• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.182-182
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• 2009

일반적으로 스크린 프린팅 공정은 실비가 간단하고 공정이 쉬우며 가격이 저렴한 특성을 가지고 있다. 본 연구에서는 스크린 프린팅 방법들 이용하여 절연층을 코팅하고 도체 패턴을 형성하여 MCPCB(Metal-Core Printed Circuit Board) 기판을 제작하였다. 또한, 이 방법으로 제작된 MCPCB 기판의 방열 특성을 기존 상용 MCPCB와 비교 평가하였다.

• 대한의용생체공학회:의공학회지
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• 제43권4호
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• pp.219-229
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• 2022

In this study, we propose a miniaturized micro-ceramic heater device. After screen-printing a silver paste between pre-sintered two aluminum oxide plates to integrate a heating circuit, the device was fabricated through a low-temperature sintering process. In order to configure the optimal heating circuit integration condition, the output current evaluation and heating test were performed according to the number of screen prints of the silver paste at various voltages. A silver paste-based heating circuit printed with a line width of 200 ㎛ and a thickness of 60 ㎛ was successfully integrated on a pre-sintered alumina substrate through a low-temperature sintering process. In the case of the 5 times printed device, the thermal response showed a response rate of 18.19 ℃/sec. To demonstrate feasibility of the proposed device in the medical field, such as bio-tissue suturing and hemostasis, a voltage was applied to pig tissue in the device to test tissue change due to heat generated from the device. These results show the possibility that the proposed small ceramic heater could be used in the medical field based on its excellent temperature response.

• 한국전기전자재료학회논문지
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• 제26권3호
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• pp.246-251
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• 2013

Screen printing is commonly used to form the front/back electrodes in silicon solar cell. But it has caused high resistance and low aspect ratio, resulting in decreased conversion efficiency in solar cell. Recently the plating method has been combined with screen-printed c-Si solar cell to reduce the resistance and improve the aspect ratio. In this paper, we investigated the effect of light induced silver plating with screen-printed c-Si solar cells and compared their electrical properties. All wafers were textured, doped, and coated with anti-reflection layer. The metallization process was carried out with screen-printing, followed by co-fired. Then we performed light induced Ag plating by changing the plating time in the range of 20 sec~5min with/without external light. For comparison, we measured the light I-V characteristics and electrode width by optical microscope. During plating, silver ions fill the porous structure established in rapid silver particle sintering during co-firing step, which results in resistance decrease and efficiency improvement. The plating rate was increased in presence of light lamp, resulting in widening the electrode with and reducing the short-circuit current by shadowing loss. With the optimized plating condition, the conversion efficiency of solar cells was increased by 0.4% due to decreased series resistance. Finally we obtained the short-circuit current of 8.66 A, open-circuit voltage of 0.632 V, fill factor of 78.2%, and efficiency of 17.8% on a silicon solar cell.

• 한국기계가공학회지
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• 제17권6호
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• pp.53-60
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• 2018

In this paper, the effect of different 3D printing parameters including laminated angle and annealing temperature is observed their effect on FDM conductive 3D printing. In FDM 3D printing, a conductive filament is heated quickly, extruded, and then cooled rapidly. FDM 3D Print conductive filament is a poor heat conductor, it heats and cools unevenly causing the rapid heating and cooling to create internal stress. when the printed conductive specimens this internal stress can be increase electrical resistance and decrease electrical conductivity. Therefore, This experiment would like to use annealing to remove internal stress and increase electrical conductivity. The result of experiment when 3D printing conductive specimen be oven cooling of annealing temperature $120^{\circ}C$ electrical resistance appeared decrease than before annealing. So We have found that 3D printing annealing removes internal stresses and increases the electrical conductivity of printed specimens. These results are very useful for making conductive 3D printing electronic circuit, sensor ect...with electrical conductance suitable for the application.

• 한국기계가공학회지
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• 제20권2호
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• pp.38-44
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• 2021

To cater to the transition from single-color to multicolor/multi-material printing, this paper proposes a cartridge-replacing type multi-nozzle Fused Depositon Modeling(FDM) three-dimensional (3D) printer. In the test printing run, tool change failure/wobble/layer shift occurred. It was confirmed that improper support was the cause of this tool change failure. As a solution, spline and electromagnetic cartridges were designed. Wobble was caused by machine vibration and the motor stepping out. To minimize wobble, an additional Z-axis was installed, and the four-point bed leveling method was used instead of the three-point bed leveling method. The occurrence of layer shift was ascribed to the eccentricity of the Z-axis lead screw. Therefore, slit coupler was replaced with an Oldham type. In addition to the mechanical supplementation, the control environment was integrated to prevent accidents and signal errors due to wire connections. Before the final test printing run, a rectifier circuit was added to the motor to secure precise control stability. The final test printing run confirmed that the wobble/layer shift phenomenon was minimized, and the maximum error between layers was reduced to 0.05.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2279-2284
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• 2007

This study is intended to analyze the effect of thin ink-film thickness around rotating printing roll on the printing quality in the gravure printing process which is used for making electronics circuit like a RFID tag with a conductive ink. The present work numerically estimates the film thickness around rotating roller partially immersed in ink, for which the volume of fluid (VOF) method was adopted to figure out the film formation process around rotating roller. Parameter studies were performed to compare the effect of ink viscosity, surface tension, roller rotating speed, immersed angle on the film thickness. The result indicates that the film thickness has a strong dependency on the fluid viscosity, while the surface tension has negligible effect.

• 한국정밀공학회지
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• 제29권4호
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• pp.449-454
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• 2012

The method for spraying of liquid through an electrical filed has become a printing method since it can make very small droplet. To increase the reliability using the electro-hydrodynamic (EHD) jet printing, the jetting status needs to be monitored. Vision measurement techniques using high speed camera has been used to visualize the jet images. However, it requires image processing of a lot of images after image acquisitions. So, it is difficult to understand jet behavior such as jetting frequency, jet repeatability etc. In this work, a low cost electrical current measurement method was developed to measure electrical current from EHD jet printing. To verify the jetting monitoring capability of developed circuit, images from high speed camera were processed for comparison purpose.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1450-1451
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• 2008

To investigate the reliability of the conductive lines patterned by ink-jet printing, we evaluated the reliability of the ink-jet printed silver (Ag) patterns according to the guide lines built up as assessments methods in the production of conventional rigid printed circuit boards. The assessment methods include the uniformity of line width and space, adhesive strength, dielectric withstand, solder float, thermal shock test and pressure cooker test (PCT). To prepare assesment vehicles, different regular test patterns were created by Ag ink-jet printing on the same polyimide substrate for each of assessment methods.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2000년도 학술대회논문집
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• pp.60-63
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• 2000

In this paper, 7-segment was implemented using AC powder EL. ZnS:Cu and BaTiO3 was used as a phosphor and dielectric respectively. The preparation of phosphor and dielectric layer was performed with screen printing. The implemented system of 7-segment was divided as following; EL display, driving circuit, software for driving. The properties of fabricated devices was measured with EL spectrum and brightness.