• Membrane Journal
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• v.23 no.1
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• pp.92-99
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• 2013

In this study the nanofiltration (NF) membrane treatment of a sulfuric acid waste solutions containing copper ion ($Cu^{+2}$) discharging from the etching processes of the printed circuit board (PCB) manufacturing industry has been studied for the recycling of acid etching solution. SelRO MPS-34 4040 NF membrane from Koch company was tested to obtain the basic NF data for recycling of etching solution and separation efficiency (total rejection) of copper ion. NF experiments were carried out with a dead-end membrane filtration laboratory system. The pure water flux was increased with the increasing storage time in sulfuric acid solution and lowering pH of acid solution because of the enhancement of NF membrane damage by sulfuric acid. The permeate flux of acid solution was decreased with the increasing copper ion concentration. Total rejection of copper ion was decreased with the increasing storage time in sulfuric acid solution and copper ion concentration, and lowering the pH of acid solution. The total rejection of copper ion was decreased from initial 37% to 15% minimum value.

• Applied Chemistry for Engineering
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• v.24 no.6
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• pp.593-598
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• 2013

In this study, we have evaluated the water absorption phenomenon of photoresist dry film, which is commonly used to build circuits on PCB (Printed Circuit Board) by photolithography, by using ATR-FTIR (Attenuated Total Reflectance-Fourier Transform Infrared). We have firstly observed significant change in fracture mode of dry film with respect to temperature and humidity, which we assumed the material transition from ductile to brittle. Secondly, we have established the process of absorption test for determining the diffusion coefficients of water into the dry film both with gravimeter and ATR-FTIR. We have successfully calculated the diffusion coefficients for each environmental conditions from the results which we achieved by gravimeter and ATR-FTIR. Compared to the gravimeter which is a conventional method for absorption test, the ATR-FTIR method in this study has been found to be very easy to use and have the same accuracy as gravimeter. Moreover, we are expecting to use the ATR-FTIR as an appropriate method to study the absorption phenomena related to any kinds of solvent and polymer system.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.167-174
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• 2005

Smaller size and higher integration of electronic components make smaller gap between metal conducting layers in electronic package. Under harsh environmental conditions (high temperature/humidity), electronic component respond to applied voltages by electrochemically ionization of metal and metal filament formation, which lead to short failure and this phenomenon is termed electrochemical migration(ECM). In this work, printed circuit board(PCB) is used for determination of ECM characteristics. Copper leads of PCB are soldered by eutectic solder alloys. Insulation breakdown time is measured at $85^{\circ}C,\;85{\%}RH$. CAF is the main mechanism of ECM at PCB. Pb is more susceptible to CAF rather than Sn, which corresponds well to the corrosion resistance of solder materials in aqueous environment. Polarization tests in chloride or chloride-free solutions fur pure metal and eutectic solder alloys are performed to understand ECM characteristics. Lifetime results show well defined log-normal distribution which resulted in biased voltage factor(n=2) by voltage scaling. Details on migration mechanism and lifetime statistics will be presented and discussed.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.19-23
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• 2002

This paper presents a micro fluxgate magnetic sensor in printed circuit board (PCB). In order to observe the effect of the closed magnetic path, the magnetic cores of rectangular-ring and two bars were each fabricated. Each fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a Co-based amorphous magnetic ribbon with extremely high DC permeability of ~100,000. Four outer layers as an excitation and pick-up coils have a planar solenoid and are made of copper foil. In case of the fluxgate sensor having the rectangular-ring shaped core, excellent linear response over the range of -100 $\mu$T to ＋ 100 $\mu$T is obtained with 540 V/Tsensitivity at excitation square wave of 3 $V_{p-p}$ and 360 KHz. The chip size of the fabricated sensing element is $7.3 \times 5.7\textrm{mm}^2$. The very low power consumption of ~8 mW was measured. This magnetic sensor is very useful for various applications such as: portable navigation systems, telematics, VR game and so on.n.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Resources Recycling
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• v.11 no.6
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• pp.3-11
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• 2002

Recently, waste printed circuit board (PCB) has significantly increased in its amount due to the rapid development of electronic industries. Since several kinds of noxious materials and also valuable metals are contained in it, the waste PCB is in an urgent need of recycling for the dual purposes for the prevention of environmental pollution and recovery of valuable resources. Also, the catalyst which equipped in the exhaust pipes of automobiles to reduce emission of air pollutants contains precious met-als so that their recovery from the waste auto-catalysts is required. In this study, the recovery of valuable metals from waste PCB and auto-catalyst by arc furnace melting process has been investigated, which is known to be very stable and suitable f3r less production of pollutants due to its high operating temperature. The effect of the kind of flux on the recovery of precious metals was examined by using quicklime, converter slag, and copper slag as the flux. In addition, the influence of direct and alternating current and the applying direction of direct current has been investigated. It was observed that using converter or copper slag as a flux was more desirable for a higher efficiency in the precious metal recovery compared with quicklime. For the effect of current, application of direct current taking the bottom as a negative pole generally showed a better efficiency for the extraction of valuable metals from waste PCB, which was also observed for the case of waste auto-catalyst. The average recovery of precious metals from both wastes by arc furnace melting process was very high, which was up to in the range of 95～97%.

• Korean Journal of Optics and Photonics
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• v.20 no.5
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• pp.272-275
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• 2009

In order to enhance the background noise filtering performance of the white light interferometry(WLI), we demonstrate the noise filtering performance of preprocessing of the measured fringe signals. The WLI was realized through a mirau interferometer which was equipped with a green LED. When measuring large-height and rough surface objects, the illumination optics are considered the numerical aperture(NA) and the depth of focus(DOF). In this case, the limited NA of the illumination optics has a considerable impact on the interference fringe. Therefore, we propose a preprocessing method that uses the intensity difference between the measured intensity and the moving average intensity. The performance is demonstrated by measuring an array of metal solder balls fabricated on printed circuit board(PCB). The proposed method reduces the noise pixels by 15 percent.

• Clean Technology
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• v.19 no.3
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• pp.219-225
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• 2013

Environment-friendly and surfactant-free aqueous cleaning agents have been developed in order to solve various problems generated by surfactants in the aqueous cleaning agents. Aqueous surfactant-free cleaning agents, S-1 and S-2 have been formulated with water-soluble solvents such as propylene glycol and propylene glycol ether on their main components and with some additives. These solvents were chosen because of their good solubility in water and excellent solubility of fluxes which are major contaminants of printed circuit board in the electronic industry. Physical properties of the formulated and the imported cleaning agents were measured to predict their cleaning performance, and their cleaning abilities of flux and solder contaminants were evaluated under the various ultrasonic frequencies by a gravimetric method. The measurement results show that the physical properties of cleaning agent V are generally similar with those of formulated cleaning agents S-1 and S-2. Both the cleaning agent V and the formulated cleaning agents S-1 and S-2 showed similar trends that their pH decrease in the beginning and then increases later on with the increase of their dilution in water. It is considered that the wetting indices of the cleaning agents calculated with experimental values do not not have any influence on their cleaning ability. In ultrasonic cleaning tests under three ultrasonic frequencies of 28, 45, and 100 kHz, their best performances of cleaning solder and flux were obtained at 45 kHz and 28 kHz, respectively, and the cleaning performance of the formulated cleaning agents S-1 and S-2 was better than that of the cleaning agent V. However, in the case of the recommended diluted concentration of 25 wt% cleaning solution, the cleaning performance of the cleaner V for solder and flux was better in the initial stage of cleaning compared to the formulated cleaners. And it may be concluded that the formulated cleaning agents S-1 and S-2 can be applied to cleaning of solder and flux in the industry, based on the experimental results in this study.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.9
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• pp.14-23
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• 2010

This paper reports the fabrication of a DVB-T/H System in Package (SiP) that is able to receive and process the DVB-T/H signal. The DVB-T/H is the European telecommunication standard for Digital Video Broadcasting (DVB). An IC-embedded Printed Circuit Board (PCB) process, interpose a chip between PCB layers, has applied to the DVB-T/H SiP. The chip inserted in DVB-T/H SiP is the System on Chip (SoC) for mobile TV. It is comprised of a RF block for DVB-T/H RF signal and a digital block to convert received signal to digital signal for an application processor. To operate the DVB-T/H IC, a 3MHz DC-DC converter and LDO are on the DVB-T/H SiP. And a 38.4MHz crystal is used as a clock source. The fabricated DVB-T/H SiP form 4 layers which size is $8mm{\times}8mm$. The DVB-T/H IC is located between 2nd and 3rd layer. According to the result of simulation, the RF signal sensitivity is improved since the layout modification of the ground plane and via. And we confirmed the adjustment of LC value on power transmission is necessary to turn down the noise level in a SiP. Although the size of a DVB-T/H SiP is decreased over 70% than reference module, the power consumption and efficiency is on a par with reference module. The average power consumption is 297mW and the efficiency is 87%. But, the RF signal sensitivity is declined by average 3.8dB. This is caused by the decrease of the RF signal sensitivity which is 2.8dB, because of the noise from the DC-DC converter.

• Journal of Korean Ophthalmic Optics Society
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• v.18 no.3
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• pp.231-239
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• 2013

Purpose: To design and fabricate the auto pattern maker for the development. Methods: we got the necessary data, needed in design, by using CAD. Based on the these data, we fabricated the trial product for the development of the auto pattern maker. Results: The auto pattern maker were composed with combinations of many elements; pattern making assembly, control panel, frame attachment and prober unit. The pattern making assembly was comprised of the cutter, the pattern holder, pattern remover and silence cover which could minimize the sound during the cutting process. The control panel was designed to be connected and operated with the main printed circuit board. The prober could get the eye shape data by scanning of 1.8 degrees around the groove of the frame through the encoding data according to the address. After starting, scanning was carried out in two passes, i.e. one right-handed and one left-handed. Communication connector could send the eye shape data from auto pattern maker to outer system with the RS232C transmission system. By using the one-way analysis of variance, we got the error rate of cut pattern size for ${\Phi}22mm$, ${\Phi}55mm$ and ${\Phi}62mm$. Because F-value was 0.510 and p-value was 0.601, no statistically significant differences were found. Also, the mean cutting error of the auto pattern maker was 0.0274 mm. Conclusions: we could succeed in making the trial product by applying it to the development of the auto pattern maker. The role of this auto pattern maker is to find a exact required size of lens to fit the frame by measuring the frame. The acquired data are transferred to outer system for grinding and finishing with patternless process. Also, the trial product can produce pattern to fit the frame. Therefore, it was confidently expected that the optometrists could handily produce pattern to fit the frame with this trial product and dispense the ophthalmic lens because of its efficiency and convenience compared to the past.