• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.1770-1773
• /
• 2005

The performance evaluation of AOV(air-operated valve) requires the processes to confirm the actuator system capability. It is necessary to evaluate the thrust of the air actuator for the margin evaluation. In this paper, to evaluate and analysis the air actuator, the performance test system and operating program are developed. This system is composed of several sensors such as pressure sensor, LVDT, and LoadCell which are used to get the data for evaluation. The LabVIEW was used for developing the operating program. The test system and operating program are proved through the actual test of the diaphragm actuator.

• 한국공작기계학회논문집
• /
• 제17권2호
• /
• pp.1-6
• /
• 2008

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio, the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.

• Applied Biological Chemistry
• /
• 제30권1호
• /
• pp.65-70
• /
• 1987

Strain gauge로 식품(食品)의 감압건조과정중(減壓乾燥過程中) 압력(壓力)과 수분감소량(水分減少量)을 계측(計測)할 수 있는 감응소자를 제작(製作)하고 이를 Apple II마이크로 컴퓨터에 접속(接續)하여 마이크로컴퓨터 감압건조(減壓乾燥)시스템을 제작(製作)하였다. 부르돈관 표면에 strain gauge를 접착하여 제작한 감압계측(減壓計測)단자의 출력(出力)값은 디지탈화시킨 후 MC 6821 접속 I.C. chip을 통하여 마이크로컴퓨터에 입력(入力)시켰다. 컴퓨터 입력값(D)과 감압실(減壓室)의 압력(壓力)(P,mmHg)과의 관계는 P=-146.136+3.620D(r=0.994)이었다. 감압건조실(減壓乾燥室)의 압력은 컴퓨터 프로그램에 의하여 $400{\sim}600mmHg$의 범위에서 30mmHg의 오차(誤差)로 제어(制御)할 수 있었다. 건조시료(乾燥試料)의 무게(W, g)와 load cell을 통한 컴퓨터 디지 털출력값(D)과의 관계는 W=-14.000十0.585D (r=0.9998)이었다. $64^{\circ}C,\;400{\sim}600mmHg$하에서 풋고추의 건조곡선(乾燥曲線)은 완숙고추의 상압건조곡선(常壓乾燥曲線)과 비슷하였으며 형태(形態)에 따른 건조속도(乾燥速度)의 변화(變化)는 상이하였고 진공도(眞空度)에도 영향을 받았다. 풋고추의 감압건조중(減壓乾燥中) 수분이동(水分移動)은 Page model을 따랐으며 그 관계식(關係式)은 원형(原型) 풋고추의 경우 $M-M_e/M_o-M_e={\exp}(-0.0673{\theta}^{1.177})$이었고 반절(半切)풋고추의 경우 $M-M_e/M_o-M_e={\exp}(-0.0655{\theta}^{1.477})$이었다.