• Title/Summary/Keyword: Prismless type LGP mold

Search Result 2, Processing Time 0.016 seconds

Studies of Prismless Type Light Guide Panel Mold Machining using Diamond Tool (다이아몬드공구에 의한 프리즘형 도광판 금형 가공기술 연구)

  • Hong S.M.;Jae T.J.;Choi D.S.;Lee E.S.;Lee D.J.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2005.06a
    • /
    • pp.1597-1600
    • /
    • 2005
  • Recently, the trends of TFT-LCD are large scale and thin thickness, so, the demands of Light Guide Panel(LGP) which is able to substitute for prism sheets are appeared. Functions of LGP obtaining polarization of light of the prism sheet as well as the incidence and reflection of light are demanded. This prismless type LGP to complete functions of the existing LGP and polarization at once must be supported by micro machining technology of LGP surface. In this research, we have used the STAMPER method for the mass product and In-Line process, and the optimized conditions are established by analyzing the cutting force and conditions according to the material and processing properties when the prismless type LGP mold is fabricated. Parameters of the cutting condition were the workpiece and cutting depth.

  • PDF

Fabrication and transcription estimation of prismless LGP for cellular phone using E-Mold technology (전열가열방식을 이용한 휴대전화용 복합기능 도광판 제작 및 전사성 평가)

  • Kim, Young-Kyun;Chung, Jae-Youp;Kim, Dong-Hak
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.10 no.1
    • /
    • pp.186-193
    • /
    • 2009
  • In this paper, we adopted E-MOLD patent technology in order to fabricate Prismless LGP(Light Guide Panel) fur cellular phone and estimate the transcription of injection-molded parts. Then, we manufactured the Ni stamper fur Prismless LGP using MEMS process. And the stamper was installed in the movable heated core which is the key part of a patented mold. Using this mold, we manufactured injection-molded plastic LGP parts with different mold temperatures so that we investigate effect of the temperature on the transcription of the parts. The CAE analysis was also conducted in order to compare with the experimental results. The transcription of LGP parts with various mold temperature displayed $100^{\circ}C$(25.0nm), $140^{\circ}C$(48.4nm), $180^{\circ}C$(52.1nm) and when compared with stamper(521Inm), transcription was superior at $180^{\circ}C$. According to the CAE results, moldability was improved as mold temperature ($50^{\circ}C{\sim}180^{\circ}C$) increased, but when filling time($1{\sim}2sec$) increases, it decreased at $160^{\circ}C$. And transcription and moldability were improved markedly at glass transition temperature($140^{\circ}C$).