• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.9
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• pp.700-707
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• 1991

Transmission line crosstalk of a printed circuit baord terminated with the linear resistive and nonlinear terminal network is analyzed. Based on a quasi-static approximation, crosstalk voltage is computed in frequency domain by applying the modal analysis. A scheme to calculate the maximum crosstalk voltage for a line terminated with the nonlinear digital gate is proposed. And also, crosstalk quantities are numerically obtained for the microstrip and strip line, and compared with the experimental data to validate relevance of this method.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.73-77
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• 1999

Revolutionary changes on multimedia, network and PDA(Personal digital assistants) causes PCB(Printed circuit beard) manufacturers to change their attitudes to product. Traditional idea for current market such as price, market, and service has collapsed down and new digitalization urges PCB manufacturers to deal with new technologies, shorter lead time with reasonable price, high qualities. Therefore PCB manufacturers have an effort to develop new marketing, products, processes for low cost to keep up pace with assembly makers.

• Resources Recycling
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• v.23 no.6
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• pp.30-39
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• 2014

The trajectories of PCB(Printed Circuit Board) particles in the corona discharge electrostatic separation was simulated. The PCB particles are prepared by crushing bare board, which disassembled from electronic components, consist mostly of copper and FR-4(Flame Retardant Level-4) Firstly, a model was established for calculating of detachment points of PCB particles from the rotating electrode in separator. The model of detachment points was derived from equilibrium of force such as gravity force, centrifugal force, electrostatic force. The trajectories of particles after detachment was calculated by acceleration derived from time-integrating method of motion equation. In this simulation, particle size, supplied voltage, rotation speed of rotating roll electrode and angle of induction electrode were adopted as variables. While the trajectories of FR-4 particles were affected by all variables, rotation speed of rotating roll electrode was dominant variables affecting trajectories of copper particles.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1806-1809
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• 2008

Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

• Journal of Satellite, Information and Communications
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• v.9 no.4
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• pp.42-46
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• 2014

In this paper, a coil typed electromagnetic band gap (EBG) structure to be inserted in the printed circuit board (PCB) inner layer in order to stabilize the PCB power line is proposed and implemented for global-navigation satellite service (GNSS) with the bandwidth from 1.55GHz to 1.81GHz. From the measurement result of the PCB board including EBG structure, the insertion loss(S21) was measured below about -50dB. From these results, it is expected that the stabilization of power delivery network (PDN) structure in the PCB circuit design should be improved and the preparation to EMI will be effective.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.136-138
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• 2006

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. Ion migration phenomena has been observed in the field of exposing the specific environment and using for a long time. Also as the RoHS restriction was started in July 1st, 2006, Pb-free solder was utilized in electronics assemblies. In this case, it is very important to compatible between components and printed circuit board(PCB), thus surface treatment materials of PCB was changed to Sn, Sn-3.0Ag-0.5Cu, Cu. Therefore these new application become to need to reevaluate the sensitivity about electrochemical ion migration. This study was evaluated the occurrence time of electrochemical ion migration using by water drop test. We utilized PCB(printed circuit board) having a comb pattern as follows 0.1, 0.318, 0.5, 1.0 mm pattern distance. Sn-3.0Ag-0.5Cu and Sn-37Pb were electroplated on the comb pattern. 6.5V and 15.0V were applied in the comb pattern and then we measured the electrical short time causing by occurring the ion migration. In these results, we evaluate the sensitivity and derived the prediction models of ion migration occurrence time depending on the pattern materials, applied voltage and pattern spacing of PCB conductor.

• Journal of the Korean Society of Safety
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• v.13 no.2
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• pp.22-29
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• 1998

The natural convection cooling of simulated electronic chips located on a printed circuit board(PCB) has been studied by Computer Aided Engineering(CAE). In CAE, 3-dimensional finite element model of simulated electronic chip was made to accomplish heat transfer analysis at each design stage of a printed circuit boards for thermal optimization. The simulated electronic chips are installed protrudent from the plate about 3mm. The materials the plates are epoxy and aluminum. The results show that the chip with relatively high heat generation rates should not be close to each other. It is found, as well that cooling effect for the aluminum plate is superior to the epoxy plate and location of maximum temperature is significantly influenced by the structure variation of PCB. In developing PCB and electronic chips, it's recommended that CAE is very useful to estimate to the distribution of temperature.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.7
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• pp.601-606
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• 2016

In this paper, an energy harvester is developed that has advantages regarding piezoelectric noise minimization, mass production, and an easily available environmental energy source, electromagnetic induction, as well as low-frequency bandwidth and high amplitude. A process for fabricating a three-dimensional multilayered planar coil using micro-electro-mechanical systems (MEMS) on a flexible printed circuit board FPCB is introduced. Optimal shape and size were calculated via internal resistance and inductance, and a prototype was fabricated through the MEMS procedure while considering the possibility of mass production. Although the internal resistance matched the designed value, the electromotive force generated did not reach the intended amount. The main reason for the decrease in efficiency was the low area of coil outskirt exposed to the magnetic field while there was relative motion between the magnet and the coil.

• Journal of Welding and Joining
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• v.13 no.2
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.