 10,0 program. Result: 1) The HIS application degree, IT application ability, and IT application frequency were significantly correlated with the degree of knowledge management process activation and 4 elements of knowledge management process, Knowledge Creation, Knowledge Storage, Knowledge Sharing, and Knowledge Utilization(p=.000). 2) The 3 variables, HIS application degree, IT application ability, and IT application frequency explained 47.2% of the total variance of the degree of knowledge management process activation, and 352% of me total variance of Knowledge Storage. And 2 variables, HIS application degree and IT application frequency explained 17.6% of the total variance of Knowledge Creation, 39.9% of the total variance of Knowledge sharing, and 33.8% of the total variance of Knowledge utilization(p=.000). 3) As a result of multiple regression analysis, the key determinant of the degree of knowledge management process activation for nurses was HIS application degree The HIS application degree, IT application frequency, position, IT application ability, and continuous total numbers of years working at the present hospital explained 51.1% of the total variance of the degree of knowledge management process activation(p=.000). Conclusions: These results suggest that the information technology application positively affects the nurses' knowledge management process. From the above findings, information technology application is empirically verified as a useful and effective method to activate knowledge management process, and knowledge management.

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Green Photoresist Stripping Process with the Influence of Free Surface from Dip Withdrawal (Dip 추출에서 유체 표면의 영향을 고려한 친환경 포토레지스트 박리공정)

  • Kim, Joon Hyun;Kim, Seung Hyun;Jeong, Byung Hyun;Joo, Gi-Tae;Kim, Young Sung
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.25 no.1
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    • pp.14-20
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    • 2016
  • This paper describes a green stripping process to effectively strip the remaining DFR layer on a non-alkali-based ITO glass surface after an etching process. A stripper, water-soluble amine compound, is used to investigate the characteristics of stripping ability and to suggest a valid method for the green process. Increasing the composition (5-30% concentration) of the ethanol amine-based stripper was found to greatly reduce the stripping time applied in the dipping method. The composition (30%) achieved an excellent stripping effect and free-residue impurities. Additionally, it was possible to obtain the effect of stripping in a way to sustain the release before generating DFR sludge from the ITO glass surface by using dipping condition (stripping time) in the composition. An Additional stripping process (buffering) out of dipping can realize productivity improvement and cost reduction because of the higher proportion of re-use of the stripping solution used in the DFR removal step.

Hybrid Recommendation Algorithm for User Satisfaction-oriented Privacy Model

  • Sun, Yinggang;Zhang, Hongguo;Zhang, Luogang;Ma, Chao;Huang, Hai;Zhan, Dongyang;Qu, Jiaxing
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.16 no.10
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    • pp.3419-3437
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    • 2022
  • Anonymization technology is an important technology for privacy protection in the process of data release. Usually, before publishing data, the data publisher needs to use anonymization technology to anonymize the original data, and then publish the anonymized data. However, for data publishers who do not have or have less anonymized technical knowledge background, how to configure appropriate parameters for data with different characteristics has become a more difficult problem. In response to this problem, this paper adds a historical configuration scheme resource pool on the basis of the traditional anonymization process, and configuration parameters can be automatically recommended through the historical configuration scheme resource pool. On this basis, a privacy model hybrid recommendation algorithm for user satisfaction is formed. The algorithm includes a forward recommendation process and a reverse recommendation process, which can respectively perform data anonymization processing for users with different anonymization technical knowledge backgrounds. The privacy model hybrid recommendation algorithm for user satisfaction described in this paper is suitable for a wider population, providing a simpler, more efficient and automated solution for data anonymization, reducing data processing time and improving the quality of anonymized data, which enhances data protection capabilities.

Effects of process variables on aqueous-based AlOx insulators for high-performance solution-processed oxide thin-film transistors

  • Huh, Jae-Eun;Park, Jintaek;Lee, Junhee;Lee, Sung-Eun;Lee, Jinwon;Lim, Keon-Hee;Kim, Youn Sang
    • Journal of Industrial and Engineering Chemistry
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    • v.68
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    • pp.117-123
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    • 2018
  • Recently, aqueous method has attracted lots of attention because it enables the solution-processed metal oxide thin film with high electrical properties in low temperature fabrication condition to various flexible devices. Focusing the development of aqueous route, many researchers are only focused on metal oxide materials. However, for expansive application of the aqueous-based metal oxide films, the systematic study of performance change with process variables for the development of aqueous-based metal oxide insulator film is urgently required. Here, we propose importance of process variables to achieve high electrical-performance metal oxide insulator based on the aqueous method. We found that the significant process variables including precursor solution temperature and humidity during the spincoating process strongly affect chemical, physical, and electrical properties of $AlO_x$ insulators. Through the optimization of significant variables in process, an $AlO_x$ insulator with a leakage current value approximately $10^5$ times smaller and a breakdown voltage value approximately 2-3 times greater than un-optimized $AlO_x$ was realized. Finally, by introducing the optimized $AlO_x$ insulators to solutionprocessed $InO_x$ TFTs, we successfully achieved $InO_x/AlO_x$ TFTs with remarkably high average field-effect mobility of ${\sim}52cm^2V^{-1}\;s^{-1}$ and on/off current ratio of 106 at fabrication temperature of $250^{\circ}C$.

Novel Processing Technology of Nanocomposites Using supercritical fluid

  • Hong, Young-Ki;Lee, Hyun-Jung;Lee, Sang-Soo;Park, Min;Kim, Jun-Kyung;Lim, Soon-Ho
    • Proceedings of the Polymer Society of Korea Conference
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    • 2006.10a
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    • pp.215-215
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    • 2006
  • The cyclic butylene terephthalte oligomer was synthesized and the composition of butylenes terephthalate cyclic oligomers was 51.2 % of dimer, 28.1 % of trimer, 7.9 % of tetramer, 8 % of pentamer and 4.8% of hexamer. Polybuthylene terephthalate was polymerized using this cyclic oligomer in the condition of melt process and supercritical process. And PBT/clay nanocomposite were manu- factured from melt process and supercritical process. Chlorodifluoro- methane(HCFC-22) was used as a solvent which has critical point ($Tc=96.2^{\circ}C$, Pc=49.7bar). Also polymer nanocomposite were manufactured using rapid expansion of supercritical solution process.

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