• Korean Journal of Materials Research
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• v.20 no.6
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Structural Engineering and Mechanics
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• v.32 no.1
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• pp.95-126
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• 2009

The present contribution addresses the parallelization of advanced simulation methods for structural reliability analysis, which have recently been developed for large-scale structures with a high number of uncertain parameters. In particular, the Line Sampling method and the Subset Simulation method are considered. The proposed parallel algorithms exploit the parallelism associated with the possibility to simultaneously perform independent FE analyses. For the Line Sampling method a parallelization scheme is proposed both for the actual sampling process, and for the statistical gradient estimation method used to identify the so-called important direction of the Line Sampling scheme. Two parallelization strategies are investigated for the Subset Simulation method: the first one consists in the embarrassingly parallel advancement of distinct Markov chains; in this case the speedup is bounded by the number of chains advanced simultaneously. The second parallel Subset Simulation algorithm utilizes the concept of speculative computing. Speedup measurements in context with the FE model of a multistory building (24,000 DOFs) show the reduction of the wall-clock time to a very viable amount (<10 minutes for Line Sampling and ${\approx}$ 1 hour for Subset Simulation). The measurements, conducted on clusters of multi-core nodes, also indicate a strong sensitivity of the parallel performance to the load level of the nodes, in terms of the number of simultaneously used cores. This performance degradation is related to memory bottlenecks during the modal analysis required during each FE analysis.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.102-103
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• 2007

In order to apply resistive superconducting fault current limiters into electric power systems, the urgent issues to be settled are as follows, such as initial installation price of SFCL, operation and maintenance cost due to ac loss of superconductor and the life of cryostat, and high voltage and high current problems. The ac loss and high cost of superconductor and cryostat system are main bottlenecks for real application. Furthermore in order to increase voltage and current ratings of SFCL, a lot of superconductor components should be connected in series and parallel which resulted in extreme high cost. Thus, in order to make practical SFCL, we designed novel hybrid SFCL which combines superconductor and conventional electric equipment including vacuum interrupter, power fuse and current limiting reactor. The main purpose of hybrid SFCL is to drastically reduce total usage of superconductor by adopting current commutation method by use of superconductor and high fast switch. Consequently, it was possible to get the satisfactory test results using this method, and further works for practical applications are in the process.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.12 no.5
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• pp.1973-1991
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• 2018

Multimedia applications over wireless networks have been evolving to augmented reality or virtual reality services. However, a rich data size compared to conventional multimedia services causes bandwidth bottlenecks over wireless networks, which is one of the main reasons why those applications are not used widely. To overcome this limitation, bandwidth aggregation techniques, which exploit a multi-path transmission, have been considered to maximize link utilization. Currently, most of the conventional researches have been focusing on the user end problems to improve the quality of service (QoS) through optimal load distribution. In this paper, we address the joint pricing and load distribution problem for multi-homing in heterogeneous wireless access networks (ANs), considering the interests of both the users and the service providers. Specifically, we consider profit from resource allocation and cost of power consumption expenditure for operation as an utility of each service provider. Here, users decide how much to request the resource and how to split the resource over heterogeneous wireless ANs to minimize their cost while supporting the required QoS. Then, service providers compete with each other by setting the price to maximize their utilities over user reactions. We study the behaviors of users and service providers by analyzing their hierarchical decision-making process as a multileader-, multifollower Stackelberg game. We show that both the user and service provider strategies are closed form solutions. Finally, we discuss how the proposed scheme is well converged to equilibrium points.

• Proceedings of the National Institute of Ecology of the Republic of Korea
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• v.2 no.2
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• pp.108-113
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• 2021

Detrimental effects of inbreeding have been studied by many researchers for a long time. However, only a few studies have shown the occurrence of inbreeding depression due to evolutionary changes as a purging process. In this study, two different populations (inbreeding and outbreeding) of Drosophila melanogaster were compared to assess inbreeding effects on artificial population bottlenecks. For inbreeding conditions, a couple of D. melanogaster (one virgin and one male) were selected from an inbred population and cultured in a vial. For outbreeding conditions, a couple of D. melanogaster were selected from different populations and cultured in a vial. There were significant differences in body lengths of adults, but not in other parameters such as the total number of adults, the rate of survival, and the rate of wing mutants. The mean body length of adults of outbreeding populations was longer than that of inbreeding populations in the first generation (G1; P = 0.004), but not in the second generation (G2; P = 0.066). Although the other three parameters (total number of adults, rate of survival, and rate of wing mutants) showed differences in their mean values between inbreeding and outbreeding populations, these differences were not statistically significant. This might be due to genetic purging. This study demonstrated one additional experimental case related to inbreeding depression in artificial bottlenecked populations. Further studies are necessary to confirm the clear interaction between inbreeding depression and genetic purging using more generations and replicates (or samples) of D. melanogaster.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.11-19
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• 2023

Recently with the rapid advancement of artificial intelligence (AI) technologies such as Chat GPT, AI semiconductors have become important. AI technologies require the ability to process large volumes of data quickly, as they perform tasks such as big data processing, deep learning, and algorithms. However, AI semiconductors encounter challenges with excessive power consumption and data bottlenecks during the processing of large-scale data. Thus, the latest packaging technologies are required for AI semiconductor computations. In this study, the authors have described packaging technologies applicable to AI semiconductors, including interposers, Through-Silicon-Via (TSV), bumping, Chiplet, and hybrid bonding. These technologies are expected to contribute to enhance the power efficiency and processing speed of AI semiconductors.

• Journal of Ocean Engineering and Technology
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• v.37 no.5
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• pp.190-197
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• 2023

In the shipbuilding and marine industry, digital transformation activities are promoted primarily by large shipyards. However, bottlenecks are observed across value chains, and digital transformation effects are reducing because of the cost and technical challenges encountered by supplies. In this study, we proposed a win-win cooperation model for large, small, and medium-sized companies using digital transformation based on the characteristics of the shipbuilding and marine industry through case studies. We investigated the digital transformation progress in German and Korean small and medium-sized enterprises (SMEs). In addition, we identified information-sharing methods and management challenges encountered in enterprise resource planning and manufacturing execution systems in the collaboration process of pipes, panels, blocks, etc. of SMEs that are suppliers of a Korean shipyard, and clarified communication by building a platform based on a common format between shipyards and suppliers. Further, we proposed a standard model of a digital transformation system for enhancing the collaboration between large companies and suppliers and proposed a basic plan including strategies to efficiently and effectively build a digital transformation system based on the standard model.

• Journal of Convergence for Information Technology
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• v.11 no.8
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• pp.8-13
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• 2021

The purpose of this study is to propose a throughput costing as a performance measurement tool to measure cost indicators, which are one of the indicators for evaluating organizational performance in a smart factory manufacturing environment. An empirical study by questionnaire was conducted, and 60 experts were surveyed to verify the hypothesis. As a result of the study, it was concluded that the information provided based on throughput costing is helpful in cost measurement and in evaluating organizational performance efficiency and effectiveness, and it was confirmed that this method has usefulness to support the planning and control process. It is proposed that the use of throughput costing by constraint theory, which can maximize throughput and optimize inventory levels in the manufacturing process, can find solutions to bottlenecks affecting the efficiency and effectiveness of organizational performance.

• Journal of Computational Design and Engineering
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• v.3 no.4
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• pp.363-369
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• 2016

Cyber Physical System (CPS) and Internet of Things (IoT) are hot objects of interest as an extension of the embedded system. These interactive products and systems contain Mobile Devices which are most popular and used most frequently. Also these have been widely used from the control of the Nuclear Power Control System (NPCS) to IoT Home Service. Information & Communication Technology (ICT) topics of trend fused-complex current Information Technology (IT) and Communication Technology (CT) are closely linked to real space and virtual space. This immediately means the arrival of the ultra-connected society. It refers to a society in which various objects surrounding the human innovation and change in the social sector are expected through the connection between the data which are to be generated. In addition, studies of Tool-kit for the design of such systems are also actively pursued. However, only increased cooperation and information sharing between the physical object consists of a variety of machinery and equipment. We have taken into consideration a number of design variables of the high barriers to entry about the product. In this study, It has been developed a Web-based collaboration framework which can be a flexible connection between macroscopically virtual environment and the physical environment. This framework is able to verifiy and manage physical environments. Also it can resolve the bottlenecks encountered during the base expansion and development process of IoT (Internet of Things) environment.

• Journal of Korean Society of Transportation
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• v.22 no.6
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• pp.175-196
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• 2004

This study focuses on improving the performance of freeway incident detection by introducing some new measures to reduce false alarms in developing a new incident detection model. The model consists of the 5 major components through which a series of decision makings in determining the given traffic flow condition are made. The decision making process was designed such that the causes of traffic congestions can be accurately classified into several types including incidents and bottlenecks according to their unique characteristics. The model performance was tested and found to be compatible with that of the existing well-recognized models in terms of the detection rate and detection time. It should noted that the model produced much less false alarms than most of the existing models. The study results prove that the initial objective of the study was satisfied as it was an experimental trial to improve the false alarm rate for the incident detection model to be more pactically usable for traffic management purposes.