• Journal of the Korean Society of Safety
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• v.37 no.4
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• pp.120-128
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• 2022

Printed circuit boards (PCBs) are a basic component in the electronics industry and are widely used in nearly all electronic products, such as mobile phones, tablet computers, and digital cameras, as well as in electric equipment. PCB manufacturing involves the use of many chemicals and chemical processes and therefore has more risks than other manufacturing sectors. This study aims to identify the causes of possible accidents during PCB manufacturing through risk assessment, develop and implement safety measures, and evaluate the effectiveness of these measures. Note that the safety measures developed to mitigate the risks of a certain process were also implemented for other similar processes. The risk assessments conducted over seven years, from 2015 to 2021, at a PCB manufacturing company identified 361 hazardous processes. Between 2016 and 2019, 41-56 hazardous processes were identified per year; such processes decreased to fewer than 20 per year after 2020. Application of the risk assessment results to the improvement of the hazardous processes with the similar characteristics seems to be effective in decreasing the risks. Equipment-related factors such as lack of appropriate maintenance, low work standards, and defective protection devices were responsible for 59.8% of all possible accidents. Because PCB manufacturing involves many chemicals, skin contact with hazardous substances, electric shock, fire, and explosion were the most common types of possible accidents (81.7%). In total, 505 safety measures were implemented, including 157 related to purchase and improvement of equipment and devices for safety (31.1%), 147 related to the installation/modification of fire prevention facilities (29.1%), and 69 related to the use of standard electrical appliances (13.7%). Risk assessment conducted after implementing the safety measures showed that these measures significantly decreased risk; 247 processes (68.4%) had a risk level of 3, corresponding to "very low," and 114 processes (31.6%) showed a risk level of 4, corresponding to "low." In particular, risk assessment of 104 processes with risk scores of 12 and 10 other processes with risk score of 16 showed that the risk decreased to 4 after implementing the safety measures. Thus, implementing these measures in similar manufacturing sectors that involve chemical processes can mitigate risk.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2009.10a
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.19 no.12
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• pp.1322-1328
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• 2009

This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Journal of Radiation Industry
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• v.9 no.3
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• pp.137-141
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• 2015

A single-shot dual-energy x-ray imaging technique has been developed using a sandwich detector by stacking two detectors, in which the front and rear detectors respectively produce relatively lower and higher x-ray energy images. Each detector layer is composed of a phosphor screen coupled with a photodiode array. The front detector layer employs a thinner phosphor screen, whereas the rear detector layer employs a thicker phosphor screen considering the quantum efficiency for x-ray photons with higher energies. We have applied the proposed method into the inspection of printed circuit boards, and obtained dual-energy images with background clutter suppressed. In addition, the single-shot dual-energy method provides sharper-edge images than the conventional radiography because of the unsharp masking effect resulting from the use of different thickness phosphors between the two detector layers. It is promising to use the single-shot dual-energy x-ray imaging for high-resolution nondestructive testing. For the reliable use of the developed method, however, more quantitative analysis is further required in comparisons with the conventional method for various types of printed circuit boards.

• Membrane Journal
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• v.13 no.1
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• pp.9-19
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• 2003

Membrane process was investigated to recover process water and valuable gold from washing water of electroless PCB plating processes. The filtration experiments were carried out using not only a RO membrane test cell to determine suitable membrane for washing water but also spiral wound membrane modules of nanofiltration and reverse osmosis for scale-up. At first, RO-TL(tap water, low pressure), RO-BL(brackish water, low pressure) and RO-normal(for water purifier) sheet membranes made by Saehan Co. were tested, and the performance of RO-TL membrane showed most suitable f3r recovery of soft etching, catalyst and Ni washing waters. As a result of RO test cell, the experiments for scale-up were carried out using RO-TL modules far water purifier at 7bar and $25^{\circ}C $The permeate flux fur Au washing water was about 30 LMH, but Au rejection was less than 80%. The permeate fluxes for Pd, Ni and soft etching washing water were about 22, 17 and 10 LMH, respectively. The Pd, Ni and Cu rejections showed more than 85, 97 and 98% respectively. The nanofiltration module for water purifier was introduced to recover Au selectively from Au, Ni and Cu ions in Au washing water. Most of Ni and Cu ions in the feed washing water were removed, and only Au ion was existed 81.9% in the permeate. Furthermore, Au ion in the permeate was concentrated and recovered by RO-TL membrane module. Finally, Au was also able to recover effectively by using 4 inch diameter spiral wound modules of NF and RO-TL membranes, in series.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.4
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• pp.1-10
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• 2015

The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

• Journal of electromagnetic engineering and science
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• v.15 no.3
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• pp.185-193
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• 2015

In this paper, a hybrid multiple input multiple output (MIMO) antenna for eight-band mobile handsets is designed and implemented. For the MIMO antenna, two hybrid antennas are laid symmetrically and connected by an interconnection tie, thereby enabling complementary operation. The tie affects both the impedance and radiation characteristics of each antenna. Further, printed circuit board (PCB) embedded type is applied to the antenna design. To verify the results of this study, we designed eight bands-LTE class 12, 13, and 14, CDMA, GSM900, DCS1800, PCS, and WCDMA-and implemented them on a bare board the same size as the real board of a handset. The voltage standing wave ratio (VSWR) is within 3:1 over the entire design band. Antenna isolation is less than -15 dB at the lower band, and -12 dB at the WCDMA band. Envelope correlation coefficient (ECC) of 0.0002-0.05 is obtained for all bands. The average gain and efficiency are measured to range from -4.69 dBi to -2.88 dBi and 33.99% to 51.5% for antenna 1, and -4.74 dBi to -2.97 dBi and 33.45% to 50.49% for antenna 2, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.70-78
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• 2009

This paper addresses the analysis and the design optimization of differential interconnects for high-speed Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, and time-domain transient simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.761-764
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• 2007

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and πace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects.

• The Transactions of the Korea Information Processing Society
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• v.7 no.1
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• pp.135-145
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• 2000

Manufacturing Message Specification (MMS) is designed as a communication standard protocol, ISO/IEC 9506, on factory automation for messaging between heterogeneous programmable unit controller, PLC, NC, Robot, of different vendors on the networks. MMS is also a standard protocol of OSI reference model application layer, In this paper, we show an implementation of MMS over TCP/IP using ANSI-C programming language on the unix environment, and make java classification using java native interface (NJI) with MMS library. The use of java classification provides a basic environment ot overcome a difficult programming with different MMS application programming interface (MMS-I) which requires a siklled programming technique of graphic user interface (GUI). In this paper, we implement a MMS application program of the automated assembly model for printed circuit board based on WWW which shows the operation, control and monitoring of real manufacturing device (RMD) with web browser providing users for consistent user interface.